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Specifications
Frequency Stability:
±50ppm
Voltage - Supply:
3V~3.6V
Operating Temperature:
-40℃~+85℃
Frequency:
33.333MHz
Mfr. Part #:
SSW033333I3CHE-T
Package:
SMD3225-4P
Key Attributes
Model Number:
SSW033333I3CHE-T
Product Description
Harmony Electronics HSO321S Oscillator
The Harmony Electronics HSO321S is a high-quality oscillator designed for various electronic applications. It offers precise frequency output and reliable performance, making it suitable for integration into a wide range of products. This specification document outlines the key electrical, mechanical, and environmental characteristics of the HSO321S, ensuring its compatibility and optimal use in demanding environments.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSO321S
- Type: Oscillator
- Country of Origin: TAIWAN
- Manufacturing Date: 2016/01/05
- Specification Number: SSW033333I3CHE-T
- Revision: 0
Technical Specifications
| Item | Symbol | Value | Unit | Condition | Min | Typ | Max | Notes |
|---|---|---|---|---|---|---|---|---|
| 1. Type | ||||||||
| Type Name | HSO321S | |||||||
| 2. Output Frequency | ||||||||
| Output Frequency | 33.333000 | MHz | ||||||
| 3. Absolute Maximum Ratings | ||||||||
| Vdd terminal voltage | Vdd | -0.5 to 4.0 | V | |||||
| Input terminal voltage | Vcont | -0.5 to Vdd+0.5 | V | |||||
| Output terminal voltage | Vout | -0.5 to Vdd+0.5 | V | |||||
| Output terminal current | Iout | mA | 15 | |||||
| Storage temp. range | Tstr | -55 to 125 | deg.C | |||||
| 4. Electric Specifications | ||||||||
| Frequency Stability | f/F | -50 to +50 | ppm | 3.3+/- 0.3V, -40~85 | Inclusive of 25 Tolerance, operating temperature range, input voltage change, Load change, first of aging, shock and vibration. | |||
| Operating temp. range | Topr | -40 to +85 | 25 | |||||
| Supply voltage | Vdd | 3.0 to 3.6 | V | 3.3 | ||||
| Current consumption 1 | Idd1 | mA | Pin #1: open or "H", 3.3V 25+/-3 | 10 | Fig1,2 | |||
| Current consumption 2 | Idd2 | mA | Pin #1: "L" level, 3.3V 25+/-3 | 0.01 | Fig1,2 | |||
| Symmetry Duty | 40 to 60 | % | CL =15pF | 50 | ||||
| Low level output voltage | Vol | V | CL =15pF | 0.1xVdd | ||||
| High level output voltage | Voh | V | CL =15pF | 0.9xVdd | ||||
| Rise & Fall time | Tr & Tf | ns | CL =15pF | 7 | ||||
| Low level input current | Iil | uA | 3.3V 25+/-3 | 10 | Fig3 | |||
| High Level input current | Iih | uA | 3.3V 25+/-3 | 10 | Fig3 | |||
| Low level input voltage | Vil | V | Vddx0.3 | |||||
| High level input voltage | Vih | V | Vddx0.7 | |||||
| Output disable time | Tplz | nsec | 150 | |||||
| Output enable time | Tpzl | msec | 10 | |||||
| Aging | -3 to +3 | ppm/year | ||||||
| Start-up time | ms | 10 | ||||||
| 5. Dimensions | ||||||||
| Length | 24.0 | mm | Max. | |||||
| Width | 3.2 +/- 0.2 | mm | ||||||
| Height | 2.5 +/- 0.2 | mm | ||||||
| Pin Connections | 1: Output, 2: GND, 3: OE (Output Enable), 4: Vdd | TOP VIEW | ||||||
| 6. Inside Structure | ||||||||
| Base Material | Alumina Ceramic (Al2O3) | |||||||
| Metalized Pad | W Ni Plating, Au Plating | |||||||
| IC | IC (Si. Al.) | |||||||
| Bonding Wire | Au | |||||||
| Crystal Blank | Rectangular At-Cut Quartz Crystal Blank | |||||||
| LID | Fe+Ni+Co | |||||||
| Adhesive | Silver Conductive Silicon Resin | |||||||
| Electrode | The use prohibition chemistry substance of Table 1 of DHE-0204-1 (HE-QA-24) is not included. | |||||||
| 7. Mechanical Performance | ||||||||
| Natural Drop | Drop 3 times from 50cm onto min. 30mm thickness hard wooden board. | JIS C 60068-2-6 A | ||||||
| Vibration | 10-55Hz, Sine Wave, 0.8mm amplitude to X, Y, Z axes, 2 hours per axis. | MIL-HDBK-781A 6.5.2/ JIS C 60068-2-6 A | ||||||
| Sealing Tightness (Fine Leakage) | Leak Rate 1.0x10-8 Pa-m3/sec. Max. (Helium leak detector) | |||||||
| Sealing Tightness (Coarse Leakage) | No gas bubble observed after dipping in FC-40 at +125 +/-5deg.C for 5 minutes. | |||||||
| Solder ability | Dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec after applying ROSIN Flux. | JIS C 60068-2-20 B | ||||||
| 8. Environment Performance | ||||||||
| Humidity | 60+/-2, RH 90~95%, 240 hours. | JIS C 60068-2-3 A | Component checked after returning to room temperature. | |||||
| Storage in Low Temperature | -40deg.C +/-2deg.C, 240 hours. | JIS C 60068-2-1 A | Component checked after returning to room temperature. | |||||
| Storage in High Temperature | +85deg.C +/-2deg.C, 240 hours. | JIS C 60068-2-2 A | Component checked after returning to room temperature. | |||||
| Temperature cycles | -30deg.C +/-2deg.C (30min) +80deg.C +/-2deg.C (30min), 25 cycles. Temp. increasing/reducing time within 3 minutes. | JIS C 0025 A | Component checked after returning to room temperature. | |||||
| High Temperature Operation | +85deg.C +/-2deg.C, +3.3V Vdd, 240 hours. | JIS C 60068-2-2 A | Component checked after returning to room temperature. Specifications A: Frequency variation within +/-5ppm, equivalent resistance within spec. B: More than 90% of lead covered by new solder. | |||||
| 9. Supplement | ||||||||
| Reflow Condition | Proposed reflow condition, max 2 soldering times. | |||||||
| Solder Iron | Bit temp.: 350deg.C Max., Time: 3sec Max., Each terminal solder 1 time Max. | |||||||
| Mounting | Designed for automatic insertion. Trial with insertion machine recommended. Avoid mounting by Ultrasonic welding. | |||||||
| Cleaning | Do not use cleaning liquid that corrodes Nickel. Ultrasonic cleaning possible, check on your board. | |||||||
| Handling | Pay attention to static-electricity. Crystal blank may break if excess force is applied. | |||||||
| By-pass Capacitor | No integrated by-pass capacitor. Recommend using 0.01F ceramic chip capacitor between Vdd and GND. | |||||||
| Storage | Keep away from high temperature, high humidity, direct sunlight, and dew. | |||||||
| 10. Taping and Packing | ||||||||
| Emboss Tape Specifications | Refer to detailed drawings. | |||||||
| Reel Specifications | Flange Diameter: 180+/-3mm, Inner Width: 9.3+/-0.3mm, Outer Width: 11.3+/-1.0mm, Hub Out Line diameter: 60.5+/-0.5mm. | Table-2 (UNIT: mm) | ||||||
| Storage (Taping) | Temperature +40deg.C Max., Humidity 80% Max. | |||||||
| Quantity on Reel | 3,000 PCS/REEL | |||||||
| 11. Flow Chart | ||||||||
| Manufacturing Process | Incoming Inspection, Etching, Freq. Sorting, Washing, Plating, Assembly, Curing, Adjustment, Annealing, Sealing, Aging, Marking, Packing, Inspection. | Includes various checks like Middle Check, Final Check, DLD Check, Temp. Characteristics Check, Leak Checks. | ||||||
| 12. Environmental Workload Chemical Substance Components List | ||||||||
| Chemical Substance | Percentage | mg | ppm | For D(H)SO321S | ||||
| WOLFRAM AND ITS COMPOUND(W) | 0.21168 | 25.2 | 53.3434 | |||||
| COBALT AND ITS COMPOUND(Co) | 0.96900 | 244.1880 | ||||||
| CHROMIUM AND ITS COMPOUND(Cr) | 0.07308 | 18.4162 | ||||||
| SILVER(Ag) | 0.15876 | 40.0075 | ||||||
| COPPER(Cu) | 0.07812 | 19.6862 | ||||||
| NICKEL AND ITS COMPOUND(Ni) | 2.26044 | 569.6309 | ||||||
| MANGANESE AND ITS COMPOUND(Mn) | 0.02016 | 5.0803 | ||||||
| MOLYBDENUM AND ITS COMPOUND(Mo) | 0.12348 | 31.1170 | ||||||
| SILICON AND ITS COMPOUND(Si) | 0.28476 | 71.7595 | ||||||
| ALUMINIUM AND ITS COMPOUND(Al) | 7.96320 | 2006.7264 | ||||||
| GOLD(Au) | 0.15372 | 38.7374 | ||||||
| IRON(Fe) | 3.37176 | 849.6835 | ||||||
2410121327_HELE-SSW033333I3CHE-T_C253916.pdf
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