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Specifications
Load Capacitance:
-
Operating Temperature:
-
Frequency:
-
Mfr. Part #:
X1H025000FK1H
Package:
SMD5032-4P
Key Attributes
Model Number:
X1H025000FK1H
Product Description
Product Overview
The Harmony Electronics HSX531S Quartz Crystal is a high-performance frequency control component designed for various electronic applications. It offers a nominal frequency of 25.000000MHz and is manufactured with a focus on reliability and compliance with environmental standards. This crystal is Pb-free, RoHS compliant, HF-Halogen free, and REACH Compliant, making it suitable for modern electronic manufacturing processes.
Product Attributes
- Brand: Harmony Electronics Corporation
- Model: HSX531S
- Country of Origin: Taiwan
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- MSL Level: 1
Technical Specifications
| Item | Electrical Spec. | Unit | Notes | Min | Type | Max |
|---|---|---|---|---|---|---|
| Frequency (FL) | MHz | 25.000000 | ||||
| Mode of oscillation | Fundamental | |||||
| Frequency tolerance | ppm | at 253 | -30 | +30 | ||
| Equivalent resistance (RR) | SERIES | 50 | ||||
| Storage temperature range | -40 | +85 | ||||
| Operable temperature range | -10 | +60 | ||||
| Temperature stability | ppm | -10 ~ +60 | -30 | +30 | ||
| Loading capacitance (CL) | pF | 20.0 | ||||
| Drive level (DL) | W | 10 | 300 | |||
| Shunt Capacitance (C0) | pF | 7.0 | ||||
| Insulation resistance | M | at DC 100V | 500 | |||
| Aging | ppm/Year | -5 | +5 | |||
| Circuit | Measured in HP/E5100A,S&A 250B | |||||
| Dimensions (L x W) | mm | 3.6 x 1.3 | ||||
| Dimensions (Height) | mm | 1.3 | ||||
| Dimensions (Lead Pitch) | mm | 1.2 | ||||
| Inside Structure - Base Material | Ceramic Al2O3 | |||||
| Inside Structure - Lid Material | Metal Fe- Ni Co Ni Plating | |||||
| Inside Structure - Kovar Material | Metal Fe- Ni -Co | |||||
| Inside Structure - Crystal Blank Material | Quartz SiO2 Rectangular At-Cut | |||||
| Carrier Tape Width | mm | 8.0 | ||||
| Carrier Tape Pitch | mm | 4.0 | ||||
| Reel Quantity | pcs | 1000 / 3000 | ||||
| Mechanical Performance - Shock | Dropping from 100 cm height 3 times on 30 mm Concrete floor. | Refer to: JIS C 60068-2-32 | A | |||
| Mechanical Performance - Vibration | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. | Refer to: JIS C 60068-2-6/ MIL-HDBK-781A 6.5.2 | A | |||
| Mechanical Performance - Leakage Test | Leak Rate 1.0x10-9 Pa-m3/sec. Max. Measured by Helium leak detector. | Refer to: JIS C 60068-2-17 | --- | |||
| Mechanical Performance - Solder ability | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | Refer to: JIS C 60068-2-20/ JIS C 60068-2-58 | B | |||
| Mechanical Performance - Bending Strength | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. | Refer to: EIAJ ET-7403/ JIS C 60068-2-21 | A | |||
| Mechanical Performance - Adhesion | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | Refer to: EIAJ ET-7403 JIS C 60068-2-21 | C | |||
| Mechanical Performance - Body strength | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec | Refer to: EIAJ ET-7403 JIS C 60068-2-21 | C | |||
| Environmental Performance - Resistance of Soldering Heat | Performing as the following reflow: | Refer to: JIS C 60068-2-58 | A | |||
| Environmental Performance - Humidity | Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 60068-2-3 | A | |||
| Environmental Performance - Storage in Low Temperature | -40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 60068-2-1 | A | |||
| Environmental Performance - Storage in High Temperature | +85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 60068-2-2 | A | |||
| Environmental Performance - Thermal shock | -55deg.C 2deg.C (30min) +125deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 0025 | A |
2410121447_HELE-X1H025000FK1H_C254361.pdf
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