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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±11ppm
Load Capacitance:
8pF
Operating Temperature:
-30℃~+85℃
Frequency:
26MHz
Mfr. Part #:
X2B026000B81H-CHZ
Package:
SMD2520-4P
Key Attributes
Model Number:
X2B026000B81H-CHZ
Product Description
Product Overview
The HSX221SA is a quartz crystal unit designed for various electronic applications. It offers a stable frequency of 26.000MHz with a tight frequency tolerance of +/-10 ppm at 25C. This crystal unit features a holder type of HSX221SA and is manufactured by Harmony Electronics Corp. It is suitable for applications requiring reliable oscillation and is built to withstand mechanical and environmental stresses.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX221SA
- Type: Quartz Crystal Unit
- Country of Origin: TAIWAN
- Manufacturing Facilities: TAIWAN, THAILAND, CHINA
- Moisture Sensitivity Level: Level 1
- Environmental Compliance: ROHS Compliant, Green Product
Technical Specifications
| Specification | Value | Notes |
|---|---|---|
| Frequency | 26.000000MHz | Nominal Frequency |
| Holder Type | HSX221SA | Seam type |
| Frequency Tolerance | +/-10 ppm | at 25C +/-3C |
| Equivalent Resistance | 40 Ohms Max. | SERIES |
| Storage Temperature Range | -40C to +85C | |
| Operable Temperature Range | -30C to +85C | |
| Temperature Drift | +/-11ppm | -30C to +85C |
| Loading Capacitance (CL) | 8.0 pF | |
| Drive Level | 10 W | 100 W Max. |
| Shunt Capacitance | 0.8~1.2 pF | |
| Insulation Resistance | > 500 M Ohms | at DC 100V |
| Mode of Oscillation | Fundamental | |
| Shock Test (Drop) | Frequency variation < +/-5 ppm; Resistance variation < +/-15% or 2 Ohms max. | Dropping from 120 cm height 3 times on Concrete floor |
| Aging | < +/- 3 ppm/Year | |
| Dimensions | Refer to Page 4 | |
| Carrier Tape & Reel | Refer to Page 6 & 7 | |
| Packing Quantity | 3,000 PCS / REEL | |
| Carrier Tape Material | PS Conductive | |
| Top Tape Material | Polyester | |
| Cover Tape Release Strength | 0.1N to 0.7N | Pulling direction 165 to 180, Speed 300mm/min |
| Mechanical Drop Test | Frequency variation < +/-5ppm, Equivalent resistance < +/-15% or 2 | 120 cm height, 3 times on Concrete floor |
| Vibration Test | Frequency 10-55Hz, Sine Wave, full amplitude 0.8mm to X, Y and Z 3 axes, 2 hours each axis. | |
| Sealing Tightness | Leak Rate 1.0x10-8 Pa-m/sec. Max. | Measured by Helium leak detector. |
| Solderability | More than 90% of lead covered by new solder. | Dipped in solder bath at 245C+/-5C for 3+/-0.5 sec. |
| Humidity Test | Frequency variation within +/-5ppm, Equivalent resistance within +/-15% or 2 | 60C +/-2C, RH 90~95%, Duration of 240 hours. |
| Low Temperature Storage | Component checked after returning to room temp. | -40C +/-2C, Duration of 240 hours. |
| High Temperature Storage | Component checked after returning to room temp. | +85C +/-2C, Duration of 240 hours. |
| Temperature Cycles | Component checked after returning to room temp. | -40C (30min) +85C (30min), 25 cycles. |
| Soldering (Reflow) | Max. 2 times soldering. | Proposed reflow condition: Preheat 160~180C (120sec), Primary heat 220C (60sec), Peak 260C (10sec Max.). |
| Soldering (Iron) | Bit temp.: 350max., Time: 3sec max. | Each terminal solder 1 time max. |
| Mounting | Designed for automatic insertion. Avoid Ultrasonic welding. | |
| Cleaning | Avoid cleaning liquids that corrode Nickel. Ultrasonic cleaning possible, check on your board. | |
| Storage Conditions | Keep away from high temperature and high humidity, direct sunlight, and dew. |
2410121327_HELE-X2B026000B81H-CHZ_C254238.pdf
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