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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Operating Temperature:
-20℃~+70℃
Load Capacitance:
8pF
Frequency:
32MHz
Mfr. Part #:
X1C032000B81H-HU
Package:
SMD1612-4P
Key Attributes
Model Number:
X1C032000B81H-HU
Product Description
Product Overview
The HSX111SA Quartz Crystal from HARMONY ELECTRONICS CORP. is a high-quality electronic component designed for various product applications. Manufactured in Taiwan, this crystal unit operates at a nominal frequency of 32.000MHz and offers precise frequency tolerance. It is suitable for use in electronic devices requiring stable oscillation, with specified operating temperature ranges and environmental performance characteristics.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX111SA
- Country of Origin: TAIWAN
- Application: Products (CRYSTAL)
- Holder Type: HSX111SA
- Mode of Oscillation: Fundamental
- Base Material: Alumina Ceramic (Al2O3)
- Lid Material: Fe-Ni-Co
- Cover Ring Material: Fe-Ni-Co Alloy
- Tape Material (Carrier): PS Conductive
- Tape Material (Top): Polyester
Technical Specifications
| Specification | Value | Notes |
|---|---|---|
| Nominal Frequency | 32.000000MHz | |
| Frequency Tolerance | +/-10ppm | at 25deg.C +/-3deg.C |
| Equivalent Resistance | 100 Ohms Max. | /SERIES |
| Storage Temperature Range | -40 deg.C To +85 deg.C | |
| Operable Temperature Range | -20 deg.C To +70 deg.C | |
| Temperature Drift | +/-10 ppm | -20 deg.C To +70deg.C |
| Loading Capacitance (CL) | 8.0 pF | |
| Drive Level | 10 uW | (100uW Max) |
| Shunt Capacitance | 2.0pF Max | |
| Insulation Resistance | More than 500M ohms | at DC 100V |
| Shock Test (Dropping) | Frequency variation < +/-5 ppm, Resistance variation < +/-15% or 2ohms max. | Dropping from 50 cm height 3 times on firm wood |
| Aging | Less than +/- 1 ppm/Year | |
| Standard Packing Quantity | 3,000 PCS / REEL | |
| Reel Diameter | 180+0/-3 mm | |
| Carrier Tape Inner Width | 9.3+/-0.3 mm | |
| Carrier Tape Outer Width | 11.3+/-1.0 mm | |
| Cover Tape Release Strength | 0.1N to 0.7N | Pulling direction 165 to 180, Speed 300mm/min |
| Mechanical Performance (Drop) | Pass | Drop the component 3 times from 50cm on hard ground (Code A) |
| Mechanical Performance (Vibration) | Pass | 10-55Hz, Sine Wave full amplitude of 0.8mm to X,Y and Z 3 axes, Duration of 2 hours to each axis (Code A) |
| Mechanical Performance (Sealing Tightness) | Leak Rate 1.0x10-8 Pa-m3/sec. Max. | Also, no serial bubble is observed by Fluor inert tests. |
| Mechanical Performance (Solderability) | Pass | More than 90% of lead shall be covered by new solder (Code B) |
| Environmental Performance (Humidity) | Pass | 60+/-2 deg.C, RH 90~95%, Duration of 240 hours (Code A) |
| Environmental Performance (Storage Low Temp) | Pass | -40+/-2 deg.C, Duration of 240 hours (Code A) |
| Environmental Performance (Storage High Temp) | Pass | +85+/-2 deg.C, Duration of 240 hours (Code A) |
| Environmental Performance (Temperature Cycles) | Pass | -40+/-2 deg.C (30min)+85+/-2 deg.C (30min), 5 cycles (Code A) |
| Soldering (Reflow Condition) | Preheat: 160~180 deg.C (120sec), Primary heat: 220 deg.C (60sec), Peak: 260 deg.C (10sec Max.) | Available for Lead Free Soldering |
| Soldering (Solder Iron) | Bit temp.:350max., Time:3sec max. | Each terminal solder a 1 time max. |
2410121342_HELE-X1C032000B81H-HU_C254218.pdf
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