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Specifications
Normal temperature Frequency Tolerance:
±30ppm
Frequency Stability:
±50ppm
Load Capacitance:
20pF
Operating Temperature:
-10℃~+85℃
Frequency:
16MHz
Mfr. Part #:
X1H016000FK1H-X
Package:
SMD5032-4P
Key Attributes
Model Number:
X1H016000FK1H-X
Product Description
Product Overview
The HSX531S is a quartz crystal unit manufactured by Harmony Electronics Corp., designed for various product applications. It offers a stable oscillation frequency of 16.000MHz with a tight frequency tolerance and a specified operating temperature range. The unit is housed in a seam-type holder and is suitable for automated insertion processes. It is also compliant with RoHS standards.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX531S
- Type: Quartz Crystal Unit
- Country of Origin: TAIWAN
- Manufacturing Locations: TAIWAN, THAILAND, CHINA
- Moisture Sensitivity Level: Level 1
- Environmental Compliance: ROHS Compliant, Green Product
Technical Specifications
| Specification | Details |
|---|---|
| Nominal Frequency | 16.000000MHz |
| Holder Type | HSX531S (Seam type) |
| Frequency Tolerance | +/-30ppm at 25deg.C +/-3deg.C |
| Equivalent Resistance | 50 ohms Max. / SERIES |
| Storage Temperature Range | -40deg.C To +85deg.C |
| Operable Temperature Range | -10deg.C To +85deg.C |
| Temperature Drift | +/-50 ppm (-10deg.C To +85deg.C) |
| Loading Capacitance (CL) | 20.0 pF |
| Drive Level | 10uW (300uW Max.) |
| Shunt Capacitance | 7.0 pF Max. |
| Insulation Resistance | More than 500M ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Shock Test | Frequency variation less than +/-5 ppm; Resistance less than +/- 15 % or 2ohms max. (Dropping from 75 cm height 3 times on firm wood) |
| Aging | Less than +/- 5 ppm/Year |
| Marking | Laser marking (Nominal Frequency, Logo, Manufactured year & month) |
| Carrier Tape Width | 12.8+/-0.3 mm |
| Reel Diameter | 180+0/-3 mm |
| Standard Packing Quantity | 1,000PCS / REEL |
| Cover Tape Release Strength | 0.1N to 0.7N |
| Mechanical Drop Test | Frequency variation shall be within +/-5ppm and equivalent resistance shall be within the specification after test. |
| Vibration Test | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X,Y and Z 3 axes, Duration of 2 hours to each axis. |
| Sealing Tightness (Leak Rate) | 1.0x10-8 Pa-m3/sec. Max. (Helium leak detector) |
| Solder Ability | More than 90% of lead shall be covered by new solder. (Dipping in solder bath at 245+/-5 for 3+/-0.5 sec.) |
| Humidity Test | 60+/-2, RH 90~95%, Duration of 240 hours. |
| Low Temperature Storage | -40+/-2, Duration of 240 hours. |
| High Temperature Storage | +85+/-2, Duration of 240 hours. |
| Temperature Cycles | -40+/-2(30min)+85+/-2(30min), 25 cycles. |
| Reflow Soldering Condition | Preheat: 160~180 deg.C (120sec); Primary heat: 220 deg.C (60sec); Peak: 260 deg.C (10sec. Max.) |
| Solder Iron Condition | Bit temp.:350 max., Time: 3sec max. |
| Inside Structure Materials | Base: Alumina Ceramic (Al2O3), Cap: Fe-Ni, Crystal Blank: Rectangular At-Cut Quartz Crystal Blank, Adhesive: Silver Conductive Silicon Resin, Metallized Pad: W Ni Plating Au Plating |
| Environmental Workload Chemical Substance Components | SILICON(Si), GOLD(Au), COBALT AND ITS COMPOUND(Co), MOLYBDENUM AND ITS COMPOUND(Mo), SILVER(Ag), COPPER(Cu), CHROMIUM AND ITS COMPOUND(Cr), ALUMINIUM(Al), MANGANESE AND ITS COMPOUND(Mn), WOLFRAM AND ITS COMPOUND(W), NICKEL AND ITS COMPOUND(Ni), IRON(Fe) |
2410121435_HELE-X1H016000FK1H-X_C254379.pdf
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