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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-10℃~+60℃
Frequency:
30MHz
Mfr. Part #:
X3S030000BK1H
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S030000BK1H
Product Description
Product Overview
The HSX321S is a quartz crystal unit manufactured by HARMONY ELECTRONICS CORP. Designed for various product applications, this crystal unit operates at a nominal frequency of 30.000MHz. It features a holder type of HSX321S and is built with a rectangular At-cut quartz crystal blank enclosed in an alumina ceramic base and a Fe-Ni-Co lid. The crystal unit is suitable for applications requiring stable frequency and reliable performance within specified environmental and mechanical conditions.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX321S
- Country of Origin: TAIWAN
- Manufacturing Locations: Taiwan Factory, Thailand Factory, Shenzhen Factory
- Holder Type: HSX321S
- Crystal Blank Type: Rectangular At-Cut Quartz Crystal Blank
- Base Material: Alumina Ceramic (Al2O3)
- Lid Material: Fe-Ni-Co
- Marking Method: Laser Marking
Technical Specifications
| Specification | Details |
|---|---|
| Nominal Frequency | 30.000000MHz |
| Frequency Tolerance | +/-10 ppm at 25C +/-3C |
| Equivalent Resistance | 50 ohms Max. / SERIES |
| Storage Temperature Range | -40C To +85C |
| Operable Temperature Range | -10C To +60C |
| Temperature Drift | +/-30 ppm (-10C To +60C) |
| Loading Capacitance (CL) | 20.0 pF +/- 0.2 pF |
| Drive Level | 10 uW +/- 2 uW (100uW Max) |
| Shunt Capacitance | 2.0 pF Max |
| Insulation Resistance | More than 500M ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Shocking (Frequency/Resistance Variation) | Frequency: Less than +/-5 ppm; Resistance: Less than +/- 15 % or 2ohms max. (Dropping from 50 cm height 3 times on firm wood) |
| Aging | Less than +/- 5 ppm/Year |
| Sealing Tightness (Leak Rate) | 1.0x10 Pam/sec. Max. (Fine Leakage) |
| Solderability | More than 90% of lead shall be covered by new solder. (Dipped in solder bath at 245C+/-5C for 3+/-0.5 sec. after applying ROSIN Flux) |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Carrier Tape Material | PS Conductive |
| Top Tape Material | Polyester |
| Cover Tape Release Strength | 0.1N to 0.7N (Pulling direction 165 to 180, Speed 300mm/min) |
| Reflow Condition (Max Soldering Times) | 2 times max. (Preheat 160~180C 120sec; Primary heat 220C 60sec; Peak 260C 10sec Max.) |
| Solder Iron Condition | Bit temp.: 350C max., Time: 3sec max., Each terminal solder 1 time max. |
2410121314_HELE-X3S030000BK1H_C254323.pdf
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