Product Overview
The Harmony Electronics Corporation HSX321S is a high-quality Quartz Crystal designed for reliable electronic applications. This product is Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant, ensuring adherence to environmental and safety standards. It is manufactured in Taiwan and is suitable for various automated SMT processes. The crystal offers a nominal frequency of 27.000000MHz and is built to withstand demanding operational conditions.
Product Attributes
- Brand: Harmony Electronics Corporation
- Product Type: Quartz Crystal
- Model: HSX321S
- Country of Origin: Taiwan
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- MSL Level: 1
Technical Specifications
| Item | Electrical Spec. | Unit | Notes | Min | Type | Max |
|---|---|---|---|---|---|---|
| Frequency (FL) | MHz | 27.000000 | ||||
| Mode of oscillation | Fundamental | |||||
| Frequency tolerance | ppm | at 253 | -10 | +10 | ||
| Equivalent resistance (RR) | SERIES | 60 | ||||
| Storage temperature range | -40 | +90 | ||||
| Operable temperature range | -30 | +90 | ||||
| Temperature stability | ppm | -30 ~ +90 | -50 | +50 | ||
| Loading capacitance (CL) | pF | 10.0 | ||||
| Drive level (DL) | W | 10 | 100 | |||
| Shunt Capacitance (C0) | pF | 2.0 | ||||
| Insulation resistance | M | at DC 100V | 500 | |||
| Aging | ppm/Year | -3 | +3 | |||
| Circuit | Measured in HP/E5100A,S&A 250B | |||||
| Dimensions (L x W) | mm | 3.2 x 2.5 | ||||
| Dimensions (Height) | mm | 0.7 | ||||
| Package Quantity | PCS / REEL | Standard Packing Quantity | 3,000 |
| Mechanical Performance | Specifications | Code |
|---|---|---|
| Shock | Dropping from 120 cm height 3 times on 30 mm Concrete floor. | A |
| Vibration | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. | A |
| Leakage Test | Leak Rate 1.0x10-9 Pa-m3/sec. Max. Measured by Helium leak detector. | --- |
| Solder ability | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | B |
| Bending Strength | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. | A |
| Adhesion | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | C |
| Body strength | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec | C |
| Environmental Performance | Specifications | Code |
|---|---|---|
| Resistance of Soldering Heat | Performing as the following reflow: | A |
| Humidity | Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. | A |
| Storage in Low Temperature | -40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | A |
| Storage in High Temperature | +85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | A |
| Thermal shock | -55deg.C 2deg.C (30min) +125deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. | A |
Specifications Code Details:
A: FREQ. DRIFT: 5 ppm Max, RESISTANCE DRIFT: 15% or 2
B: More than 90% of lead shall be covered by new solder.
C: FREQ. DRIFT: 15 ppm Max, RESISTANCE DRIFT: 25% or 10
2410121447_HELE-X3S027000BA1H-X_C254352.pdf
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