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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±20ppm
Operating Temperature:
-20℃~+75℃
Load Capacitance:
12pF
Frequency:
24MHz
Mfr. Part #:
X2B024000BC1HA-V
Package:
SMD2520-4P
Key Attributes
Model Number:
X2B024000BC1HA-V
Product Description
Product Overview
The Harmony Electronics HSX221SA is a Quartz Crystal unit designed for reliable electronic applications. It operates at a nominal frequency of 24.000000MHz and is manufactured with high-quality materials, ensuring compliance with environmental standards such as RoHS and REACH. This product is suitable for integration into various electronic devices, offering stable performance and durability.
Product Attributes
- Brand: Harmony Electronics Corporation
- Product Type: Quartz Crystal
- Model: HSX221SA
- Country of Origin: Taiwan
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- MSL Level: 01
Technical Specifications
| Item | Electrical Spec. | Unit | Min | Type | Max | Notes |
|---|---|---|---|---|---|---|
| Frequency (FL) | MHz | 24.000000 | ||||
| Mode of oscillation | Fundamental | |||||
| Frequency tolerance | ppm | -10 | +10 | at 253 | ||
| Equivalent resistance (RR) | 150 | SERIES | ||||
| Storage temperature range | -40 | +85 | ||||
| Operable temperature range | -20 | +75 | ||||
| Temperature stability | ppm | -20 | +20 | -20 ~ +75 | ||
| Loading capacitance (CL) | pF | 12.0 | ||||
| Drive level (DL) | W | 10 | 100 | |||
| Shunt Capacitance (C0) | pF | 2.0 | ||||
| Insulation resistance | M | 500 | at DC 100V | |||
| Aging | ppm/Year | -3 | +3 | |||
| Circuit Measured in | HP/E5100A,S&A 250B | |||||
| Dimensions (L x W x H) | mm | 2.0 x 2.0 x 0.73 (Max) | Refer to drawing | |||
| Pin Connections | 1:Crystal, 2:GND/Lid, 3:Crystal, 4:GND/Lid | |||||
| Inside Structure Components | Material | Note | ||||
| Base | Ceramic Al2O3 | (1) | ||||
| Lid | Metal Fe- Ni Co Ni Plating | (2) | ||||
| Kovar | Metal Fe- Ni -Co | (3) | ||||
| Crystal Blank | Quartz SiO2 Rectangular At-Cut | (4) | ||||
| Electrode | Metal - | (5) | ||||
| PAD Metal | W Ni Plating Au Plating | (6) | ||||
| Connective Adhesive | Silver Powder Ag | |||||
| Reflow Conditions (Preheat) | sec | 120 | 160~180deg.C | |||
| Reflow Conditions (Primary heat) | sec | 60~120 | >=220 deg.C | |||
| Reflow Conditions (Peak) | sec | 10 | Max. | 260 deg.C | ||
| Manual Solder iron (Bit temp.) | Max. 350 | |||||
| Manual Solder iron (Time) | sec | Max. 3 | ||||
| Carrier Tape Dimensions (A x B x C) | mm | 4.0 x 4.0 x 1.75 | Refer to drawing | |||
| Reel Dimensions (Diameter x Width) | mm | 180 x 60.5 | Refer to drawing | |||
| Standard Packing Quantity | PCS / REEL | 3,000 | ||||
| Shock Test | Dropping from 120 cm height 3 times on 30 mm Concrete floor. | A | JIS C 60068-2-32 | |||
| Vibration Test | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. | A | JIS C 60068-2-6 | |||
| Leakage Test | Leak Rate | Pa-m3/sec. Max. | 1.0x10-9 | Measured by Helium leak detector. | ||
| Solder ability | Dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | B | JIS C 60068-2-20 | |||
| Bending Strength | Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. | A | EIAJ ET-7403 | |||
| Adhesion | Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | C | EIAJ ET-7403 | |||
| Body strength | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec | C | EIAJ ET-7403 | |||
| Humidity Test | Temperature 602, RH 90~95%, duration of 240 hours. | A | JIS C 60068-2-3 | |||
| Storage in Low Temperature | -40deg.C 2deg.C, duration of 240 hours. | A | JIS C 60068-2-1 | |||
| Storage in High Temperature | +85deg.C 2deg.C, duration of 240 hours. | A | JIS C 60068-2-2 | |||
| Temperature cycles | -40deg.C 2deg.C (30min) +85deg.C 2deg.C (30min) 25 cycles. | A | JIS C 0025 |
2410121447_HELE-X2B024000BC1HA-V_C254334.pdf
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