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Specifications
Normal temperature Frequency Tolerance:
±20ppm
Frequency Stability:
±20ppm
Operating Temperature:
-20℃~+70℃
Load Capacitance:
12pF
Frequency:
25MHz
Mfr. Part #:
X3S025000DC1H-U
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S025000DC1H-U
Product Description
Product Overview
The HSX321S Quartz Crystal from HARMONY ELECTRONICS CORP. is a high-precision frequency control component designed for various electronic applications. It offers a nominal frequency of 25.000MHz with tight frequency tolerance and stable performance across a defined operating temperature range. The crystal unit is housed in an HSX321S holder and is suitable for automated insertion processes.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX321S
- Country of Origin: TAIWAN
- Manufacturing Locations: THAILAND, CHINA
- Moisture Sensitivity Level: Level 1
- Compliance: ROHS Compliant, Green Product
Technical Specifications
| Specification | Details |
|---|---|
| Nominal Frequency | 25.000000MHz |
| Holder Type | HSX321S |
| Frequency Tolerance | +/-20 ppm at 25C +/-3C |
| Equivalent Resistance | 60 Ohms Max. / SERIES |
| Storage Temperature Range | -40C To +85C |
| Operable Temperature Range | -20C To +70C |
| Temperature Drift | +/-20 ppm (-20C To +70C) |
| Loading Capacitance (CL) | 12.0 pF |
| Drive Level | 10 W (100W Max.) |
| Shunt Capacitance | 2.0 pF Max. |
| Insulation Resistance | > 500M Ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Shock Resistance (Drop Test) | Frequency variation < +/-5 ppm; Resistance variation < +/-15% or 2 Ohms |
| Aging | < +3 ppm/Year |
| Holder Type | HSX321S Seam type |
| Sealing Tightness (Leak Rate) | 1.0x10 Pa-m/sec. Max. |
| Solderability (Dipping) | 245C +/-5C for 3+/-0.5 sec. |
| Substrate Bending | Withstand 3 mm board bend for 5 sec. |
| Adhesion Pressure | 5N for 101 sec. |
| Body Strength Pressure | 10N for 101 sec. |
| Humidity Test | 60C +/-2C, 90~95% RH for 240 hours |
| Low Temperature Storage | -40C +/-2C for 240 hours |
| High Temperature Storage | +85C +/-2C for 240 hours |
| Temperature Cycles | -40C (30min) +85C (30min), 25 cycles |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Carrier Tape Material | PS (Conductive) |
| Top Tape Material | Polyester |
| Cover Tape Release Strength | 0.1N to 0.7N (Pulling direction 165 to 180, Speed 300mm/min) |
| Soldering Iron Temperature | 350C max., Time: 3sec max. per terminal |
| Reflow Soldering Conditions | Preheat: 160~180C (120sec), Primary heat: 220C (60sec), Peak: 260C (10sec Max.) |
2410121327_HELE-X3S025000DC1H-U_C254348.pdf
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