Product Overview

The Harmony Electronics HSX530G Quartz Crystal is a high-performance component designed for various electronic applications. It operates at a nominal frequency of 24.000000MHz and is manufactured with Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant materials, ensuring environmental responsibility. This crystal unit is suitable for automated SMT processes and offers stable performance within specified operating and storage temperature ranges.

Product Attributes

• Brand: Harmony Electronics Corp.
• Product Type: Quartz Crystal
• Model: HSX530G
• Country of Origin: Taiwan
• Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
• MSL Level: 01
• Internal Connection: Rectangular At-Cut Quartz Blank

Technical Specifications

Dimensions: 2.0 x 1.4 x 0.8 mm (Max. 2.6 x 1.1 x 1.6 mm)

Marking: Laser marking. Date code includes Year and Month.

Inside Structure: Base-Ceramic (Al2O3), Cap-Ceramic (Al2O3), Crystal-Seal Glass, Crystal Blank Quartz (SiO2 Rectangular At-Cut), Electrode-Metal, PAD-Metal (Ni Plating Au Plating), Connective Adhesive (Silver Powder Ag).

Handling Suggestions: Recommended reflow conditions (Preheat 160~180 120 sec; Primary heat >=220 60~120 sec; Peak 260 10 sec Max). Manual solder iron: Bit temp. 350 max., Time 3 sec max. Avoid ultrasonic processes and excessive shock during mounting. Ensure PCB warping does not affect product. Cleansing: General cleaning solutions may be used, but testing is recommended. Ultrasonic cleaning is not recommended. Storage: Original packaging, clean dust-free environment, out of direct sunlight. Recommended storage conditions: Temperature +40 Max, Relative Humidity 80% Max.

Emboss Carrier Tape & Reel: Carrier tape material: PS (Conductive). Top cover tape material: PET. Tape joint is not allowed. Release strength of cover tape: 0.1N to 0.7N.

Package: Reel quantity: 1000pcs.

Mechanical Performance:

• Shock: Dropping from 120 cm height 3 times on 30 mm Concrete floor.
• Vibration: Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles, 2 hours each direction.
• Leakage Test: Leak Rate 1.0x10-9 Pa-m3/sec. Max.
• Solder ability: Dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec after applying ROSIN Flux.
• Bending Strength: Mount sample on board, apply pressure until board bent to 3 mm for 5 1 sec.
• Adhesion: Apply pressure vertically to the side of specimen attached to the circuit board with pressure jig (5N for 101 sec).
• Body strength: Apply pressure to the center of body with R0.5 pressure jig (10N for 101sec).

Environmental Performance:

• Resistance of Soldering Heat: Performed as specified reflow conditions.
• Humidity: 602, RH 90~95%, 240 hours.
• Storage in Low Temperature: -40deg.C 2deg.C, 240 hours.
• Storage in High Temperature: +85deg.C 2deg.C, 240 hours.
• Temperature cycles: -40deg.C 2 (30min) +85deg.C 2 (30min), 25 cycles.

Factory Locations:

• Head Office/Taiwan Factory: NO.39, HUADONG RD., DALIAO DIST., DAFA INDUSTRIAL PARK, KAOHSIUNG CITY 831, TAIWAN.
• China Factory: JU YUAN INDUSTRIAL PARK, QIAO TANG ROAD, TANG WEI COMMUNITY, FUYONG, BAOAN DISTRICT, SHEN ZHEN CITY, CHINA (Post Code:518103).
• Thailand Factory: 66MOO 5, KAONGU-BEOKPRAI RD., T.BEOKPRAI, A. BANPONG, RATCHABURI PROVINCE 70110, THAILAND.

Service Center: TAIPEI OFFICE 2F., NO.409, SEC.2, TIDING BLVD., NEIHU DISTRICT, TAIPEI CITY 114, TAIWAN.

Contact Information: TEL: 886-2-26588883, FAX: 886-2-26588683, E-MAIL: contactus@hele.com.tw