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Specifications
Frequency Stability:
±50ppm
Voltage - Supply:
3V~3.6V
Operating Temperature:
-40℃~+85℃
Frequency:
12MHz
Mfr. Part #:
SSI012000I3CHE-T
Package:
SMD5032-4P
Key Attributes
Model Number:
SSI012000I3CHE-T
Product Description
Harmony Electronics HSO531S Oscillator
The Harmony Electronics HSO531S is a high-quality oscillator designed for various electronic applications. This product offers precise frequency output and reliable performance across a wide operating temperature range. It is suitable for integration into electronic devices requiring stable and accurate timing signals.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Country of Origin: TAIWAN
- Model Type: HSO531S
- Application For: Products: OSCILLATOR
- Customer Part No.: HELE.
- Harmony Part No: SSI012000I3CHE-T
- Sample Order No: EOS-D50229-2
Technical Specifications
| Item | Symbol | Min | Typ | Max | Unit | Condition / Notes |
|---|---|---|---|---|---|---|
| Type Name | HSO531S | |||||
| Output Frequency | F | 12.000000 | MHz | |||
| Frequency Stability | f/F | -50 | +50 | ppm | Inclusive of 25 Tolerance, operating temperature range, input voltage change, Load change, first of aging, shock and vibration. | |
| Operating Temp. Range | Topr | -40 | 25 | +85 | ||
| Supply Voltage | Vdd | 3.0 | 3.3 | 3.6 | V | 3.3+/- 0.3V |
| Current Consumption 1 | Idd1 | 25 | mA | #1 pin: open or "H", No Load | ||
| Current Consumption 2 | Idd2 | 0.05 | mA | #1 pin: "L" level, No Load | ||
| Symmetry (Duty) | 40 | 50 | 60 | % | Output load C-MOS CL =30pF | |
| Low level output voltage | Vol | 0.1xVdd | V | Output load C-MOS CL =30pF | ||
| High level output voltage | Voh | 0.9xVdd | V | Output load C-MOS CL =30pF | ||
| Rise & Fall time | Tr & Tf | 10 | ns | Fig1,2, 3.3V 25+/- 3, Output load C-MOS CL =30pF | ||
| Low level input current | Iil | -100 | A | |||
| High Level input current | Iih | 100 | A | |||
| Low level input voltage | Vil | 0.3xVdd | V | |||
| High level input voltage | Vih | 0.7xVdd | V | |||
| Output disable time | Tplz | 100 | ns | Fig3, 3.3V 25+/- 3 | ||
| Output enable time | Tpzl | 5 | ms | Fig3, 3.3V 25+/- 3 | ||
| Aging | -5 | 5 | ppm/year | Fig3, 3.3V 25+/- 3 | ||
| Storage Temp. Range | Tstr | -55 | 125 | |||
| Vdd terminal voltage | Vdd | -0.5 | 7.0 | V | Absolute Maximum Ratings | |
| Input terminal voltage | Vcont | -0.5 | Vdd+0.5 | V | Absolute Maximum Ratings | |
| Output terminal voltage | Vout | -0.5 | Vdd+0.5 | V | Absolute Maximum Ratings | |
| Output terminal current | Iout | 15 | mA | Absolute Maximum Ratings |
Dimensions
Refer to Page 5 of the specification document for detailed dimension drawings.
Mechanical Performance
| Item | Test Methods | Specifications |
|---|---|---|
| Natural Drop | Drop 3 times from the height of 50cm onto min. 30mm thickness hard wooden board. | A |
| Vibration | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. | A |
| Sealing Tightness | (1) Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium leak detector. Fine Leakage. (2) Dipping in the FC-40 at +125 +/-5deg.C for 5 minutes, no gas bubble observed from the inside of the can. | |
| Solderability | After applying ROSIN Flux, dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec. | B |
Environment Performance
| Item | Test Methods | Specifications |
|---|---|---|
| Humidity | Temperature 60 +/- 2 , RH 90~95%, Duration of 240 hours. Back to room temperature first, then in 1~2 hours, the component shall be checked. | A |
| Storage in Low Temperature | -40deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. | A |
| Storage in High Temperature | +85deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. | A |
| Temperature cycles | -30deg.C +/-2deg.C (30min) +80deg.C +/-2deg.C (30min) 25 cycles. Temp. increasing or reducing time need to be within 3 minutes. Back to the room temperature first, then in 1~2 hours, the component shall be checked. | A |
| High Temperature Operation | +85deg.C +/-2deg.C, +3.3V Vdd Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. | A |
Supplement
- Recommended reflow condition and maximum 2 soldering cycles.
- Land Pattern Layout and Solder Iron details are provided on Page 8.
- Suitable for Lead Free Soldering.
- Designed for automatic insertion; trial with insertion machine recommended. Pay attention to board warp.
- Avoid cleaning liquids that corrode Nickel. Ultrasonic cleaning is possible but requires checking on your board.
- Static-electricity precautions are necessary due to C-MOS circuitry.
- No integrated by-pass capacitor; recommend using a 0.01F capacitor between Vdd and GND.
- Storage: Keep away from high temperature, high humidity, direct sunlight, and dew.
Taping and Packing
- Emboss Tape Specifications and Reel Specifications are detailed on Pages 10-11.
- Storage Conditions: Temperature +40deg.C Max., Humidity 80% Max.
- Quantity on Reel: 1,000 PCS/REEL.
- Label information is provided on Page 11.
- Package details are shown on Page 12.
Flow Chart
Refer to Page 13 for the manufacturing flow chart, including incoming inspections, processing steps, and outgoing inspection.
Environmental Workload Chemical Substance Components List
| Chemical Substance Components | TYPE PERCENTAGE HSO531S (mg) | ppm |
|---|---|---|
| WOLFRAM AND ITS COMPOUND(W) | 6.739 | 4312.960 |
| COBALT AND ITS COMPOUND(Co) | 3.082 | 1972.480 |
| CHROMIUM AND ITS COMPOUND(Cr) | 0.000 | 0.000 |
| SILVER(Ag) | 0.986 | 631.040 |
| COPPER(Cu) | 0.179 | 114.560 |
| NICKEL AND ITS COMPOUND(Ni) | 6.849 | 4383.360 |
| MANGANESE AND ITS COMPOUND(Mn) | 0.025 | 16.000 |
| MOLYBDENUM AND ITS COMPOUND(Mo) | 0.111 | 71.040 |
| SILICON AND ITS COMPOUND(Si) | 1.518 | 971.520 |
| ALUMINIUM AND ITS COMPOUND(Al) | 28.820 | 18444.800 |
| GOLD(Au) | 0.691 | 442.240 |
2410121342_HELE-SSI012000I3CHE-T_C254214.pdf
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