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Quality Quartz crystal HELE X1H016000FI1H-X 16 MHz fundamental mode frequency with environmental compliance factory
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Quality Quartz crystal HELE X1H016000FI1H-X 16 MHz fundamental mode frequency with environmental compliance factory
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Specifications
Normal temperature Frequency Tolerance:
±30ppm
Frequency Stability:
±30ppm
Load Capacitance:
18pF
Operating Temperature:
-20℃~+70℃
Frequency:
16MHz
Mfr. Part #:
X1H016000FI1H-X
Package:
SMD5032-4P
Key Attributes
Model Number: X1H016000FI1H-X
Product Description

Product Overview

The HSX531S Quartz Crystal from Harmony Electronics Corporation is a high-quality electronic component designed for precise frequency generation. It operates on a fundamental mode of oscillation at a nominal frequency of 16.000000MHz. This crystal is RoHS compliant, Pb-free, HF-Halogen free, and REACH compliant, ensuring it meets environmental and safety standards. It is suitable for various electronic applications requiring stable and accurate timing signals.

Product Attributes

  • Brand: Harmony Electronics Corporation
  • Product Type: Quartz Crystal
  • Model: HSX531S
  • Origin: Taiwan
  • Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
  • MSL Level: 1
  • Green Product: Yes

Technical Specifications

Item Electrical Spec. Unit Notes Min Type Max
Frequency (FL) 16.000000 MHz 16.000000
Mode of oscillation Fundamental
Frequency tolerance -30 to +30 ppm at 253
Equivalent resistance (RR) 50 SERIES
Storage temperature range -40 to +85
Operable temperature range -20 to +70
Temperature stability -30 to +30 ppm -20 ~ +70
Loading capacitance (CL) 18.0 pF
Drive level (DL) 10 to 300 W
Shunt Capacitance (C0) 7.0 pF
Insulation resistance 500 M at DC 100V
Aging -5 to +5 ppm/Year
Circuit Measured in HP/E5100A,S&A 250B
Dimensions (L x W x H) 3.6 x 2.5 x 1.3 mm (Approx.)
Marking Laser marking
Inside Structure Components Base Ceramic (Al2O3)
Lid Metal (Fe-Ni-Co Ni Plating)
Kovar Metal (Fe-Ni-Co)
Crystal Blank Quartz (SiO2) Rectangular At-Cut
Electrode Metal
PAD Metal W Ni Plating Au Plating
Connective Adhesive Silver Powder (Ag)
Reflow Conditions (Preheat) 160~180 120 sec.
Reflow Conditions (Primary heat) >=220 60~120 sec.
Reflow Conditions (Peak) 260 10 sec. Max.
Manual Solder iron (Bit temp.) Max. 350 3sec max.
Carrier Tape Material PS Conductive
Top Cover Tape Material Polyester
Release strength of cover tape 0.1 N to 0.7 N
Reel Quantity 1000pcs or 3000pcs
Standard Packing Quantity 1,000PCS / REEL
Shock Test Dropping from 120 cm height 3 times on 30 mm Concrete floor. JIS C 60068232 A
Vibration Test Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. JIS C 6006826 A
Leakage Test Leak Rate 1.0x10 Pa-m/sec. Max. Measured by Helium leak detector
Solder ability Dipping in solder bath at 245 5 for 3 0.5 sec. JIS C 60068220 B
Bending Strength Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. EIAJ ET7403 A
Adhesion Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. EIAJ ET7403 C
Body strength Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec EIAJ ET7403 C
Humidity Test Temperature 602, RH 90~95%, duration of 240 hours. JIS C 6006823 A
Storage in Low Temperature -40 2, duration of 240 hours. JIS C 6006821 A
Storage in High Temperature +85 2, duration of 240 hours. JIS C 6006822 A
Temperature cycles -40 2 (30min) +85 2 (30min) 25 cycles. Temperature Increasing/reducing time3mins. JIS C 0025 A

2410121455_HELE-X1H016000FI1H-X_C254357.pdf

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