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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Load Capacitance:
9pF
Operating Temperature:
-10℃~+60℃
Frequency:
24MHz
Mfr. Part #:
X3S024000B91H-V
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S024000B91H-V
Product Description
Product Overview
The Harmony Electronics HSX321S is a Quartz Crystal designed for high-precision timing applications. This Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant component offers stable performance across a specified temperature range. It is suitable for various electronic devices requiring accurate frequency generation. Manufactured by Harmony Electronics Corporation, it is available with a nominal frequency of 24.000000MHz.
Product Attributes
- Brand: Harmony Electronics
- Product Type: Quartz Crystal
- Model: HSX321S
- Part Number (H.ELE. P/N): X3S024000B91H-V
- Sample Order Number (H.ELE. SAMPLE O/N): EOS-IB0115-5
- Release Date: 2018/11/09
- MSL Level: 1
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- Country of Origin: Taiwan
- Internal Connections: Pin 1: Crystal, Pin 2: GND/Lid, Pin 3: Crystal, Pin 4: GND/Lid
- Inside Structure Materials: Base (Ceramic Al2O3), Lid (Metal Fe-Ni-Co Ni Plating), Kovar (Metal Fe-Ni-Co), Crystal Blank (Quartz SiO2 At-Cut), Electrode Metal, PAD Metal (W Ni Plating Au Plating), Connective Adhesive (Silver Powder Ag)
Technical Specifications
| Item | Electrical Spec. | Unit | Notes | Min | Type | Max |
|---|---|---|---|---|---|---|
| 1. Frequency (FL) | MHz | 24.000000 | ||||
| 2. Mode of oscillation | Fundamental | |||||
| 3. Frequency tolerance | ppm | at 253 | -10 | +10 | ||
| 4. Equivalent resistance (RR) | SERIES | 60 | ||||
| 5. Storage temperature range | -40 | +85 | ||||
| 6. Operable temperature range | -10 | +60 | ||||
| 7. Temperature stability | ppm | -10 ~ +60 | -10 | +10 | ||
| 8. Loading capacitance (CL) | pF | 9.0 | ||||
| 9. Drive level (DL) | W | 10 | 100 | |||
| 10. Shunt Capacitance (C0) | pF | 2.0 | ||||
| 11. Insulation resistance | M | at DC 100V | 500 | |||
| 12. Aging | ppm/Year | -3 | +3 | |||
| 13. Circuit | Measured in HP/E5100A,S&A 250B | |||||
| Dimensions | mm | Tolerance: 0.1 | ||||
| L | 3.2 | 3.4 | ||||
| W | 2.5 | 2.7 | ||||
| H | 0.7 | 0.9 | ||||
| A | 1.2 | 1.4 | ||||
| B | 1.7 | |||||
| Package Dimensions | mm | |||||
| Length | 13.2 | 13.7 | ||||
| Width | 9.3 | 9.6 | ||||
| Thickness | 3.0 | 3.3 | ||||
| Reel Quantity | pcs | 3000 | ||||
| Mechanical Performance | Test Methods | Specifications | Code | |||
| Shock | JIS C 60068-2-32 | Dropping from 120 cm height 3 times on 30 mm Concrete floor. | A | |||
| Vibration | JIS C 60068-2-6/ MIL-HDBK-781A 6.5.2 | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. | A | |||
| Leakage Test | JIS C 60068-2-17 | Leak Rate 1.0x10-9 Pa-m3/sec. Max. Measured by Helium leak detector. | --- | |||
| Solder ability | JIS C 60068-2-20/ JIS C 60068-2-58 | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | B | |||
| Bending Strength | EIAJ ET-7403/ JIS C 60068-2-21 | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. | A | |||
| Adhesion | EIAJ ET-7403 JIS C 60068-2-21 | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | C | |||
| Body strength | EIAJ ET-7403 JIS C 60068-2-21 | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec. | C | |||
| Environmental Performance | Test Methods | Specifications | Code | |||
| Resistance of Soldering Heat | JIS C 60068-2-58 | Performing as the following reflow: | A | |||
| Humidity | JIS C 60068-2-3 | Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. | A | |||
| Storage in Low Temperature | JIS C 60068-2-1 | -40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | A | |||
| Storage in High Temperature | JIS C 60068-2-2 | +85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | A | |||
| Thermal shock | JIS C 0025 | -55deg.C 2deg.C (30min) +125deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. | A |
Specifications Code Definitions:
A: FREQ. DRIFT: 5 ppm Max, RESISTANCE DRIFT: 15% or 2
B: More than 90% of lead shall be covered by new solder.
C: FREQ. DRIFT: 15 ppm Max, RESISTANCE DRIFT: 25% or 10
2410121447_HELE-X3S024000B91H-V_C254372.pdf
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