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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±20ppm
Operating Temperature:
-30℃~+90℃
Load Capacitance:
8pF
Frequency:
16MHz
Mfr. Part #:
X3S016000B81H-DHU
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S016000B81H-DHU
Product Description
Product Overview
The HSX321S Quartz Crystal from HARMONY ELECTRONICS CORP. is a high-performance frequency control component designed for various product applications. It offers precise frequency stability and reliable operation across a wide temperature range. This crystal unit is suitable for applications requiring accurate timing and oscillation, making it a key component in electronic devices.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX321S
- Country of Origin: TAIWAN
- Manufacturing Locations: THAILAND, CHINA
- Moisture Sensitivity Level: Level 1
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Frequency | 16.000000 | MHz | |
| Holder Type | HSX321S | ||
| Frequency Tolerance | +/-10 | ppm | at 25C +/-3C |
| Equivalent Resistance | 50 | Ohms Max. | SERIES |
| Storage Temperature Range | -40 to +90 | C | |
| Operable Temperature Range | -30 to +90 | C | |
| Temperature Drift | +/-20 | ppm | -30C to +90C |
| Loading Capacitance (CL) | 8.0 | pF | |
| Drive Level | 10 | W | (200W Max.) |
| Shunt Capacitance | 2.0 | pF Max. | |
| Insulation Resistance | > 500 | M ohms | at DC 100V |
| Mode of Oscillation | Fundamental | ||
| Shock Test (Frequency Variation) | < +/-5 | ppm | Dropping from 120 cm height 3 times on Concrete floor |
| Shock Test (Resistance Variation) | < +/-15 % or 2 ohms max. | Dropping from 120 cm height 3 times on Concrete floor | |
| Aging | < +/-3 | ppm/Year | |
| Holder | HSX321S | Seam type | |
| Carrier Tape Material | PS Conductive | ||
| Top Tape Material | Polyester | ||
| Standard Packing Quantity | 3,000 | PCS / REEL | |
| Storage Condition (Temp.) | +40 | C Max. | |
| Storage Condition (RH) | 80 | % Max. | |
| Cover Tape Release Strength | 0.1 to 0.7 | N | Pulling direction 165 to 180, Speed 300mm/min |
| Mechanical Performance - Natural Drop | Frequency < +/-5 ppm, Resistance < +/-15% or 2 ohms max. | Dropping from 120 cm height 3 times on Concrete floor | |
| Mechanical Performance - Vibration | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. | ||
| Mechanical Performance - Sealing Tightness | Leak Rate < 1.0x10-8 Pa-m/sec. Max. | Measured by Helium leak detector. | |
| Mechanical Performance - Solder Ability | Dipping in solder bath at 245C+/-5C for 3+/-0.5 sec. | After applying ROSIN Flux. | |
| Mechanical Performance - Substrate Bending | Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed :0.5 mm / sec | ||
| Mechanical Performance - Adhesion | Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure : 5N for 101 sec | ||
| Mechanical Performance - Body Strength | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec | ||
| Environmental Performance - Humidity | Temperature 60 +/-2 C, RH 90~95%, Duration of 240 hours. | ||
| Environmental Performance - Storage in Low Temperature | -40C +/-2C, Duration of 240 hours. | ||
| Environmental Performance - Storage in High Temperature | +85C +/-2C, Duration of 240 hours. | ||
| Environmental Performance - Temperature Cycles | -40C +/-2C (30min) +85C +/-2C (30min) 25 cycles. | ||
| Soldering Reflow Condition | Available for Lead Free Soldering | Proposed reflow condition, soldering 2 times max. | |
| Soldering Iron Condition | Bit temp.: 350 max., Time: 3sec max. , Each terminal solder a 1 time max. |
2410121327_HELE-X3S016000B81H-DHU_C254342.pdf
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