Product Overview
The Harmony Electronics Corporation HSX321S Quartz Crystal is a high-performance frequency control component designed for a wide range of electronic applications. Engineered for precision and reliability, this crystal unit operates at a nominal frequency of 8.000000MHz, utilizing a fundamental mode of oscillation. It is manufactured with Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant materials, reflecting a commitment to environmental standards. The HSX321S is suitable for various automated SMT processes and is built to withstand demanding mechanical and environmental conditions, making it an ideal choice for industrial and consumer electronics.
Product Attributes
- Brand: Harmony Electronics Corporation
- Product Type: Quartz Crystal
- Model: HSX321S
- Sample Order Number: EOSG801811
- Harmony Part Number: X3S008000FA1HX
- Release Date: 2016/08/15
- MSL Level: 01
- Certifications: Pb free, RoHS Compliant, HFHalogen free, REACH Compliant
- Country of Origin: Taiwan, China, Thailand (Factory options available)
- Inside Structure Materials: Base (Al2O3), Lid (FeNiCo), Kovar (FeNiCo), Crystal Blank (SiO2 Rectangular AtCut), Electrode (W, Ni, Au), PAD (W, Ni, Au), Connective Adhesive (Ag)
Technical Specifications
| Item | Electrical Spec. | Unit | Notes | Min | Type | Max |
|---|---|---|---|---|---|---|
| 1. Frequency (FL) | Frequency | MHz | 8.000000 | |||
| 2. Mode of oscillation | Fundamental | |||||
| 3. Frequency tolerance | ppm | at 253 | -30 | +30 | ||
| 4. Equivalent resistance (RR) | SERIES | 300 | ||||
| 5. Storage temperature range | -40 | +85 | ||||
| 6. Operable temperature range | -40 | +85 | ||||
| 7. Temperature stability | ppm | -40 ~ +85 | -50 | +50 | ||
| 8. Loading capacitance (CL) | pF | 10.0 | ||||
| 9. Drive level (DL) | W | 10 | 100 | |||
| 10. Shunt Capacitance (C0) | pF | 2.0 | ||||
| 11. Motional Capacitance (C1) | fF | |||||
| 12. Insulation resistance | M | at DC 100V | 500 | |||
| 13. Aging | ppm/Year | -3 | +3 | |||
| 14. Pulling Sensitivity | ppm/pF | |||||
| 15. Q Factor | K | |||||
| 16. RLD2 | ||||||
| 17. FDLD | ppm | |||||
| 18. DLD2 | ||||||
| 19. SPUR | ||||||
| 20. SPFR | ppm | |||||
| 21. SPDB | dB | |||||
| 22. Circuit | Measured in HP/E5100A,S&A 250B | |||||
| Dimensions: (Refer to Diagram 2) | ||||||
| Marking: Laser marking. Date Code: Y=Year (0-9), M=Month (A-M). | ||||||
| Reflow Conditions: Preheat: 160~180 (120 sec), Primary heat: 220 (60 sec), Peak: 260 (10 sec Max.) | ||||||
| Manual Solder iron: Bit temp.: 350 max., Time: 3sec max. | ||||||
| Carrier Tape Dimensions: (Refer to Diagram 6) | ||||||
| Reel Quantity: 1000pcs / 3000pcs. Standard Packing Quantity: 3,000PCS / REEL. | ||||||
| Package Dimensions: (Refer to Diagram 7) | ||||||
| Item | Test Methods | Specifications | ||||
| 1. Shock | Dropping from 120 cm height 3 times on 30 mmm Concrete Floor (JIS C 6006826 A) | |||||
| 2. Vibration | Frequency 1055Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. (MILHDBK781A 6.5.2/ JIS C 6006826 A) | |||||
| 3. Leakage Test | Leak Rate 1.0x109 Pam3/sec. Max. Measured by Helium leak detector. | |||||
| 4. Solder ability | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. (JIS C 60068220 B) | More than 90% of lead shall be covered by new solder. | ||||
| 5. Bending Strength | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. (EIAJ ET7403 A) | |||||
| 6. Adhesion | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. (EIAJ ET7403 A) | |||||
| 7. Body strength | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec (EIAJ ET7403 A) | |||||
| Item | Test Methods | Specifications | ||||
| 1. Resistance of Soldering Heat | Performing as the following reflow. | Frequency variation shall be within 5ppm and equivalent resistance shall be within 15% or 2 | ||||
| 2. Humidity | Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then in 1~2 hours, the component shall be checked. (JIS C 6006823 A) | |||||
| 3. Storage in Low Temperature | 40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. (JIS C 6006821 A) | |||||
| 4. Storage in High Temperature | +85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. (JIS C 6006822 A) | |||||
| 5. Temperature cycles | 40deg.C 2deg.C (30min) +85deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then in 1~2 hours, the component shall be checked. (JIS C 0025 A) | |||||
Contact Information:
TEL: 886226588883
Email: contactus@hele.com.tw
Factory Locations:
HEAD OFFICE/TAIWAN FACTORY: No.39, Huadong Rd., Daliao Dist., Dafa Industrial Park, Kaohsiung City 831, Taiwan (ROC).
CHINA FACTORY: Ju Yuan Industrial Park, Qiao Tang Road, Tang Wei Community, Fuyong, Baoan District, Shen Zhen City, China (Post Code:518103).
THAILAND FACTORY: 66moo 5, Kaongubeokprai Rd., t.beokprai, A. Banpong, Ratchaburi Province 70110, Thailand.
Service Center:
TAIPEI OFFICE (114) 2F., NO.409, SEC.2, TIDING BLVD., NEIHU DISTRICT, TAIPEI CITY 114, TAIWAN
TEL: 886226588883 FAX: 886226588683
2409291004_HELE-X3S008000FA1H-X_C254257.pdf
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