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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Operating Temperature:
-
Load Capacitance:
10pF
Frequency:
48MHz
Mfr. Part #:
X3S048000BA1H-U
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S048000BA1H-U
Product Description
Product Overview
The HSX321S Quartz Crystal from HARMONY ELECTRONICS CORP. is a high-performance frequency control component designed for various electronic applications. It offers precise frequency stability and reliable operation across a wide temperature range. This crystal is suitable for integration into electronic devices requiring accurate timing and oscillation, with a focus on robust mechanical and environmental performance.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX321S
- Country of Origin: TAIWAN
- Manufacturing Facilities: THAILAND, CHINA
- Specification Number: X3S048000BA1HA-U
- Revision: 0
- Date: 2016/02/04
- Moisture Sensitivity Level: Level 1
Technical Specifications
| Specification | Details |
|---|---|
| Frequency | 48.000000 MHz |
| Holder Type | HSX321S |
| Frequency Tolerance | +/-10ppm at 25C +/-3C |
| Equivalent Resistance | 50 Ohms Max. / SERIES |
| Storage Temperature Range | -40C To +125C |
| Operable Temperature Range | -40C To +85C |
| Temperature Drift | +/- 20 ppm (-40C To +85C) |
| Loading Capacitance (CL) | 10.0 pF |
| Drive Level | 10 W (100W Max.) |
| Shunt Capacitance | 2.0 pF Max. |
| Insulation Resistance | More than 500M Ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Shock Resistance (Drop Test) | Frequency variation less than +/-5 ppm; Resistance less than +/-15% or 2ohms max. (120 cm height, 3 times on concrete floor) |
| Aging | Less than +/-3 ppm/Year |
| Holder Type | HSX321S Seam type |
| Carrier Tape Dimensions | Refer to Page 6 |
| Reel Dimensions | Refer to Page 7 |
| Storage Condition (Tape & Reel) | Temperature: +40C Max.; Relative Humidity: 80% Max. |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Carrier Tape Material | PS Conductive |
| Top Tape Material | Polyester |
| Taping Dimension (Leader) | Cover-tape length > 400 mm |
| Taping Dimension (Terminal) | Cover-tape fixed by paper tape, rolled around core |
| Taping Dimension (Carrier-tape Terminal) | Empty embossed area > 40 mm |
| Joint of Tape | Carrier-tape and top cover-tape should not be jointed |
| Release Strength of Cover Tape | 0.1N to 0.7N (Pulling direction 165 to 180, Speed 300mm/min) |
| Mechanical Performance - Natural Drop | Frequency variation < +/-5 ppm; Resistance variation < +/-15% or 2 (120 cm height, 3 times on concrete floor) |
| Mechanical Performance - Vibration | 10-55Hz, 0.8mm amplitude, 2 hours per axis (X, Y, Z) |
| Mechanical Performance - Sealing Tightness | Leak Rate 1.0x10^-8 Pa-m/sec. Max. (Helium leak detector) |
| Mechanical Performance - Solder Ability | 245C +/-5C for 3+/-0.5 sec. |
| Mechanical Performance - Substrate Bending | 3 mm bend, 5 1 sec. (0.5 mm/sec pressure speed) |
| Mechanical Performance - Adhesion | 5N pressure for 101 sec. |
| Mechanical Performance - Body Strength | 10N pressure for 101 sec. (R0.5 pressure jig) |
| Environmental Performance - Humidity | 60C +/-2C, 90~95% RH, 240 hours |
| Environmental Performance - Storage in Low Temperature | -40C +/-2C, 240 hours |
| Environmental Performance - Storage in High Temperature | +85C +/-2C, 240 hours |
| Environmental Performance - Temperature Cycles | -40C (30min) +85C (30min), 25 cycles |
| Soldering Recommendation (Reflow) | Max. 2 times soldering. Refer to Page 12 for proposed reflow conditions. |
| Soldering Recommendation (Solder Iron) | Bit temp.: 350C max., Time: 3sec max. per terminal. |
| Mounting Recommendation | Designed for automatic insertion. Avoid ultrasonic welding. |
| Cleaning Recommendation | Avoid cleaning liquids that corrode Nickel. Ultrasonic cleaning possible, check on your board. |
| Storage Recommendation | Keep away from high temperature and high humidity, direct sunlight, and dew. |
| Environmental Workload Chemical Substance Components | Includes Si, Au, Co & Compound, Mo & Compound, Ag, Cu, Cr & Compound, Al, Mn & Compound, W & Compound, Ni & Compound, Fe. (Details on Page 15) |
2410121327_HELE-X3S048000BA1H-U_C254378.pdf
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