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Specifications
Normal temperature Frequency Tolerance:
±8ppm
Frequency Stability:
±12ppm
Load Capacitance:
9pF
Operating Temperature:
-20℃~+75℃
Frequency:
26MHz
Mfr. Part #:
X2B026000L91H-S
Package:
SMD2520-4P
Key Attributes
Model Number:
X2B026000L91H-S
Product Description
Product Overview
The Harmony Electronics HSX221SA is a high-quality Quartz Crystal designed for reliable electronic applications. It features a nominal frequency of 26.000000MHz and is manufactured with Pb-free, RoHS Compliant, and HF-Halogen free materials. This crystal is suitable for various industrial applications requiring precise frequency control and offers excellent stability across a wide operating temperature range.
Product Attributes
- Brand: HARMONY ELECTRONICS CORPORATION
- Product Type: Quartz Crystal
- Model: HSX221SA
- Harmony P/N: X2B026000L91H-S
- Sample O/N: EOS-HC0286-2
- Country of Origin: Taiwan
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- MSL Level: 01
- Green Product: Yes
Technical Specifications
| Item | Electrical Spec. | Unit | Notes | Min | Type | Max |
|---|---|---|---|---|---|---|
| Frequency (FL) | MHz | 26.000000 | ||||
| Mode of oscillation | Fundamental | |||||
| Frequency tolerance | ppm | at 253 | -8 | +8 | ||
| Equivalent resistance (RR) | SERIES | 80 | ||||
| Storage temperature range | -40 | +85 | ||||
| Operable temperature range | -20 | +75 | ||||
| Temperature stability | ppm | -20 ~ +75 | -12 | +12 | ||
| Loading capacitance (CL) | pF | 9.0 | ||||
| Drive level (DL) | W | 10 | 100 | |||
| Shunt Capacitance (C0) | pF | 2.0 | ||||
| Insulation resistance | M | at DC 100V | 500 | |||
| Aging | ppm/Year | -3 | +3 | |||
| Circuit Measured in | HP/E5100A,S&A 250B | |||||
| Dimensions | ||||||
| Length | mm | 2.50.15 | ||||
| Width | mm | 2.00.15 | ||||
| Height | mm | 0.73 Max | ||||
| Inside Structure Components | Material | Note | ||||
| Base | Ceramic Al2O3 | (1) | ||||
| Lid | Metal Fe- Ni Co Ni Plating | (2) | ||||
| Kovar | Metal Fe- Ni -Co | (3) | ||||
| Crystal Blank | Quartz SiO2 | Rectangular At-Cut | ||||
| Electrode | Metal | - | ||||
| PAD | Metal W Ni Plating Au Plating | (6) | ||||
| Connective Adhesive | Silver Powder Ag | |||||
| Reflow Conditions | ||||||
| Preheat | deg.C | 160~180 | 120 sec. | |||
| Primary heat | deg.C | 60~120 | >=220 | |||
| Peak | deg.C | Max. | 10 | 260 | ||
| Emboss Carrier Tape Dimensions | ||||||
| Pocket Width | mm | 4.00.1 | ||||
| Pocket Depth | mm | 1.550.05 | ||||
| Pocket Pitch | mm | 4.00.1 | ||||
| Carrier Tape Width | mm | 8.00.2 | ||||
| Reel Package | ||||||
| Reel Diameter | mm | 180 | 180+0/-3 | |||
| Reel Width | mm | 13.20.5 | ||||
| Reel Thickness | mm | 3.00.2 | ||||
| Standard Packing Quantity | PCS / REEL | 3,000 | ||||
| Mechanical Performance Tests | ||||||
| Shock | Dropping from 120 cm height 3 times on 30 mm Concrete floor. | Refer to: JIS C 60068-2-32 | A | |||
| Vibration | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. | Refer to: JIS C 60068-2-6 | A | |||
| Leakage Test | Leak Rate | Pa-m3/sec. Max. | Measured by Helium leak detector. | 1.0x10-9 | ||
| Solder ability | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | Refer to: JIS C 60068-2-20 | B | |||
| Bending Strength | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. | Refer to: EIAJ ET-7403 | A | |||
| Adhesion | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | Refer to: EIAJ ET-7403 | C | |||
| Body strength | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec | Refer to: EIAJ ET-7403 | C | |||
| Environmental Performance Tests | ||||||
| Resistance of Soldering Heat | Performing as the following reflow: | A | ||||
| Humidity | Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 60068-2-3 | A | |||
| Storage in Low Temperature | -40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 60068-2-1 | A | |||
| Storage in High Temperature | +85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 60068-2-2 | A | |||
| Temperature cycles | -40deg.C 2deg.C (30min) +85deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. | Refer to: JIS C 0025 | A | |||
| Specifications Code A (Humidity/Low Temp/High Temp/Temp Cycles) | FREQ. DRIFT: 5 ppm Max, RESISTANCE DRIFT: 15% or 2 | |||||
| Specifications Code B (Solder ability) | More than 90% of lead shall be covered by new solder. | |||||
| Specifications Code C (Bending Strength/Adhesion/Body Strength) | FREQ. DRIFT: 15 ppm Max, RESISTANCE DRIFT: 25% or 10 | |||||
2410121447_HELE-X2B026000L91H-S_C254317.pdf
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