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Specifications
Normal temperature Frequency Tolerance:
±15ppm
Frequency Stability:
±15ppm
Operating Temperature:
-20℃~+75℃
Load Capacitance:
8pF
Frequency:
32MHz
Mfr. Part #:
X2B032000C81H-HU
Package:
SMD2520-4P
Key Attributes
Model Number:
X2B032000C81H-HU
Product Description
Product Overview
The Harmony Electronics HSX221SA is a Quartz Crystal unit designed for electronic applications requiring precise frequency control. It features a nominal frequency of 32.000000MHz and operates as a fundamental mode oscillator. This product is Pb-free, RoHS compliant, HF-Halogen free, and REACH compliant, making it suitable for environmentally conscious manufacturing. The HSX221SA is manufactured by Harmony Electronics Corporation, with its origin in Taiwan.
Product Attributes
- Brand: Harmony Electronics
- Model: HSX221SA
- Product Type: Quartz Crystal
- Country of Origin: Taiwan
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- MSL Level: 01
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 32.000000 | MHz | |
| Mode of Oscillation | Fundamental | ||
| Frequency Tolerance | -15 to +15 | ppm | at 253 |
| Equivalent Resistance (RR) | 50 | SERIES | |
| Storage Temperature Range | -40 to +85 | ||
| Operable Temperature Range | -20 to +75 | ||
| Temperature Stability | -15 to +15 | ppm | -20 ~ +75 |
| Loading Capacitance (CL) | 8.0 | pF | |
| Drive Level (DL) | 10 to 100 | W | |
| Shunt Capacitance (C0) | 2.0 | pF | |
| Insulation Resistance | 500 | M | at DC 100V |
| Aging | -3 to +3 | ppm/Year | |
| Dimensions (L x W x H) | 2.5 x 2.0 x 0.73 | mm | Tolerance: 0.15 (for 2.5x2.0), 0.1 (for 0.73) |
| Carrier Tape Width | 8.0 | mm | 0.2 |
| Reel Quantity | 3000 | PCS / REEL | Standard Packing Quantity |
Inside Structure Components:
| Component | Material | Note |
|---|---|---|
| Base | Al2O3 | |
| Lid | Fe-Ni-Co | |
| Kovar | Fe-Ni-Co | |
| Crystal Blank | SiO2 | Rectangular At-Cut |
| Electrode | W, Ni, Au | |
| PAD | W, Ni, Au | |
| Connective Adhesive | Ag |
Mechanical Performance:
| Item | Test Method | Specifications |
|---|---|---|
| Shock | JIS C 60068-2-6 A | Dropping from 120 cm height 3 times on 30mmm Concrete Floor |
| Vibration | MIL-HDBK-781A 6.5.2/ JIS C 60068-2-6 A | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 120 mins to each direction. |
| Leakage Test | --- | Leak Rate 1.0x10-9 Pa-m3/sec. Max. Measured by Helium leak detector. |
| Solder ability | JIS C 60068-2-20 B | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. |
| Bending Strength | EIAJ ET-7403 A | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. |
| Adhesion | EIAJ ET-7403 A | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. |
| Body strength | EIAJ ET-7403 A | Apply pressure to the center of body with the R0.5 pressure jig. pressure :5N for 101sec |
Environmental Performance:
| Item | Test Method | Specifications |
|---|---|---|
| Resistance of Soldering Heat | A | Performing as the following reflow: |
| Humidity | JIS C 60068-2-3 A | Temperature 60 2, RH 90~95%, Duration of 240 hours. Back to room temperature first, then in 1~2 hours, the component shall be checked. |
| Storage in Low Temperature | JIS C 60068-2-1 A | -40deg.C 2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. |
| Storage in High Temperature | JIS C 60068-2-2 A | +85deg.C 2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. |
| Temperature cycles | JIS C 0025 A | -40deg.C 2deg.C (30min) +85deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then in 1~2 hours, the component shall be checked. |
Reflow Conditions:
- Preheat: 160~180 deg.C, 120 sec.
- Primary heat: 220 deg.C, 100 sec.
- Peak: 260 deg.C, 10 sec. Max.
- Maximum 2 reflow cycles recommended.
Manual Solder Iron:
- Bit temperature: 350 max.
- Time: 3sec max.
- Each terminal solder 1 time max.
2409291004_HELE-X2B032000C81H-HU_C254259.pdf
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