Harmony Electronics HSX531S Quartz Crystal Specification
Product Overview
The Harmony Electronics HSX531S is a quartz crystal unit designed for various electronic applications. It offers a stable oscillation frequency of 22.1184MHz with a frequency tolerance of +/-20ppm at 25C. This crystal is suitable for use in a wide operating temperature range and features a low equivalent resistance. It is manufactured in Taiwan, Thailand, and China, adhering to quality standards for reliable performance.
Product Attributes
- Brand: Harmony Electronics Corp.
- Model: HSX531S
- Frequency: 22.1184 MHz
- Country of Origin: Taiwan, Thailand, China
- Moisture Sensitivity Level: Level 1
- Environmental Compliance: ROHS Compliant, Green Product
Technical Specifications
| Specification | Details |
|---|---|
| Frequency | 22.118400 MHz |
| Holder Type | HSX531S |
| Frequency Tolerance | +/-20ppm at 25C +/-3C |
| Equivalent Resistance | 50 Ohms Max. / SERIES |
| Storage Temperature Range | -40C To +85C |
| Operable Temperature Range | -10C To +60C |
| Temperature Drift | +/-50 ppm (-10C To +60C) |
| Loading Capacitance (CL) | 20.0 pF |
| Drive Level | 10uW (300uW Max.) |
| Shunt Capacitance | 7.0 pF Max. |
| Insulation Resistance | More than 500M Ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Shock Test Variation | Frequency less than +/-5 ppm, Resistance less than +/-15% or 2ohms max. |
| Aging | Less than +/-5 ppm/Year |
| Holder Type | HSX531S Seam type |
| Standard Packing Quantity | 1,000 PCS / REEL |
| Storage Condition | Temperature: +40C Max., Relative Humidity: 80% Max. |
| Mechanical Performance - Natural Drop | Drop 3 times from 75cm height onto hard wooden board. Frequency variation within +/-5ppm, Resistance within +/-15% or 2ohms max. |
| Mechanical Performance - Vibration | 10-55Hz, Sine Wave, 0.8mm amplitude for 2 hours per axis (X,Y,Z). Frequency variation within +/-5ppm, Resistance within +/-15% or 2ohms max. |
| Mechanical Performance - Sealing Tightness | Leak Rate 1.0x10-8 Pa-m3/sec. Max. |
| Mechanical Performance - Solderability | After applying ROSIN Flux, dipping in solder bath at 245+/-5 for 3+/-0.5 sec. More than 90% of lead covered by new solder. |
| Environmental Performance - Humidity | 60C+/-2C, RH 90~95% for 240 hours. Frequency variation within +/-5ppm, Resistance within +/-15% or 2ohms max. |
| Environmental Performance - Storage in Low Temperature | -40C+/-2C for 240 hours. Frequency variation within +/-5ppm, Resistance within +/-15% or 2ohms max. |
| Environmental Performance - Storage in High Temperature | +85C+/-2C for 240 hours. Frequency variation within +/-5ppm, Resistance within +/-15% or 2ohms max. |
| Environmental Performance - Temperature Cycles | -40C+/-2C (30min) +85C+/-2C (30min), 25 cycles. Frequency variation within +/-5ppm, Resistance within +/-15% or 2ohms max. |
| Soldering Reflow Condition | Preheat: 160~180C (120sec), Primary heat: 220C (60sec), Peak: 260C (10sec) Max. (Max. 2 times) |
| Solder Iron Condition | Bit temp.: 350C max., Time: 3sec max. per terminal. |
Inside Structure
- Base: Alumina Ceramic (Al2O3)
- Cap: Fe-Ni
- Crystal Blank: Rectangular At-Cut Quartz Crystal Blank
- Adhesive: Silver Conductive Silicon Resin
- Metallized Pad: W Ni Plating, Au Plating
- Electrode: Use prohibition chemistry substance of Table 1 of DHE-0204-1 (HE-QA-24) is not included.
Marking & Dimensions
- Marking: Nominal Frequency, Logo, Manufactured year & month.
- Nominal frequency = 3 numbers after decimal point MAX. (e.g., 12.000 MHz -> 12.000)
- Manufacturing Lot No. (Year/Month) codes are specified.
- Chamfer index mark depends on the ceramic base supplier.
Emboss Carrier Tape & Reel
- Dimensions of Carrier Tape and Reel are specified.
- Tape Material: Carrier tape A PET, Top tape Polyester.
- Label Contents: Sticks label for every reel.
- Taping Dimension: Leader cover-tape > 400 mm, Terminal cover-tape fixed by paper tape.
- Joint of Tape: Carrier-tape and top cover-tape should not be jointed.
- Release Strength of Cover Tape: 0.1N to 0.7N.
Package
- Standard Packing Quantity: 1,000 PCS / REEL.
- Carton Type A, B, C, D specified for packaging.
- Includes desiccant and foam-rubber cushion for protection.
Environmental Workload Chemical Substance Components List
| Chemical Substance Components | Percentage | (mg) | ppm |
|---|---|---|---|
| SILICON(Si) | 0.15756 | 63.65 | - |
| GOLD(Au) | 0.15756 | 63.65 | - |
| COBALT AND ITS COMPOUND(Co) | 2.56944 | 1038.05 | - |
| MOLYBDENUM AND ITS COMPOUND(Mo) | 0.12928 | 52.23 | - |
| SILVER(Ag) | 0.71104 | 287.26 | - |
| COPPER(Cu) | 0.10100 | 40.80 | - |
| CHROMIUM AND ITS COMPOUND(Cr) | 0.06868 | 27.75 | - |
| ALUMINIUM(Al) | 11.11000 | 4488.44 | - |
| MANGANESE AND ITS COMPOUND(Mn) | 0.06464 | 26.11 | - |
| WOLFRAM AND ITS COMPOUND(W) | 0.15352 | 62.02 | - |
| NICKEL AND ITS COMPOUND(Ni) | 6.13676 | 2479.25 | - |
| IRON(Fe) | 9.45764 | 3820.89 | - |
Supplement
- Mounting: Designed for automatic insertion; trial mounting recommended. Avoid ultrasonic welding.
- Cleaning: Avoid cleaning liquids that corrode Nickel. Ultrasonic cleaning possible, check on your board.
- Storage: Keep away from high temperature, high humidity, direct sunlight, and dew.
Flow Chart
Manufacturing process includes steps such as Incoming Inspection, Etching, Frequency Sorting, Plating, Mounting, Curing, Sealing, Aging, Marking, Taping, and Final Inspection.
Document Revision:
Rev. 0, Date: 2015/01/15, Reason: New
2410121333_HELE-X1H022118DK1H_C254358.pdf
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