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Specifications
Normal temperature Frequency Tolerance:
±20ppm
Load Capacitance:
9pF
Operating Temperature:
-30℃~+85℃
Equivalent Series Resistance(ESR):
80Ω
Frequency:
26MHz
Mfr. Part #:
X3S026000B91H-X
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S026000B91H-X
Product Description
Product Overview
The Harmony Electronics HSX321S is a quartz crystal unit designed for various product applications. It operates at a nominal frequency of 16.000MHz with a frequency tolerance of +/-10 ppm at 25C. This crystal unit features a holder type of HSX321S and is suitable for applications requiring stable frequency generation. It is manufactured by Harmony Electronics Corp. with production facilities in Taiwan, Thailand, and China.
Product Attributes
- Brand: Harmony Electronics Corp.
- Model: HSX321S
- Type: Quartz Crystal Unit
- Country of Origin: Taiwan
- Manufacturing Locations: Taiwan, Thailand, China
- Moisture Sensitivity Level: Level 1
- Marking: Laser marking (Logo, Nominal Frequency, Manufactured year & month, Lot No.)
Technical Specifications
| Specification | Details |
|---|---|
| Nominal Frequency | 16.000000MHz |
| Holder Type | HSX321S |
| Frequency Tolerance | +/-10 ppm at 25C +/-3C |
| Equivalent Resistance | 80 Ohms Max. / SERIES |
| Storage Temperature Range | -40C To +95C |
| Operable Temperature Range | -30C To +85C |
| Temperature Drift | +/-20ppm (-30C To +85C) |
| Loading Capacitance (CL) | 9.0pF |
| Drive Level | 10 W (100W Max) |
| Shunt Capacitance | 2.0 pF Max |
| Insulation Resistance | More than 500M Ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Shock Test (Frequency Variation) | Less than +/-5 ppm |
| Shock Test (Resistance Variation) | Less than +/-15% or 2ohms max. |
| Aging | Less than +/-3 ppm/Year |
| Holder Type | HSX321S Seam type |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Tape Material (Carrier) | PS Conductive |
| Tape Material (Top) | Polyester |
| Cover Tape Release Strength | 0.1N to 0.7N |
| Mechanical Performance (Drop Test) | Drop 3 times from 75cm onto hard wooden board. (Code A) |
| Mechanical Performance (Vibration Test) | 10-55Hz, 0.8mm amplitude, 120min per axis. (Code A) |
| Mechanical Performance (Sealing Tightness) | Leak Rate 1.0x10 Pa-m/sec. Max. (Fine Leakage) |
| Mechanical Performance (Solderability) | Dipped in solder bath at 245C+/-5C for 3+/-0.5 sec. (Code B) |
| Mechanical Performance (Substrate Bending) | Apply pressure to bend board to 3mm for 51 sec. (Code A) |
| Mechanical Performance (Adhesion) | Apply 5N pressure for 10+/-1 sec. (Code A) |
| Mechanical Performance (Body Strength) | Apply 10N pressure for 10+/-1 sec. (Code A) |
| Environmental Performance (Humidity) | 60C +/-2C, 90~95% RH, 240 hours. (Code A) |
| Environmental Performance (Storage Low Temp) | -40C +/-2C, 240 hours. (Code A) |
| Environmental Performance (Storage High Temp) | +85C +/-2C, 240 hours. (Code A) |
| Environmental Performance (Temperature Cycles) | -40C to +85C, 25 cycles. (Code A) |
| Soldering Reflow Condition | Max 2 times. (See Page 12 for detailed profile) |
| Solder Iron Condition | 350C max., 3 sec max. per terminal. |
| Base Material | Alumina Ceramic (AlO) |
| Lid Material | Fe-Ni-Co |
| Crystal Blank | Rectangular At-Cut Quartz Crystal Blank |
| Adhesive | Silver Conductive Silicon Resin |
| Cover Ring Material | Fe-Ni-Co Alloy |
2410121317_HELE-X3S026000B91H-X_C254351.pdf
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