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Specifications
Frequency Stability:
±50ppm
Voltage - Supply:
3V~3.6V
Operating Temperature:
-40℃~+85℃
Frequency:
8MHz
Mfr. Part #:
SSW008000I3CHE-T
Package:
SMD3225-4P
Key Attributes
Model Number:
SSW008000I3CHE-T
Product Description
Product Overview
The Harmony Electronics HSO321S is a Crystal Oscillator designed for reliable performance. It operates at a nominal frequency of 8.000000MHz and is Pb-free, RoHS 2.0, HF-Halogen free, and REACH Compliant. This product is suitable for various electronic applications requiring stable frequency output.
Product Attributes
- Brand: HARMONY ELECTRONICS CORPORATION
- Product Type: Crystal Oscillator
- Model: HSO321S
- Part Number (H.ELE. P/N): SSW008000I3CHE-T
- Sample O/N: EOS-J70469-1
- Release Date: 2019/08/01
- MSL Level: 1
- Product Standards: Pb free, RoHS 2.0, HF-Halogen free, REACH Compliant
- Country of Origin: Kaohsiung, Taiwan; Shenzhen, China; Dongguan, China; Ratchaburi, Thailand
Technical Specifications
| Item | Symbol | Electrical Spec. | Unit | Condition |
|---|---|---|---|---|
| Electrical Specifications | FL | 8.000000 | MHz | Output Frequency |
| f/F | -50 to +50 | ppm | Frequency Stability @3.30.3V/-40~85 | |
| Topr | -40 to +85 | Operating temp. range | ||
| Vdd | 3.0 to 3.6 | V | Supply voltage | |
| CL | 15 | pF | Output load (C-MOS) | |
| Idd1 | - to 10 | mA | Current consumption 1 (#1 pin: open or "H") @3.3V/ 253 | |
| Idd2 | - to 0.01 | mA | Current consumption 2 (#1 pin: "L" level) | |
| Vol | - to 0.1xVdd | V | Low level output voltage | |
| Voh | 0.9xVdd to - | V | High level output voltage | |
| Duty | 40 to 60 | % | Symmetry | |
| Tr & Tf | - to 7 | ns | Rise & Fall time | |
| Iil | - to 10 | uA | Low level input current | |
| Iih | - to 10 | uA | High Level input current | |
| Vil | - to Vddx0.3 | V | Low level input voltage | |
| Vih | Vddx0.7 to - | V | High level input voltage | |
| Tplz | - to 150 | nsec | Output disable time | |
| Tpzl | - to 10 | msec | Output enable time | |
| Aging | -3 to 3 | ppm/year | Aging | |
| Start-up time | - to 10 | ms | Start-up time | |
| Jitter, Phase RMS(1-) | - to 1 | ps | 12KHz~20MHz Frequency Band | |
| Absolute Maximum Ratings | Vdd | -0.5 ~ 4.0 | V | Vdd terminal voltage |
| Vcont | -0.5 ~ Vdd+0.5 | V | Input terminal voltage | |
| Vout | -0.5 ~ Vdd+0.5 | V | Output terminal voltage | |
| Iout | 15 | mA | Output terminal current | |
| Tstr | -55 ~ 125 | deg.C | Storage temp. range | |
| Mechanical Performance | Shock | Refer to: JIS C 60068-2-32 | A | Dropping from 50 cm height 3 times on 30mm Concrete Floor. |
| Vibration | Refer to: JIS C 60068-2-6/MIL-HDBK-781A 6.5.2 | A | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. | |
| Leakage Test | Refer to: JIS C 60068-2-17 | A | Leak Rate 1.0x10-9 Pa-m3/sec. Max. Measured by Helium leak detector. | |
| Solder ability | Refer to: JIS C 60068-2-20/C 60068-2-58 | B | After applying ROSIN Flux, dipping in solder bath at 245deg.C +/- 5deg.C for 3+/-0.5 sec. | |
| Environmental Performance | Resistance of Soldering Heat | Refer to: JIS C 60068-2-58 | A | Performing as the following reflow. |
| Humidity | Refer to: JIS C 60068-2-3 | A | Temperature 60+/-2, RH 90~95%, Duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | |
| Storage in Low Temperature | Refer to: JIS C 60068-2-1 | A | -40deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | |
| Storage in High Temperature | Refer to: JIS C 60068-2-2 | A | +85deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | |
| Thermal shock | Refer to: JIS C 0025 | A | -40deg.C +/-2deg.C (30min) +85deg.C +/-2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. | |
| Dimensions | 3.20.2 x 2.50.2 | mm | ||
| Pin Connections | 1: Vdd, 2: GND, 3: OE(Output Enable), 4: Output | |||
| Marking | Laser marking | Date Code: Year (0-9), Month (A-M) | ||
| Inside Structure Components | Base-Ceramic, Lid, Kovar, Crystal Blank, Electrode, Connective Adhesive, Bonding Wire, IC, Pad | Material: Ceramic Al2O3, Fe-Ni-Co, Metal SiO2, Silver Powder Ag, Au, Si, Ni-Plating, Au-Plating | ||
| Reflow Condition | Preheat: 160~180deg.C (120 sec), Primary heat: >=220 deg.C (10020 sec), Peak: 2605 deg.C (10 sec Max.) | Soldering within 2 times recommended. | ||
| Manual Solder iron | Bit temp.: 350 max., Time: 3sec max. | Each terminal only should be soldered once. | ||
| Storage Conditions | Environmental Temperature: +40 degrees Celsius Maximum, Relative Humidity: 80% Maximum | Keep in clean dust-free environment out of direct sunlight. | ||
| Carrier Tape Material | Carrier tape: PS, Conductive Top tape: PET | |||
| Standard Packing Quantity | 3,000PCS / REEL | |||
| Release strength of cover tape | 0.1N to 0.7N | N | Pulling direction: 165 to 180, Speed: 300mm/min. |
2411121056_HELE-SSW008000I3CHE-T_C253918.pdf
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