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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Load Capacitance:
18pF
Operating Temperature:
-30℃~+85℃
Frequency:
20MHz
Mfr. Part #:
X3S020000BI1H-HZ
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S020000BI1H-HZ
Product Description
Product Overview
The HSX321S is a quartz crystal unit manufactured by Harmony Electronics Corp. Designed for a variety of product applications, this crystal operates at a nominal frequency of 20.000MHz. It features a holder type of HSX321S and is built to withstand a wide range of operating and storage temperatures. The unit is manufactured in Taiwan, Thailand, and Shenzhen, with specifications confirmed and prepared by F. S. Tsai, C. L. Wang, and U. F. Chen, respectively.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX321S
- Country of Origin: TAIWAN, THAILAND, SHENZHEN
- Holder Type: HSX321S
- Mode of Oscillation: Fundamental
- Seam Type: Seam
- Base Material: Alumina Ceramic (Al2O3)
- Lid Material: Fe-Ni-Co
- Marking Method: Laser marking
Technical Specifications
| Specification | Details |
|---|---|
| Nominal Frequency | 20.000MHz |
| Frequency Tolerance | +/- 10 ppm at 25C +/-3C |
| Equivalent Resistance | 60 Ohms Max. / SERIES |
| Storage Temperature Range | -40C To +85C |
| Operable Temperature Range | -30C To +85C |
| Temperature Drift | +/-10 ppm (-30C To +85C) |
| Loading Capacitance (CL) | 18.0 pF +/- 0.2 pF |
| Drive Level | 10 uW +/- 2 uW (100uW Max) |
| Shunt Capacitance | 2.0 pF Max |
| Insulation Resistance | More than 500M Ohms at DC 100V |
| Shock Test (Frequency Variation) | Less than +/-5 ppm |
| Shock Test (Resistance Variation) | Less than +/- 15 % or 2 Ohms max. |
| Aging | Less than +/- 5 ppm/Year |
| Carrier Tape Width | 12.8+/-0.3 mm |
| Reel Diameter | 180+0/-3 mm |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Cover Tape Release Strength | 0.1N to 0.7N |
| Mechanical Performance (Drop Test) | Frequency variation within +/-5ppm, Equivalent resistance within specification. |
| Mechanical Performance (Vibration Test) | Frequency variation within +/-5ppm, Equivalent resistance within specification. |
| Mechanical Performance (Sealing Tightness) | Leak Rate 1.0x10-8 Pa-m3/sec. Max. |
| Mechanical Performance (Solderability) | More than 90% of lead covered by new solder. |
| Environmental Performance (Humidity) | Frequency variation within +/-5ppm, Equivalent resistance within specification. |
| Environmental Performance (Low Temp. Storage) | Frequency variation within +/-5ppm, Equivalent resistance within specification. |
| Environmental Performance (High Temp. Storage) | Frequency variation within +/-5ppm, Equivalent resistance within specification. |
| Environmental Performance (Temperature Cycles) | Frequency variation within +/-5ppm, Equivalent resistance within specification. |
| Soldering Iron Temperature (Max) | 350C |
| Soldering Iron Time (Max) | 3 sec |
| Reflow Preheat Temperature | 160~180C |
| Reflow Preheat Time | 120 sec |
| Reflow Primary Heat Temperature | 220C |
| Reflow Primary Heat Time | 60 sec |
| Reflow Peak Temperature | 260C (Max) |
| Reflow Peak Time | 10 sec (Max) |
2410121317_HELE-X3S020000BI1H-HZ_C254329.pdf
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