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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Operating Temperature:
-20℃~+70℃
Load Capacitance:
12pF
Frequency:
32MHz
Mfr. Part #:
X3S032000BC1HZ-NU
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S032000BC1HZ-NU
Product Description
Product Overview
The HSX321S Quartz Crystal from Harmony Electronics Corp. is a high-quality crystal unit designed for various electronic applications. It offers a stable oscillation at 32.000MHz with precise frequency tolerance, making it suitable for applications requiring accurate timing. The unit is built with durable materials and adheres to strict mechanical and environmental performance standards, ensuring reliability in demanding conditions. It is available in tape and reel packaging for automated assembly processes.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX321S
- Type: Quartz Crystal Unit
- Country of Origin: TAIWAN
- Manufacturing Locations: THAILAND, CHINA
- Moisture Sensitivity Level: Level 1
- Environmental Compliance: ROHS Compliant, Green Product
Technical Specifications
| Specification | Details |
|---|---|
| Frequency | 32.000000MHz |
| Holder Type | HSX321S |
| Frequency Tolerance | +/-10 ppm at 25C +/-3C |
| Equivalent Resistance | 50 Ohms Max. / SERIES |
| Storage Temperature Range | -40C to +85C |
| Operable Temperature Range | -20C to +70C |
| Temperature Drift | +/-10 ppm (-20C to +70C) |
| Loading Capacitance (CL) | 12.0 pF |
| Drive Level | 10 W (100W Max.) |
| Shunt Capacitance | 2.0 pF Max. |
| Insulation Resistance | More than 500M Ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Shock Test Variation (Frequency) | Less than +/-5 ppm |
| Shock Test Variation (Resistance) | Less than +/-15% or 2ohms max. |
| Aging | Less than +3 ppm/Year |
| Holder Type | HSX321S Seam type |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Tape Material (Carrier) | PS Conductive |
| Tape Material (Top) | Polyester |
| Cover Tape Release Strength | 0.1N to 0.7N |
| Mechanical Performance - Natural Drop | Dropping from 120 cm height 3 times on Concrete floor |
| Mechanical Performance - Vibration | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. |
| Mechanical Performance - Sealing Tightness | Leak Rate 1.0x10 Pa-m/sec. Max. (Measured by Helium leak detector) |
| Mechanical Performance - Solder ability | Dipping in solder bath at 245C+/-5C for 3+/-0.5 sec. |
| Mechanical Performance - Substrate Bending | Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec (Pressure speed :0.5 mm / sec) |
| Mechanical Performance - Adhesion | Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure : 5N for 101 sec |
| Mechanical Performance - Body Strength | Apply pressure to the center of body with the R0.5 pressure jig. Pressure :10N for 101sec |
| Environmental Performance - Humidity | Temperature 60C +/-2C, RH 90~95%, Duration of 240 hours. |
| Environmental Performance - Storage in Low Temperature | -40C +/-2C, Duration of 240 hours. |
| Environmental Performance - Storage in High Temperature | +85C +/-2C, Duration of 240 hours. |
| Environmental Performance - Temperature Cycles | -40C +/-2C (30min) +85C +/-2C (30min) 25 cycles. |
| Soldering Condition (Reflow) | Preheat 160~180C (120sec), Primary heat 220C (60sec), Peak 260C (10sec Max.) |
| Soldering Condition (Solder Iron) | Bit temp.: 350 max., Time: 3sec max. |
2411121006_HELE-X3S032000BC1HZ-NU_C136081.pdf
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