Product Overview
The HSX321SK Quartz Crystal from Harmony Electronics Corporation is a high-performance frequency control component designed for various electronic applications. It operates at a nominal frequency of 28.636360MHz and is manufactured with a focus on reliability and environmental compliance. Key features include a fundamental mode of oscillation, tight frequency tolerance, and a wide operating temperature range, making it suitable for demanding industrial environments. This product is Pb-free, RoHS compliant, HF-Halogen free, and REACH compliant, reflecting Harmony Electronics' commitment to sustainable manufacturing.
Product Attributes
- Brand: HARMONY ELECTRONICS CORPORATION
- Product Type: Quartz Crystal
- Model: HSX321SK
- Origin: Taiwan
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- Green Product: Yes
Technical Specifications
| Item | Electrical Spec. | Unit | Notes | Min | Type | Max |
|---|---|---|---|---|---|---|
| Frequency (FL) | MHz | 28.636360 | ||||
| Mode of oscillation | Fundamental | |||||
| Frequency tolerance | ppm | at 253 | -20 | +20 | ||
| Equivalent resistance (RR) | SERIES | 50 | ||||
| Storage temperature range | -40 | +125 | ||||
| Operable temperature range | -40 | +85 | ||||
| Temperature stability | Ppm | -40 ~ +85 | -20 | +20 | ||
| Loading capacitance (CL) | pF | 20.0 | ||||
| Drive level (DL) | W | 10 | 100 | |||
| Shunt Capacitance (C0) | pF | 2.0 | ||||
| Insulation resistance | M | at DC 100V | 500 | |||
| Aging | ppm/Year | -3 | +3 | |||
| Circuit | Measured in HP/E5100A,S&A 250B | |||||
| Dimensions (L x W) | mm | 3.2 x 2.5 | ||||
| Package Quantity | PCS/REEL | Standard Packing Quantity | 3,000 |
Dimensions
Dimensions: 3.20.1 mm x 2.50.1 mm
Marking
Laser marking. Date Code and Month Code available.
Inside Structure
| Component | Material | Note |
|---|---|---|
| Base | Ceramic Al2O3 | |
| Lid | Metal Fe- Ni Co Ni Plating | |
| Kovar | Metal Fe- Ni -Co | |
| Crystal Blank | Quartz SiO2 | Rectangular At-Cut |
| Electrode | Metal | |
| PAD | Metal W Ni Plating Au Plating | |
| Connective Adhesive | Silver Powder Ag |
Handling Suggestions
Reflow Condition: Preheat 160~180deg.C (120 sec), Primary heat >=220 deg.C (10020 sec), Peak 2605 deg.C (10 sec Max). Soldering within 2 times recommended.
Manual Solder iron: Bit temp.: 350 max., Time: 3sec max. Each terminal should be soldered once.
Mounting Conditions: Suitable for most automated SMT processes. SMT sampling prior to mass production is advised. Ultrasonic processes are not recommended. Minimize excessive shock during mounting.
Cleansing Conditions: General cleaning solutions may be used, but testing prior to mass production is recommended. Ultrasonic cleaning is not recommended.
Storage Conditions: Preserve in original packaging. Avoid moisture, direct sunlight. Keep in a clean, dust-free environment. Environmental Temperature: Max +40C, Maximum Relative Humidity: 80%.
Emboss Carrier Tape & Reel
Carrier Tape Material: PS (Conductive), Top tape Material: PET. Release strength of cover tape: 0.1N to 0.7N.
Package
Standard Packing Quantity: 3,000PCS / REEL. Reel quantity: [1000pcs] & [3000pcs].
Mechanical Performance
| Item | Test Methods | Specifications |
|---|---|---|
| Shock | JIS C 60068-2-32 | Dropping from 120 cm height 3 times on 30 mm Concrete floor. |
| Vibration | JIS C 60068-2-6/ MIL-HDBK-781A 6.5.2 | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles, 2 hours each direction. |
| Leakage Test | JIS C 60068-2-17 | Leak Rate 1.0x10-9 Pa-m3/sec. Max. (Helium leak detector). |
| Solder ability | JIS C 60068-2-20/ JIS C 60068-2-58 | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. |
| Bending Strength | EIAJ ET-7403/ JIS C 60068-2-21 | Mount on board, apply pressure to center until bent 3 mm, hold for 5 1 sec. Pressure speed: 0.5 mm/sec. |
| Adhesion | EIAJ ET-7403 JIS C 60068-2-21 | Apply pressure vertically to the side of specimen attached to the circuit board. Pressure: 5N for 101 sec. |
| Body strength | EIAJ ET-7403 JIS C 60068-2-21 | Apply pressure to the center of body with R0.5 pressure jig. Pressure: 10N for 101sec. |
Environmental Performance
| Item | Test Methods | Specifications |
|---|---|---|
| Resistance of Soldering Heat | JIS C 60068-2-58 | Performing as the following reflow. FREQ. DRIFT: 5 ppm Max, RESISTANCE DRIFT: 15% or 2. |
| Humidity | JIS C 60068-2-3 | 602, RH 90~95%, 240 hours. Check component after 1~2 hours at room temperature. |
| Storage in Low Temperature | JIS C 60068-2-1 | -40deg.C 2deg.C, 240 hours. Check component after 1~2 hours at room temperature. |
| Storage in High Temperature | JIS C 60068-2-2 | +85deg.C 2deg.C, 240 hours. Check component after 1~2 hours at room temperature. |
| Thermal shock | JIS C 0025 | -55deg.C 2deg.C (30min) +125deg.C 2deg.C (30min), 25 cycles. Temperature Increasing/reducing time 3mins. Check component after 1~2 hours at room temperature. |
Contact Information
Tel: 886-2-26588883
Email: contactus@hele.com.tw
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