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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Operating Temperature:
-20℃~+85℃
Load Capacitance:
16pF
Frequency:
36MHz
Mfr. Part #:
X3S036000BG1H-V
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S036000BG1H-V
Product Description
Product Overview
The Harmony Electronics HSX321S is a Quartz Crystal designed for reliable electronic applications. It operates at a nominal frequency of 36.000000MHz and is manufactured to high standards, ensuring Pb-free, RoHS Compliant, HF-Halogen free, and REACH Compliant characteristics. This product is suitable for various industrial uses requiring precise frequency control.
Product Attributes
- Brand: Harmony Electronics Corporation
- Product Type: Quartz Crystal
- Model: HSX321S
- Part Number: X3S036000BG1H-V
- Sample Order Number: EOS-J40433-10
- Country of Origin: Taiwan
- Certifications: Pb free, RoHS Compliant, HF-Halogen free, REACH Compliant
- MSL Level: 1
Technical Specifications
| Item | Electrical Spec. | Unit | Notes | Min | Type | Max |
|---|---|---|---|---|---|---|
| Frequency (FL) | Frequency | MHz | 36.000000 | |||
| Mode of oscillation | Mode of oscillation | Fundamental | ||||
| Frequency tolerance | Frequency tolerance | ppm | at 253 | -10 | +10 | |
| Equivalent resistance (RR) | Equivalent resistance | SERIES | 50 | |||
| Storage temperature range | Storage temperature | -40 | +85 | |||
| Operable temperature range | Operable temperature | -20 | +80 | |||
| Temperature stability | Temperature stability | ppm | -20 ~ +80 | -30 | +30 | |
| Loading capacitance (CL) | Loading capacitance | pF | 16.0 | |||
| Drive level (DL) | Drive level | W | 10 | 100 | ||
| Shunt Capacitance (C0) | Shunt Capacitance | pF | 2.0 | |||
| Insulation resistance | Insulation resistance | M | at DC 100V | 500 | ||
| Aging | Aging | ppm/Year | -3 | +3 | ||
| Circuit | Circuit | Measured in HP/E5100A,S&A 250B | ||||
| Dimensions | Length | mm | Tolerance: 0.1 | 3.2 | ||
| Dimensions | Width | mm | Tolerance: 0.1 | 2.5 | ||
| Dimensions | Height | mm | Tolerance: 0.1 | 0.7 | ||
| Inside Structure (Base) | Material | Ceramic Al2O3 | ||||
| Inside Structure (Lid) | Material | Metal Fe- Ni Co Ni Plating | ||||
| Inside Structure (Kovar) | Material | Metal Fe- Ni -Co | ||||
| Inside Structure (Crystal Blank) | Material | Quartz SiO2 Rectangular At-Cut | ||||
| Mechanical Performance (Shock) | Test Method | Dropping from 120 cm height 3 times on 30 mm Concrete floor. Refer to: JIS C 60068-2-32 | A | |||
| Mechanical Performance (Vibration) | Test Method | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. Refer to: JIS C 60068-2-6/ MIL-HDBK-781A 6.5.2 | A | |||
| Mechanical Performance (Leakage Test) | Test Method | Leak Rate 1.0x10-9 Pa-m3/sec. Max. Measured by Helium leak detector. Refer to: JIS C 60068-2-17 | --- | |||
| Mechanical Performance (Solder ability) | Test Method | After applying ROSIN Flux, dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. Refer to: JIS C 60068-2-20/ JIS C 60068-2-58 | B | |||
| Mechanical Performance (Bending Strength) | Test Method | Mount a sample on board. Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. Pressure speed: 0.5 mm/sec. Refer to: EIAJ ET-7403/ JIS C 60068-2-21 | A | |||
| Mechanical Performance (Adhesion) | Test Method | Mount a sample on the circuit board. Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. Refer to: EIAJ ET-7403 JIS C 60068-2-21 | A | |||
| Mechanical Performance (Body strength) | Test Method | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec Refer to: EIAJ ET-7403 JIS C 60068-2-21 | A | |||
| Environmental Performance (Resistance of Soldering Heat) | Test Method | Performing as the following reflow: Refer to: JIS C 60068-2-58 | A | |||
| Environmental Performance (Humidity) | Test Method | Temperature 602, RH 90~95%, duration of 240 hours. Back to room temperature first, then check the component after 1~2 hours. Refer to: JIS C 60068-2-3 | A | |||
| Environmental Performance (Storage in Low Temperature) | Test Method | -40deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. Refer to: JIS C 60068-2-1 | A | |||
| Environmental Performance (Storage in High Temperature) | Test Method | +85deg.C 2deg.C, duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. Refer to: JIS C 60068-2-2 | A | |||
| Environmental Performance (Thermal shock) | Test Method | -55deg.C 2deg.C (30min) +125deg.C 2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. Refer to: JIS C 0025 | A | |||
| Specifications code | Specifications | A | ||||
| Specifications code | FRE. DRIFT | 5 ppm Max | ||||
| Specifications code | RESISTANCE DRIFT | 15% or 2 | ||||
| Specifications code | Solder ability | More than 90% of lead shall be covered by new solder. | B | |||
| Package Quantity | One reel quantity | pcs | 1000 & 3000 | |||
| Package Quantity | Standard Packing Quantity | PCS / REEL | 3,000 |
2410121652_HELE-X3S036000BG1H-V_C254283.pdf
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