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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Operating Temperature:
-10℃~+60℃
Load Capacitance:
12pF
Frequency:
16MHz
Mfr. Part #:
X3S016000BC1H-V
Package:
SMD3225-4P
Key Attributes
Model Number:
X3S016000BC1H-V
Product Description
Product Overview
The HSX321S is a quartz crystal unit manufactured by Harmony Electronics Corp., designed for various product applications. This specification document details its electrical, mechanical, and environmental performance, along with packaging and handling instructions. It is suitable for applications requiring precise frequency control.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX321S
- Country of Origin: TAIWAN
- Manufacturing Locations: TAIWAN FACTORY, THAILAND FACTORY, SHENZHEN FACTORY
- Specification Number: X3S016000BC1H-V
- Revision: 0
- Date of Specification: 2012/04/19
Technical Specifications
| Item | Specification | Details |
|---|---|---|
| Frequency | 16.000000MHz | |
| Holder Type | HSX321S | |
| Frequency Tolerance | +/-10 ppm | at 25deg.C +/-3deg.C |
| Equivalent Resistance | 80 ohms Max. | / SERIES |
| Storage Temperature Range | -40 deg.C To +85 deg.C | |
| Operable Temperature Range | -10 deg.C To +60 deg.C | |
| Temperature Drift | +/-10ppm | -10 deg.C To +60 deg.C |
| Loading Capacitance (CL) | 12.0 pF | |
| Drive Level | 10 W | (100uW Max) |
| Shunt Capacitance | 2.0 pF Max | |
| Insulation Resistance | More than 500M ohms | at DC 100V |
| Mode of Oscillation | Fundamental | |
| Circuit Measurement | Measured in HP/E5100A, S&A 250B | |
| Shock Test | Dropping from 50 cm height 3 times on firm wood | Frequency variation < +/-5 ppm; Resistance variation < +/- 15% or 2ohms max. |
| Aging | Less than +/-5 ppm/Year | |
| Holder Type | HSX321S | Seam type |
| Marking | Laser marking | Logo, Nominal Frequency, Manufactured year & month, Manufacturing Lot No. |
| Base Material | Alumina Ceramic (Al2O3) | |
| Lid Material | Fe-Ni-Co | |
| Carrier Tape Dimensions | See Page 6 | |
| Reel Dimensions | See Page 7 | Diameter: 180+0/-3 mm, Inner Width: 9.3+/-0.3 mm, Outer Width: 11.3+/-1.0 mm |
| Storage Condition (Reel) | Temperature: +40deg.C Max., Relative Humidity: 80% Max. | |
| Standard Packing Quantity | 3,000 PCS / REEL | |
| Tape Material | Carrier tape: PS, Top tape: Polyester | |
| Taping Dimension (Leader) | Cover-tape length > 400 mm (including empty embossed area) | |
| Taping Dimension (Terminal) | Empty embossed area > 40 mm, sealed by top cover-tape | |
| Joint of Tape | Carrier-tape and top cover-tape should not be jointed | |
| Release Strength of Cover Tape | 0.1N to 0.7N | Pulling direction 165 to 180, Speed 300mm/min |
| Mechanical Performance (Drop) | Natural Drop | 3 times from 50cm height onto hard wooden board. Specification A. |
| Mechanical Performance (Vibration) | Vibration | 10-55Hz, 0.8mm amplitude for 2 hours on X, Y, Z axes. Specification A. |
| Mechanical Performance (Sealing) | Tightness | Leak Rate 1.0x10-8 Pa-m3/sec. Max. (Helium leak detector). Specification Fine Leakage. |
| Mechanical Performance (Solderability) | Solderability | Dipped in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec after applying ROSIN Flux. Specification B. |
| Environmental Performance (Humidity) | Humidity | 60+/-2 deg.C, 90~95% RH for 240 hours. Specification A. |
| Environmental Performance (Low Temp Storage) | Storage in Low Temperature | -40deg.C +/-2deg.C for 240 hours. Specification A. |
| Environmental Performance (High Temp Storage) | Storage in High Temperature | +85deg.C +/-2deg.C for 240 hours. Specification A. |
| Environmental Performance (Temp Cycles) | Temperature cycles | -40deg.C (30min) +85deg.C (30min), 25 cycles. Specification A. |
| Soldering Condition (Reflow) | Proposed reflow condition, max 2 soldering times. Preheat: 160~180 deg.C (120sec), Primary heat: 220 deg.C (60sec), Peak: 260 deg.C (10sec Max). Available for Lead Free Soldering. | |
| Soldering Condition (Solder Iron) | Bit temp.: 350max., Time: 3sec max., Each terminal solder 1 time max. | |
| Mounting | Designed for automatic insertion; trial recommended. Caution for board warp. | |
| Cleaning | Avoid cleaning liquids that corrode Nickel. Ultrasonic cleaning possible, but check on board. | |
| Storage | Keep away from high temperature and high humidity, direct sunlight, and dew. | |
| Environmental Workload Chemical Substance Components | H(D)SX321S | Contains Si, Au, Co & Co Compound, Mo & Mo Compound, Ag, Cu, Cr & Cr Compound, Al, Mn & Mn Compound, W & W Compound, Ni & Ni Compound, Fe. |
2410121317_HELE-X3S016000BC1H-V_C254367.pdf
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