Current Detecting Metal Plate Chip Resistor - LP20 Type
This specification covers Current Detecting Metal Plate Chip Resistors, LP20 type. Designed for high-precision current detection, these resistors offer reliable performance in demanding applications. The LP20 type features a metal plate element for excellent surge handling and thermal stability, making it suitable for various electronic circuits.
Product Attributes
- Brand: HOKURIKU ELECTRIC INDUSTRY CO.,LTD.
- Model: LP20
- Origin: Japan (implied by HDK)
- Material: Metal plate for resistor (Alloy of low thermos electromotive force), Copper electrode, Ni under plated, Sn surface plated terminal.
- Certifications: RoHS directive compliant.
Technical Specifications
| Item | Contents |
|---|---|
| Model No. Designation | LP20 R003 F E (Ex. LP20 Resistance Tolerance Taping type) |
| Nominal Resistance | 0.001 to 0.003 |
| Resistance Tolerance | Class F (1.0 %) |
| Temperature Coefficient of Resistance | 100 ppm/ |
| Rated Ambient Temperature | 70 |
| Operating Temperature Range | -55 to 150 |
| Rated Wattage | 0.5 W (at ambient temperature from -55 to 70 ) |
| Rated Voltage Formula | E(PR) (E: Rated voltage [V], P: Rated wattage [W], R: Nominal resistance []) |
| Weight | 0.004 g (typical) |
| Dimensions (L x W x t) | 2 0.2 mm x 1.25 0.2 mm x 0.3 0.1 mm |
| Terminal Plating | Ni under plated, Sn surface plated |
| Taping Quantity | 5 000 pcs. / reel |
| Packaging | Reel packaged in a box (dimensions vary by number of reels) |
| Storage Condition | Guaranteed for one year in standard state (15-35 , 25-75 % RH). Avoid dusty, harmful gas environments. |
Characteristics and Test Methods
| No. | Items | Characteristics | Test Method |
|---|---|---|---|
| 1 | Resistance | Within 1.0 % (Class F) | Measurement current; 1 A measured at 25 |
| 2 | Temperature coefficient of resistance | Within 100 ppm/ | Standard temperature; 25 , measured temperature; 150 |
| 3 | Short-time overload | Resistance change; within 0.5 % | Applied electric power equal to 3 times rated power in 5 s. JIS C 5201-1 4.13 |
| 4 | Insulation resistance | Over 109 | Measured at terminals and center of resistor by d.c.100 V15 V in 1 min. JIS C 5201-1 4.6 |
| 5 | Dielectric withstanding voltage | Without breakdown | Applied at terminals and center of resistor on a.c. 100V, 1min. JIS C 5201-1 4.7 |
| 6 | Resistance to soldering heat | Resistance change; within 0.5 %; No remarkable outward damage | Copper sheet temperature; 260 5 , Duration; 5 s0.5 s |
| 7 | Solder-ability | Over 95 % coverage | Solder temperature; 245 5 , Duration of immersion; 3 s0.5 s. JIS C 5201-1 4.17 |
| 8 | Vibration | Resistance change; within 0.5 %; No remarkable outward damage | Vibration frequency range; 10 Hz to 55 Hz, Peak to peak amplitude; 1.5 mm. XYZ 3-direction each 2 h. JIS C 5201-1 4.22 |
| 9 | Resistance to solvent | No remarkable outward damage | Solvent; Isopropyl alcohol, Temperature; 20 to 25 , Duration of immersion; 60 s5 s |
| 10 | High temp. exposure | Resistance change; within 2.0 % | Temperature; 150 2 , Bias load; 0 % power. Duration; 1 000 h. JIS C 5201-1 4.23.2 |
| 11 | Change of temperature | Resistance change; within 0.5 %; No remarkable outward damage | -55 3 (30 min.)/normal temp. (2 to 3 min.) /150 2 (30 min.)/normal temp.(2 to 3 min.). Number of cycles; 5 cycles |
| 12 | Moisture resistance | Resistance change; within 1.0 % | MIL-STD-202, method 106 (7a and 7b not required), 1cycle=24 h, 10 cycles |
| 13 | Bias humidity | Resistance change; within 1.0 % | Temperature; 85 2 , Relative humidity; 85 %. 10 %-bias load; on time 90 min./off time 30 min. Duration; 1 000 h |
| 14 | Endurance (Rated load) | Resistance change; within 2.0 % | Temperature;70 3 . Rated wattage; 90 min ON, 30 min OFF. Duration; 1 000 h. |
Notice for Application
Circumstance: Avoid corrosive circumstances (Ammonium, Sulfur, Halogenic gases) that can erode solder plating and cause open circuits.
Soldering Iron Operation: Apply soldering iron slowly. Tip temperature below 310 , time within 3 s. each. Limit application to the same point to 2 times.
Reflow Soldering: Pre-heat 140 to 180 for 60 to 120 s. Reflow peak temperature 2555 for a maximum of 5 s. Maximum 2 times.
Positioning: Lay out products to minimize impact from board bend or deflection. Avoid installation near dividing lines or prone to strains.
Coating Treatment: Resin burying or coating may significantly change resistance. Check material before use.
Thermal Effect Design: Confirm thermal effects in using conditions as resistors are heat-up parts.
Others
Power Derating: Consider self-fever, ambient temperature, and heat influence from other parts. Apply sufficient load derating for long-term stable use.
Shock to the Resistor: Adjust surface mounter settings to avoid damaging the resistor. Avoid dropping.
Solder Mask and Solder Volume: Product may float on solder if solder volume is excessive, leading to higher resistance. Recommended solder mask thickness is approximately 0.1 mm.
General Use: Products are designed for general standard use in electronic equipment. For critical applications (transportation, medical, aerospace, etc.), design fail-safe systems and ensure safety measures.
2410121643_HDK-LR20R003FE_C128540.pdf
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