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Quality Electronic Component HELE X3S032000LK1H-Z Quartz Crystal Unit 32 MHz Frequency for Precision Devices factory
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Quality Electronic Component HELE X3S032000LK1H-Z Quartz Crystal Unit 32 MHz Frequency for Precision Devices factory
>
Specifications
Normal temperature Frequency Tolerance:
±8ppm
Frequency Stability:
±12ppm
Load Capacitance:
20pF
Operating Temperature:
-30℃~+85℃
Frequency:
32MHz
Mfr. Part #:
X3S032000LK1H-Z
Package:
SMD3225-4P
Key Attributes
Model Number: X3S032000LK1H-Z
Product Description

Product Overview

The HSX321S is a quartz crystal unit manufactured by HARMONY ELECTRONICS CORP. Designed for various product applications, this crystal operates at a nominal frequency of 32.000MHz. It features a holder type of HSX321S and is built with an alumina ceramic base and a Fe-Ni-Co lid. The HSX321S is suitable for applications requiring stable frequency and reliable performance, with specifications covering electrical characteristics, mechanical robustness, and environmental resistance. It is available in tape and reel packaging for automated assembly.

Product Attributes

  • Brand: HARMONY ELECTRONICS CORP.
  • Product Type: Quartz Crystal Unit
  • Model: HSX321S
  • Country of Origin: TAIWAN
  • Manufacturing Locations: THAILAND, CHINA
  • Base Material: Alumina Ceramic (Al2O3)
  • Lid Material: Fe-Ni-Co
  • Marking: Laser marking (Logo, Nominal Frequency, Manufactured year & month)
  • Moisture Sensitivity Level: Level 1

Technical Specifications

Specification Details Reference Page
Nominal Frequency 32.000000MHz 3
Holder Type HSX321S 3
Frequency Tolerance +/-8 ppm at 25C +/-3C 3
Equivalent Resistance 50 ohms Max. / SERIES 3
Storage Temperature Range -40C To +85C 3
Operable Temperature Range -30C To +85C 3
Temperature Drift +/-12ppm (-30C To +85C) 3
Loading Capacitance (CL) 20.0pF 3
Drive Level 10 W (100W Max) 3
Shunt Capacitance 2.0 pF Max 3
Insulation Resistance More than 500M ohms at DC 100V 3
Mode of Oscillation Fundamental 3
Shock Test (Dropping) 75 cm height, 3 times on firm wood. Frequency variation < +/-5 ppm, Resistance variation < +/-15% or 2ohms max. 3, 10
Aging Less than +/-3 ppm/Year 3
Holder Seam Type HSX321S 3
Dimensions and Marking Refer to page 4 3, 4
Emboss Carrier Tape & Reel Refer to pages 6 and 7 3, 6, 7, 8, 9
Mechanical Performance - Natural Drop Drop 3 times from 75cm onto hard wooden board. 10
Mechanical Performance - Vibration 10-55Hz, 0.8mm amplitude (X, Y, Z axes), 120min per direction. 10
Mechanical Performance - Sealing Tightness Leak Rate 1.0x10 Pa-m/sec. Max. (Helium leak detector) 10
Mechanical Performance - Solderability Dipped in solder bath at 245C+/-5C for 3+/-0.5 sec after applying ROSIN Flux. 10
Mechanical Performance - Substrate Bending Board bent to 3mm, held for 5 1 sec. 10
Mechanical Performance - Adhesion Pressure: 5N for 10+/-1 sec. 10
Mechanical Performance - Body Strength Pressure: 10N for 10+/-1 sec. 10
Environmental Performance - Humidity 60C +/-2C, 90~95% RH, 240 hours. 11
Environmental Performance - Storage in Low Temperature -40C +/-2C, 240 hours. 11
Environmental Performance - Storage in High Temperature +85C +/-2C, 240 hours. 11
Environmental Performance - Temperature Cycles -40C (30min) +85C (30min), 25 cycles. 11
Soldering Condition (Reflow) Preheat: 160~180C (120sec), Primary heat: 220C (60sec), Peak: 260C (10sec Max). Available for Lead Free Soldering. 12
Soldering Condition (Solder Iron) Bit temp.: 350C max., Time: 3sec max. 12
Standard Packing Quantity 3,000 PCS / REEL 7
Carrier Tape Material PS Conductive 7
Top Tape Material Polyester 7
Cover Tape Release Strength 0.1N to 0.7N (Pulling direction 165 to 180, Speed 300mm/min) 8

2410121317_HELE-X3S032000LK1H-Z_C254295.pdf

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