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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±10ppm
Operating Temperature:
-30℃~+85℃
Load Capacitance:
8pF
Equivalent Series Resistance(ESR):
100Ω
Frequency:
16MHz
Mfr. Part #:
X2C016000B81H-R
Package:
SMD2016-4P
Key Attributes
Model Number:
X2C016000B81H-R
Product Description
Product Overview
The HARMONY ELECTRONICS CORP. HSX211S is a quartz crystal unit designed for electronic applications. It operates at a nominal frequency of 16.000 MHz and offers precise frequency tolerance. This component is suitable for a range of operating temperatures and is built with a robust construction for mechanical and environmental endurance.
Product Attributes
- Brand: HARMONY ELECTRONICS CORP.
- Model: HSX211S
- Country of Origin: TAIWAN / CHINA / THAILAND
- Moisture Sensitivity Level: Level 1
- Certifications: ROHS Compliant, Green Product
Technical Specifications
| Specification | Details |
|---|---|
| Nominal Frequency | 16.000000 MHz |
| Holder Type | HSX211S |
| Frequency Tolerance | +/-10 ppm at 25deg.C +/-3deg.C |
| Equivalent Resistance | 200 ohms Max. / SERIES |
| Storage Temperature Range | -40 deg.C To +85 deg.C |
| Operable Temperature Range | -20 deg.C To +75 deg.C |
| Temperature Drift | +/-10 ppm (-20 deg.C To +75 deg.C) |
| Loading Capacitance (CL) | 8.0 pF |
| Drive Level | 10 W (100uW Max) |
| Shunt Capacitance | 2.0 pF Max |
| Insulation Resistance | More than 500M ohms at DC 100V |
| Mode of Oscillation | Fundamental |
| Aging | Less than +/- 3 ppm/Year |
| Holder Type | HSX211S Seam type |
| Standard Packing Quantity | 3,000 PCS / REEL |
| Tape Material | Carrier tape: PS, Conductive Top tape: Polyester |
| Cover Tape Release Strength | 0.1N to 0.7N (Pulling direction 165 to 180, Speed 300mm/min) |
| Mechanical Drop Test | Dropping from 120 cm height 3 times on Concrete floor |
| Vibration Test | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 120min. to each direction. |
| Sealing Tightness | Leak Rate 1.0x10-8 Pa-m3/sec. Max. (Helium leak detector) |
| Solderability Test | Dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec. |
| Substrate Bending Test | 3 mm deflection for 5 1 sec. |
| Adhesion Test | 5N for 10+/-1 sec. |
| Body Strength Test | 10N for 10+/-1sec. |
| Humidity Test | 60+/-2, RH 90~95%, Duration of 240 hours. |
| Low Temperature Storage Test | -40deg.C +/-2deg.C, Duration of 240 hours. |
| High Temperature Storage Test | +85deg.C +/-2deg.C, Duration of 240 hours. |
| Temperature Cycles Test | -40deg.C +/-2deg.C (30min) +85deg.C +/-2deg.C (30min), 25 cycles. |
| Reflow Soldering Condition (Preheat) | 160~180 deg.C, 120sec. |
| Reflow Soldering Condition (Primary Heat) | 220 deg.C, 60sec. |
| Reflow Soldering Condition (Peak) | 260 deg.C, 10sec. Max. |
| Solder Iron Condition | Bit temp.:350 max., Time:3sec max. |
2410121435_HELE-X2C016000B81H-R_C254300.pdf
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