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Quality Electronic Equipment Crystal Oscillator 26 Megahertz Frequency HD 83026000301 with SMD 3.2x2.5 Package factory
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Quality Electronic Equipment Crystal Oscillator 26 Megahertz Frequency HD 83026000301 with SMD 3.2x2.5 Package factory
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Specifications
Frequency:
26MHz
Mfr. Part #:
83026000301
Package:
SMD3225-4P
Key Attributes
Model Number: 83026000301
Product Description

Product Overview

This specification applies to the RoHS crystal oscillator with a frequency of 26.000 MHz, designed for use in electronic equipment. It features a SMD 3.2x2.5 package and CMOS output waveform, with a frequency stability of 50ppm and an operating temperature range of -40 to +85C. The oscillator is suitable for general electronic applications and is not recommended for safety-critical applications.

Product Attributes

  • Brand: JIANGSU HD-CRYSTAL TECHNOLOGY CO., LTD
  • Origin: China
  • Certifications: RoHS

Technical Specifications

ItemSpecificationNominal FrequencyFrequency StabilityAgingOperating Temperature RangeStorage Temperature RangeInput Voltage (VDD)Input Current (IDD)Output WaveformOutput SymmetryRise/Fall TimeOutput Voltage VOL:VOHOutput LoadOutput State ControlStart-up TimeStandby CurrentPhase Jitter (rms)Oscillation Mode
SMD 3.2x2.5 XOSMD3225-4 Crystal Oscillator26.000 MHz50ppm (incl. 25C tolerance, tolerance over operating temperature range, input voltage change, load change, 1 year aging)3ppm/year-40 to +85C-55 to +125C+3.3Vdc10%10mA maxCMOS5010%8ns max10%VDD 90%VDD15pFEnable/disable510ms max10A max1ps rms max (12kHz to 20MHz)Fundamental

Reliability Specifications

ItemTest MethodSpecificationProcedure
Low Temperature StorageGB/T 2423.1-2001, Method AaFrequency change after test 5ppm.Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours.
HumidityGB/T 2423.3- 2006, Method CabFrequency change after test 5ppm.Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours.
High Temperature StorageGB/T 2423.2-2001, Method BaFrequency change after test 5ppm.Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours.
Temperature CycleGB/T 2423.22-2002, Method NbFrequency change after test 5ppm.10 cycles from -55C to 125C. Measurement taken after DUT being left at room temperature for 242 hours.
VibrationGB/T 2423.10- 1995, Method FcFrequency change after test 5ppm.Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour.
ShockGB/T 2423.5-1995, Method EaFrequency change after test 5ppm.Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles / direction, total 18 cycles. Measurement taken after 1 hour.
SolderabilityGB/T 2423.28-2005, Method TcTerminals shall be covered more then 95% with solder.In 245 5 solder bath for 2 0.5 seconds. There is no need to do functioned test.
Resistance to Soldering HeatGB/T 2423.28-2005, Test Tb Method 1BFrequency change after test 5ppm. No visible damages.Passed through the re-flow oven under the following condition. Preheat to 150C5C for 60 to 120sec,and peak 265C5C for 10s3sec.Measurement taken after DUT being left at room temperature for at 242 hours.
DropGB/T 2423.8-1995, Method EdNo visible damages.Free drop to the wooden plate from 1.0 m heights for 3 times.
Terminal StrengthJIS-C- 6429 Method 1 & 2No visible damageMount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60 seconds. 8-12X magnifier.

2409302231_HD-83026000301_C5272982.pdf

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