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Specifications
Power(Watts):
125mW
Resistance:
100kΩ
Voltage Rating:
150V
Temperature Coefficient:
±100ppm/℃
Operating Temperature:
-55℃~+155℃
Type:
Thick Film Resistor
Tolerance:
±1%
Mfr. Part #:
GR0805F100KT5G00
Package:
0805
Key Attributes
Model Number:
GR0805F100KT5G00
Product Description
Product Overview
The GiantOhm GR Series General Purpose Thick Film Chip Resistors are designed with advanced thick film technology, offering tiny and lightweight components with high reliability. These RoHS compliant resistors are compatible with both reflow and wave soldering, making them versatile for various manufacturing processes. With an MSL class of MSL 1, they are suitable for a wide range of applications including home appliances, telecommunications, smart wearables, computers and peripherals, and instruments and meters.
Product Attributes
- Brand: GiantOhm
- Series: GR Series
- Technology: Thick Film
- Compliance: RoHS compliant
- Moisture Sensitivity Level: MSL 1
- Soldering Compatibility: Reflow and wave soldering
Technical Specifications
| Series | Size | Rated Power | Max. Working Voltage (MWV) | Max. Overload Voltage (MOV) | Dielectric Withstanding Voltage (DWV) | Max. Rated Current (MRC) | Max. Overload Current (MOC) | Resistance Value Range (0.5%) | Resistance Value Range (1%) | Resistance Value Range (5%) | Jumper Resistance | Operating Temperature Range |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GR0105 | 0105 | 1/32W | 15V | 30V | - | 0.5A | 1A | 10-10M | 1-10M | - | < 50m | -55 to +125 |
| GR0201 | 0201 | 1/20W | 25V | 50V | - | 0.5A | 1A | 1-10M | 1-10M | - | < 50m | -55 to +155 |
| GR0402 | 0402 | 1/16W | 50V | 100V | 100V | 1A | 2A | 1-10M | 1-22M | 1-22M | < 50m | -55 to +155 |
| GR0603 | 0603 | 1/10W | 75V | 150V | 300V | 1A | 2A | 1-10M | 1-22M | 1-100M | < 50m | -55 to +155 |
| GR0805 | 0805 | 1/8W | 150V | 300V | 500V | 2A | 5A | 1-10M | 1-22M | 1-100M | < 50m | -55 to +155 |
| GR1206 | 1206 | 1/4W | 200V | 400V | 500V | 2A | 10A | 1-10M | 1-22M | 1-100M | < 50m | -55 to +155 |
| GR1210 | 1210 | 1/2W | 200V | 500V | 500V | 2A | 10A | 1-10M | 1-22M | 1-100M | < 50m | -55 to +155 |
| GR1812 | 1812 | 3/4W | 200V | 500V | 500V | 2A | 10A | 1-10M | 1-22M | 1-100M | < 50m | -55 to +155 |
| GR2010 | 2010 | 3/4W | 200V | 500V | 500V | 2A | 10A | 1-10M | 1-22M | 1-100M | < 50m | -55 to +155 |
| GR2512 | 2512 | 1W | 200V | 500V | 500V | 2A | 10A | 1-10M | 1-22M | 1-100M | < 50m | -55 to +155 |
| Type | L (mm) | W (mm) | H (mm) | A (mm) | B (mm) |
|---|---|---|---|---|---|
| 0105 | 0.400.02 | 0.200.02 | 0.130.02 | 0.100.03 | 0.100.03 |
| 0201 | 0.600.03 | 0.300.03 | 0.230.03 | 0.100.05 | 0.150.05 |
| 0402 | 1.000.10 | 0.500.05 | 0.350.05 | 0.200.10 | 0.250.10 |
| 0603 | 1.600.10 | 0.800.10 | 0.450.10 | 0.300.20 | 0.300.20 |
| 0805 | 2.000.15 | 1.250.15 | 0.550.10 | 0.400.20 | 0.400.20 |
| 1206 | 3.100.15 | 1.550.15 | 0.550.10 | 0.450.20 | 0.450.20 |
| 1210 | 3.100.10 | 2.600.20 | 0.550.10 | 0.500.25 | 0.500.20 |
| 1812 | 4.500.20 | 3.200.20 | 0.550.20 | 0.500.20 | 0.500.20 |
| 2010 | 5.000.10 | 2.500.20 | 0.550.10 | 0.600.25 | 0.500.20 |
| 2512 | 6.350.10 | 3.200.20 | 0.550.10 | 0.600.25 | 0.500.20 |
| Item | Test Method | Acceptable Criterion |
|---|---|---|
| Temperature Coefficient of Resistance (T.C.R.) | IEC 60115-1 6.2 | GR0105: 1R10: -200~+600PPM/, 10R100: 300PPM/, 100: 200PPM/ GR0201: 1R10: -100~+350PPM/, 10: 200PPM/ GR0402~2512: 1R10: 200PPM/C, 10 R10M: 100PPM/C, 10MR22M: 200PPM/C, 22MR100M: 300PPM/C |
| Insulation Resistance | IEC 60115-1 12.1.3.5 | 109 |
| Dielectric Withstanding Voltage | IEC 60115-1 12.2.4 | Test to confirm if the presence of current or arc breakdown by 10uA |
| Short Time Over Load | IEC 60115-1 8.1.4.2 | 1% seriesR/R=(1.0%+0.05), 5% seriesR/R=(2.0%+0.05), 0105R/R=(2.0%+0.05), Jumper< 50m |
| Intermittent Overload | IEC 60115-1 8.4.4 | R/R=(5.0%+0.05), Jumper< 50m |
| Resistance to Solvent | IEC 60115-1 11.3.2 method1 | No obvious damage, peeling, swelling phenomenon |
| Solderability | J-STD-002 & IEC 60115-1 11.1.4.3 | 1. Solder coverage over 95%, 2. No more than 5% of the partially exposed substrate, non-wetted plating or ceramic substrate part. |
| Resistance to Soldering Heat | IEC 60115-1 11.2.4.3& MIL-STD-202 Method 210 | R/R=(1.0%+0.05), Jumper< 50m |
| Thermal Shock | IEC 60115-1 10.1.4 | R/R=(1.0%+0.05), Jumper< 50m |
| Solder Joint Endurance Test | IEC 60115-1 9.8.4 | R/R=(1.0%+0.05), Jumper< 50m |
| Resistance to Dry Heat | IEC 60115-1 7.3 | 1% seriesR/R=(1.0%+0.05), 5% seriesR/R=(3.0%+0.05), 0105R/R=(3.0%+0.05), Jumper< 50m |
| Loading Life in Moisture | IEC 60115-1 10.4 | 1% seriesR/R=(1.0%+0.05), 5% seriesR/R=(3.0%+0.05), 0105R/R=(3.0%+0.05), Jumper< 100m |
| Load Life | IEC 60115-1 7.1 | 1% seriesR/R=(1.0%+0.05), 5% seriesR/R=(3.0%+0.05), 0105R/R=(3.0%+0.05), Jumper< 100m |
| Low temperature load test | IEC 60115-1 10.2.4 | 1% seriesR/R=(1.0%+0.05), 5% seriesR/R=(2.0%+0.05), 0105R/R=(2.0%+0.05), Jumper< 50m |
| Shear force test | IEC 60115-1 9.7 | Without visible damage. |
| Type | A (mm) | B (mm) | C (mm) |
|---|---|---|---|
| 0105 | 0.2 | 0.5 | 0.2 |
| 0201 | 0.3 | 1.0 | 0.4 |
| 0402 | 0.5 | 1.5 | 0.6 |
| 0603 | 0.8 | 2.1 | 0.9 |
| 0805 | 1.2 | 3.0 | 1.3 |
| 1206 | 2.2 | 4.2 | 1.6 |
| 1210 | 2.2 | 4.2 | 2.8 |
| 1812 | 3.1 | 5.9 | 3.0 |
| 2010 | 3.5 | 6.1 | 2.8 |
| 2512 | 3.8 | 8.0 | 3.5 |
| Type or Size | A0.2 (mm) | B0.2 (mm) | C0.05 (mm) | D0 +0.1 (mm) | E0.1 (mm) | F0.05 (mm) | G0.1 (mm) | W0.2 (mm) | T0.1 (mm) | |
|---|---|---|---|---|---|---|---|---|---|---|
| Carrier Taping A 0105 | 0.24 | 0.45 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.40 | |
| Carrier Taping A 0201 | 0.40 | 0.70 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.47 | |
| Carrier Taping A 0402 | 0.67 | 1.17 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.47 | |
| Carrier Taping B 0603 | 1.10 | 1.90 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.67 | |
| Carrier Taping B 0805 | 1.65 | 2.40 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.81 | |
| Carrier Taping B 1206 | 1.90 | 3.45 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.81 | |
| Carrier Taping B 1210 | 2.85 | 3.50 | 2.0 | 1.5 | 1.75 | 3.5 | 4.0 | 8.0 | 0.81 | |
| Embossed Taping 2010 | 2.90 | 5.60 | 2.00 | 1.50 | 1.50 | 1.75 | 5.50 | 4.00 | 12.00 | 1.00 |
| Embossed Taping 1812 | 3.50 | 4.80 | 2.00 | 1.50 | 1.50 | 1.75 | 5.50 | 4.00 | 12.00 | 1.00 |
| Embossed Taping 2512 | 3.50 | 6.70 | 2.00 | 1.50 | 1.50 | 1.75 | 5.50 | 4.00 | 12.00 | 1.00 |
| Type | SPQ | PCS/Rl. | A0.5 (mm) | B0.5 (mm) | C0.5 (mm) | D1 (mm) | M2 (mm) | W1 (mm) |
|---|---|---|---|---|---|---|---|---|
| 0105 | 20,000 | 20,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 0201 | 15,000 | 15,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 0402 | 10,000 | 10,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 0603 | 5,000 | 5,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 0805 | 5,000 | 5,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 1206 | 5,000 | 5,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 1210 | 5,000 | 5,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 10.0 |
| 1812 | 4,000 | 4,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 13.8 |
| 2010 | 4,000 | 4,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 13.8 |
| 2512 | 4,000 | 4,000 | 2.0 | 13.0 | 21.0 | 60.0 | 178.0 | 13.8 |
| Size of chip resistors | Adhesive force limit |
|---|---|
| 0105, 0201 | 6~30gf |
| 0402 | 10~40gf |
| 0603 and above | 10~70gf |
2508041620_GiantOhm-GR0805F100KT5G00_C49652969.pdf
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