FRC-Series Thick Film Chip Resistor

The FRC-Series Thick Film Chip Resistor is a compact and lightweight component designed for high reliability and quality. It finds extensive application in various electronic devices, including entertainment systems, appliances, computers, communication equipment, power supplies, illumination, and measuring instruments.

Product Attributes

Brand: FOJAN
Product Type: Thick Film Chip Resistor
Material: Ceramic substrate (Al2O3), Conductive layer (Ag), Resistive layer (RuO2+ glass), Outer Protective layer (Epoxy), Plating (Ni/Sn)

Technical Specifications

Type	Rated Power (at 70)	Max. Working Voltage (RCWV)	Max. Overload Voltage	T.C.R. (PPM/)	Resistance Range	Dimensions (L x W x H) mm
0201	1/20W	25V	50V	400 (1~10) 200 (10~10M)	1~10M	0.600.03 x 0.300.03 x 0.230.03
0402	1/16W	50V	100V	200 (1~10) 100 (10~10M) 200 (10M~22M)	1~22M	1.000.05 x 0.500.05 x 0.350.05
0603	1/10W	75V	150V	200 (1~10) 100 (10~10M) 200 (10M~22M)	1~22M	1.600.10 x 0.800.10 x 0.450.10
0805	1/8W	150V	300V	200 (1~10) 100 (10~10M) 200 (10M~22M)	1~22M	2.000.10 x 1.250.10 x 0.500.10
1206	1/4W	200V	400V	200 (1~10) 100 (10~10M) 200 (10M~22M)	1~22M	3.100.10 x 1.600.10 x 0.550.10
1210	1/2W	200V	400V	200 (1~10) 100 (10~10M) 200 (10M~22M)	1~22M	3.100.10 x 2.500.15 x 0.550.10
1218	1W	200V	500V	200 (1~10) 100 (10~1M)	1~1M	3.100.10 x 4.600.10 x 0.550.10
1812	3/4W	200V	400V	200 (1~10) 100 (10~10M)	1~10M	4.500.20 x 3.100.20 x 0.550.10
2010	3/4W	200V	400V	200 (1~10) 100 (10~10M) 200 (10M~22M)	1~22M	5.000.10 x 2.500.15 x 0.550.10
2512	1W	200V	400V	200 (1~10) 100 (10~10M) 200 (10M~22M)	1~22M	6.350.10 x 3.100.15 x 0.550.10

Item	Test Method	Test Condition	Specification
Temperature Coefficient	JIS C 5201 4.8 / IEC60115-1-4.8	TCR=R-R0/t-t0R0 10ppm R0: resistance at room temperature, R: resistance at 125 or -55, t0: room temperature, t: test temperature (125 or -55)	As SPEC
Short-time overload	JIS C 5201 4.13 / IEC60115-1-4.13	Applied 2.5 times of rated voltage for 5 seconds. Measure the variation of resistance.	0.5%, 1%: (1.0%+0.05) 5%: (2.0%+0.05)
Solderability	JIS C 5201 4.17 / IEC60115-1-4.17	Dip the terminal in a flux and then dip into a soldering bath at 2455 for 30.5sec.	95% coverage
Resist to soldering heat	JIS C 5201 4.18 / IEC 60115-1-4.18	Dip the terminal in a flux and then dip into a soldering bath at 2605 for 10 0.5sec. Measure the variation of resistance.	(1.00% +0.05)
Insulation resistance	JIS C 5201 4.6 / IEC60115-1-4.6	Applied the dielectric withstanding voltage on the center of body for 605 seconds. Then measure insulation resistance.	>10G
Dielectric withstanding voltage	JIS C 5201 4.7 / IEC60115-1-4.7	Applied the dielectric withstanding voltage on the center of body for 605 seconds.	No evidence of flashover, arcing or insulation breakdown
Terminal bending	JIS C 5201 4.33 / IEC60115-1-4.33	Specimen shall be mounted on test board, then bend the board and maintained for 201s. Bending distance: 5+0.2/0 mm (size 1206) or 2+0.2/0 mm (size > 1206). Measure the variation of resistance.	(1.00% +0.05)
Rapid temperature changes	JIS C 5201 4.19 / IEC60115-1-4.19	Put specimen in a chamber: T1: -553; T2: 1553 / 1253, 30min, repeated 300 cycles. Measure the variation of resistance.	0.5%, 1%: (1.0%+0.05) 5%: (2.0%+0.05)
Humidity	JIS C 5201 4.24 / IEC60115-1-4.24	Constant temperature and humidity chamber: Temp 402, Humidity 90~95 %RH; Applied rated voltage for 1.5 hours, power off for 0.5 hours; Repeat power on/off for 1000 +48/-0 hours. Measure the variation of resistance.	0.5%, 1%: (1.0%+0.05) 5%: (2.0%+0.05)

2510101005_FOJAN-FRC1206J105-TS_C2907441.pdf

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