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Quality Ceramic chip inductors FH VHF100505HQ5N6ST with Ni Sn plating providing performance and durability factory
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Quality Ceramic chip inductors FH VHF100505HQ5N6ST with Ni Sn plating providing performance and durability factory
>
Specifications
Current Rating:
200mA
Inductance:
5.6nH
Frequency - Self Resonant:
4GHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
1.4Ω
Type:
Multilayer Inductor;High-frequency Inductor
Ratings:
-
Q @ Frequency:
8@100MHz
Mfr. Part #:
VHF100505HQ5N6ST
Package:
0402
Key Attributes
Model Number: VHF100505HQ5N6ST
Product Description

Product Overview

The VHF100505HQ Series Chip High Frequency Inductors are designed for demanding electronic applications. These multilayer ceramic inductors offer precise inductance values and reliable performance across a wide temperature range. They are suitable for various applications requiring high-frequency filtering and impedance matching. The series is manufactured with advanced ceramic technology and features Ni/Sn plating for excellent solderability and durability.

Product Attributes

  • Product Type: Chip high frequency inductors
  • Series: VHF100505HQ
  • Material: Ceramic system (Al2O3)
  • Inner Electrode Material: Pure Silver (Ag)
  • Terminal Electrode Material: Silver (Ag) layer with Ni/Sn plating
  • Plating: Ni/Sn
  • RoHS Compliance: "Unitary lead free" products indicate compliance with RoHS directive.

Technical Specifications

Part NO. Inductance (nH) Q Value (min) DCR () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max
VHF100505HQ1N0T 1.0 8 0.06 100 50 10000 1000
VHF100505HQ1N1T 1.1 8 0.07 100 50 10000 1000
VHF100505HQ1N2T 1.2 8 0.07 100 50 10000 1000
VHF100505HQ1N3T 1.3 8 0.07 100 50 10000 1000
VHF100505HQ1N5T 1.5 8 0.08 100 50 6000 1000
VHF100505HQ1N6T 1.6 8 0.08 100 50 6000 1000
VHF100505HQ1N8T 1.8 8 0.08 100 50 6000 900
VHF100505HQ2N0T 2.0 8 0.09 100 50 6000 900
VHF100505HQ2N2T 2.2 8 0.09 100 50 6000 900
VHF100505HQ2N4T 2.4 8 0.10 100 50 6000 800
VHF100505HQ2N7T 2.7 8 0.12 100 50 6000 800
VHF100505HQ3N0T 3.0 8 0.12 100 50 6000 800
VHF100505HQ3N3T 3.3 8 0.13 100 50 6000 800
VHF100505HQ3N6T 3.6 8 0.15 100 50 4000 700
VHF100505HQ3N9T 3.9 8 0.16 100 50 4000 700
VHF100505HQ4N3T 4.3 8 0.16 100 50 4000 700
VHF100505HQ4N7T 4.7 8 0.16 100 50 4000 700
VHF100505HQ5N1T 5.1 8 0.16 100 50 4000 600
VHF100505HQ5N6T 5.6 8 0.20 100 50 4000 600
VHF100505HQ6N2T 6.2 8 0.20 100 50 3900 600
VHF100505HQ6N8T 6.8 8 0.20 100 50 3900 600
VHF100505HQ7N5T 7.5 8 0.24 100 50 3700 500
VHF100505HQ8N2T 8.2 8 0.24 100 50 3600 500
VHF100505HQ9N1T 9.1 8 0.26 100 50 3400 500
VHF100505HQ10NT 10 8 0.26 100 50 3200 500
VHF100505HQ12NT 12 8 0.50 100 50 2700 400
VHF100505HQ15NT 15 8 0.50 100 50 2300 400
VHF100505HQ18NT 18 8 0.60 100 50 2100 350
VHF100505HQ20NT 20 8 0.60 100 50 2000 350
VHF100505HQ22NT 22 8 0.60 100 50 1900 350
VHF100505HQ27NT 27 8 0.70 100 50 1600 300
VHF100505HQ33NT 33 8 0.80 100 50 1300 300
VHF100505HQ39NT 39 8 1.00 100 50 1200 250
VHF100505HQ43NT 43 8 1.10 100 50 1100 250
VHF100505HQ47NT 47 8 1.10 100 50 1000 250
VHF100505HQ56NT 56 8 1.20 100 50 750 200
VHF100505HQ68NT 68 8 1.40 100 50 750 200
VHF100505HQ82NT 82 8 1.60 100 50 750 200
VHF100505HQR10T 100 8 2.00 100 50 700 200
VHF100505HQR12T 120 8 2.50 100 50 600 150
VHF100505HQR15T 150 8 3.00 100 50 550 150
VHF100505HQR18T 180 8 3.50 100 50 500 150
VHF100505HQR22T 220 8 3.70 100 50 450 100
VHF100505HQR27T 270 8 4.50 100 50 400 100
VHF100505HQR33T 330 6 5.00 50 50 350 80
Size L (mm) W (mm) T (mm) L1 (mm) W (mm)
100505 1.00.15 0.50.15 0.50.15 0.250.1 0.50.15
Inductance Tolerance:
  • Ls 6.2nH: B (0.1nH), C (0.2nH), S (0.3nH)
  • Ls > 6.2nH: G (2%), H (3%), J (5%)
Note: VHF100505HQ series products have no compensation value; the product test center value equals the nominal value.
Reliability Testing Items:
Item Requirements Test Methods and Remarks
Operating Temperature Range -55+125
Solder ability At least 95% of terminal electrode should be covered with solder. Preheating temperature: 120 ~ 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s
Resistance to Soldering Heat At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: HQ: 10%, Q value change (ceramic): 20% Preheating temperature: 120 ~ 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s
Adhesion of electrode The termination and body should be no damage. Applied force: 5N for 1005 series. Keep time: 101S
Low temperature resistance No mechanical damage. Inductance change: 10%, Q value change (ceramic): 20% Temperature: -552, Testing time: 1000+240/-0 h
Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate, Curvature: 2mm, Hold time: 20s1s, Compression speed: 0.5mm/s
Vibration No mechanical damage. Inductance change: 10%, Q value change (ceramic): 20% Amplitude: 1.5mm, Test time: 2h in each of 3 mutually perpendicular directions, Frequency range: 10Hz to 55Hz to 10Hz (1 minute)
High temperature resistance No mechanical damage. Inductance change: 10%, Q value change (ceramic): 20% Temperature: 1252, Testing time: 1000+240/-0 h
Static Humidity No mechanical damage. Inductance change: 10%, Q value change (ceramic): 20% Humidity: 90% to 95% RH, Temperature: 602, Testing time: 1000+240/-0 h
High temperature load No mechanical damage. Inductance change: 10%, Q value change (ceramic): 20% Impose current: rated current, Temperature: 1252, Testing time: 1000+240/-0 h
Temperature Shock No mechanical damage. Inductance change: 10%, Q value change (ceramic): 20% Temperature: -55 for 303min +125 for 303min, Number of cycles: 100
Note: After testing, items concerning electrical performance should be tested after 242hrs of recovery under standard conditions.
Packaging:
  • Taping Dimensions: 8mm tape width, 4mm pitch.
  • Reel Dimensions: 1782.0mm (A), 22.02.0mm (B), 12.51.5mm (C), 572.0mm (N), 8mm (G).
  • Peeling Force: 0.1N0.7N (pulling in the direction of arrow), Speed: 300mm/min.
  • Packaging Quantity: 10000 Pcs/REEL, 100000 Pcs/BOX, 600000 Pcs/CASE (for 100505 size).
Recommended Soldering Conditions:
  • Reflow Soldering: Temperature difference between solder and ferrite surface should be limited to 150 max during pre-heating. Temperature difference during cooling into solvent after soldering should be limited to 100 max.
  • Hand Soldering: Soldering Iron Temperature: 350 (Max), Power: 30W (Max), Soldering Time: < 5S.
Cleaning:
  • Cleaning Temperature: 60 max
  • Cleaning Time: 1 minute min.
  • Ultrasonic Power: 200W max
Storage Requirements:
  • Storage Period: Within 1 year from the factory inspection date. If exceeded, check solderability before use.
  • Storage Conditions: Temperature: -10 to +40, Humidity: 30% to 70% RH. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Products should be airtight packaged.
Usage Of ODS (Ozone Depleting Substances):
The company does not use ODS such as CCl4, HCFC in the production process.
2410121256_FH-VHF100505HQ5N6ST_C395073.pdf
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