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Specifications
Current Rating:
3mA
Inductance:
10uH
Tolerance:
±10%
Frequency - Self Resonant:
17MHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
1.75Ω
Type:
Multilayer Inductor;High-frequency Inductor
Ratings:
-
Q @ Frequency:
20@2MHz
Mfr. Part #:
CMI160808J100KT
Package:
0603
Key Attributes
Model Number:
CMI160808J100KT
Product Description
Product Overview
The CMI160808 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with Ni/Sn plating. They offer a range of inductance values with specified tolerances and electrical characteristics.
Product Attributes
- Product Type: Multilayer Chip Ferrite Inductors
- Series: CMI160808 Series
- Material (Body): Ni-Cu-Zn Ferrite
- Material (Inner Electrode): Pure Silver (Ag)
- Material (Terminal Electrode): Silver (Ag) layer with Ni/Sn plating
- Packaging: Tape & Reel
- Compliance: RoHS (if specified as 'Unitary lead free')
Technical Specifications
| Part NO. | Tolerance (%) | Inductance (H) | Q Value (min) | RDC () max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA) max |
|---|---|---|---|---|---|---|---|---|
| CMI160808V47NKT | 10 | 0.047 | 15 | 0.20 | 50 | 50 | 260 | 50 |
| CMI160808V56NKT | 10 | 0.056 | 15 | 0.20 | 50 | 50 | 260 | 50 |
| CMI160808V68NKT | 10 | 0.068 | 15 | 0.20 | 50 | 50 | 250 | 50 |
| CMI160808V82NKT | 10 | 0.082 | 15 | 0.20 | 50 | 50 | 245 | 50 |
| CMI160808VR10KT | 10 | 0.10 | 20 | 0.25 | 25 | 50 | 240 | 50 |
| CMI160808VR12KT | 10 | 0.12 | 20 | 0.30 | 25 | 50 | 205 | 50 |
| CMI160808VR15KT | 10 | 0.15 | 20 | 0.30 | 25 | 50 | 180 | 50 |
| CMI160808VR18KT | 10 | 0.18 | 20 | 0.30 | 25 | 50 | 165 | 50 |
| CMI160808VR22KT | 10 | 0.22 | 20 | 0.40 | 25 | 50 | 150 | 50 |
| CMI160808VR27KT | 10 | 0.27 | 20 | 0.45 | 25 | 50 | 136 | 50 |
| CMI160808VR33KT | 10 | 0.33 | 20 | 0.50 | 25 | 50 | 125 | 50 |
| CMI160808VR39KT | 10 | 0.39 | 20 | 0.60 | 25 | 50 | 110 | 50 |
| CMI160808VR47KT | 10 | 0.47 | 20 | 0.70 | 25 | 50 | 105 | 50 |
| CMI160808VR56KT | 10 | 0.56 | 20 | 0.70 | 25 | 50 | 95 | 50 |
| CMI160808VR68KT | 10 | 0.68 | 20 | 0.90 | 25 | 50 | 90 | 50 |
| CMI160808VR82KT | 10 | 0.82 | 20 | 1.00 | 25 | 50 | 85 | 50 |
| CMI160808U1R0KT | 10 | 1.0 | 25 | 0.50 | 10 | 50 | 75 | 25 |
| CMI160808U1R2KT | 10 | 1.2 | 25 | 0.55 | 10 | 50 | 65 | 25 |
| CMI160808U1R5KT | 10 | 1.5 | 25 | 0.70 | 10 | 50 | 60 | 25 |
| CMI160808U1R8KT | 10 | 1.8 | 25 | 0.75 | 10 | 50 | 55 | 25 |
| CMI160808U2R2KT | 10 | 2.2 | 25 | 0.80 | 10 | 50 | 50 | 25 |
| CMI160808U2R7KT | 10 | 2.7 | 25 | 0.90 | 10 | 50 | 45 | 15 |
| CMI160808U3R3KT | 10 | 3.3 | 25 | 1.00 | 10 | 50 | 40 | 15 |
| CMI160808U3R9KT | 10 | 3.9 | 25 | 1.30 | 10 | 50 | 35 | 15 |
| CMI160808U4R7KT | 10 | 4.7 | 25 | 1.50 | 10 | 50 | 33 | 15 |
| CMI160808J5R6KT | 10 | 5.6 | 12 | 1.55 | 4 | 50 | 22 | 5 |
| CMI160808J6R8KT | 10 | 6.8 | 12 | 1.55 | 4 | 50 | 20 | 5 |
| CMI160808J8R2KT | 10 | 8.2 | 12 | 1.65 | 4 | 50 | 18 | 5 |
| CMI160808J100KT | 10 | 10 | 20 | 1.75 | 2 | 50 | 17 | 3 |
| CMI160808J120KT | 10 | 12 | 20 | 1.85 | 2 | 50 | 15 | 3 |
| CMI160808J150MT | 20 | 15 | 20 | 2.50 | 1 | 50 | 14 | 1 |
| CMI160808J180MT | 20 | 18 | 20 | 2.70 | 1 | 50 | 13 | 1 |
| CMI160808J220MT | 20 | 22 | 20 | 3.00 | 1 | 50 | 12 | 1 |
Dimensions
| Size | L (mm) | W (mm) | T (mm) | a (mm) |
|---|---|---|---|---|
| 160808 | 1.60.20 | 0.80.20 | 0.80.20 | 0.30.2 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder. | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: V, U: 20%; X: 25%; J: 30%. Q value change (ferrite): within 30%. | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 7N for 1608 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30%. | Temperature: -402; Testing time: 1000 +240 -0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s. |
| 7 | Vibration | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30%. | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30%. | Testing time: 1000 +240 -0 h; Temperature: 852 |
| 9 | Static Humidity | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30%. | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +240 -0 h |
| 10 | High temperature load | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30%. | Impose current: at rated current; Testing time: 1000 +240 -0 h; Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30%. | Temperature: -40 for 303min +85 for 303min; Number of cycles: 32 |
Packaging Information
| Size | Pieces per REEL | Pieces per BOX | Pieces per CASE |
|---|---|---|---|
| 160808 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
Reflow Soldering:
- Pre-heating temperature difference between solder and ferrite surface should not exceed 150.
- Cooling temperature difference after soldering should not exceed 100.
- Products should be soldered within the allowable range indicated by the reflow soldering profile curve.
Iron Soldering:
- Soldering Iron Temperature: 350 (Max)
- Power: 30W (Max)
- Soldering Time: < 5S (Avoid touching terminal electrodes with the iron tip)
Cleaning Conditions
- Cleaning Temperature: 60 (max)
- Cleaning Time: 1 minute (min)
- Ultrasonic Output Power: 200W (max)
Storage Requirements
Storage Period: Within 1 year from the inspection date at the inductor company. If exceeded, solderability must be checked.
Storage Conditions:
- Warehouse Temperature: -10 to +40
- Relative Humidity: 30% to 70%
- Avoid storage in corrosive substances (sulfur, chlorine gas, acid).
- Store on a shelf to prevent influence from humidity and dust.
- Avoid heat shock, vibration, and direct sunlight.
- Products should be stored in airtight packaging.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.
Notes
- If the product is certified as "Unitary lead free", it complies with RoHS directive requirements.
- This product specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
- The company does not warrant against failure caused by any use of the product that deviates from the intended use described in this product specification.
2410121258_FH-CMI160808J100KT_C109083.pdf
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