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Specifications
Current Rating:
400mA
Inductance:
2.2nH
Frequency - Self Resonant:
6GHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
200mΩ
Type:
Multilayer Inductor;High-frequency Inductor
Ratings:
-
Q @ Frequency:
8@100MHz
Mfr. Part #:
VHF160808H2N2ST
Package:
0603
Key Attributes
Model Number:
VHF160808H2N2ST
Product Description
Product Overview
The VHF160808H Series Chip High Frequency Inductors are designed for demanding electronic applications. These multilayer chip inductors are constructed with a ceramic body and internal electrodes made of pure silver, with terminal electrodes featuring a silver layer and Ni/Sn plating. They offer a wide range of inductance values from 1.0 nH to 470 nH, suitable for various high-frequency circuits. The series is manufactured by [Manufacturer Name - Not specified in text] and is available in tape & reel packaging for automated assembly.
Product Attributes
- Product Type: Chip high frequency inductors
- Series: VHF160808H
- Construction: Multilayer chip inductors
- Body Material: Ceramic (Al2O3)
- Internal Electrode Material: Pure Silver (Ag)
- Terminal Electrode Material: Silver Layer (Ag) with Ni/Sn Plating
- Packaging: Tape & Reel
- Certifications: RoHS compliant (for "Unitary lead free" products)
Technical Specifications
| Part Number | Inductance (nH) | Tolerance | Q Value (min) | DC Resistance () max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA) max | Dimensions (LWT mm) | |
|---|---|---|---|---|---|---|---|---|---|---|
| VHF160808H1N0T | 1.0 | S/D (for Ls<6.8nH) | 8 | 0.05 | 100 | 50 | 10000 | 500 | 1.60.80.8 | |
| VHF160808H1N2T | 1.2 | S/D (for Ls<6.8nH) | 8 | 0.05 | 100 | 50 | 10000 | 500 | 1.60.80.8 | |
| VHF160808H1N5T | 1.5 | S/D (for Ls<6.8nH) | 8 | 0.10 | 100 | 50 | 6000 | 500 | 1.60.80.8 | |
| VHF160808H1N8T | 1.8 | S/D (for Ls<6.8nH) | 8 | 0.10 | 100 | 50 | 6000 | 500 | 1.60.80.8 | |
| VHF160808H2N0T | 2.0 | S/D (for Ls<6.8nH) | 8 | 0.10 | 100 | 50 | 6000 | 500 | 1.60.80.8 | |
| VHF160808H2N2T | 2.2 | S/D (for Ls<6.8nH) | 8 | 0.10 | 100 | 50 | 6000 | 500 | 1.60.80.8 | |
| VHF160808H2N4T | 2.4 | S/D (for Ls<6.8nH) | 8 | 0.12 | 100 | 50 | 6000 | 500 | 1.60.80.8 | |
| VHF160808H2N7T | 2.7 | S/D (for Ls<6.8nH) | 10 | 0.12 | 100 | 50 | 6000 | 500 | 1.60.80.8 | |
| VHF160808H3N3T | 3.3 | S/D (for Ls<6.8nH) | 10 | 0.15 | 100 | 50 | 6000 | 500 | 1.60.80.8 | |
| VHF160808H3N6T | 3.6 | S/D (for Ls<6.8nH) | 10 | 0.16 | 100 | 50 | 6000 | 500 | 1.60.80.8 | |
| VHF160808H3N9T | 3.9 | S/D (for Ls<6.8nH) | 10 | 0.16 | 100 | 50 | 6000 | 500 | 1.60.80.8 | |
| VHF160808H4N3T | 4.3 | S/D (for Ls<6.8nH) | 1 | 0 | 0.18 | 100 | 50 | 6000 | 500 | 1.60.80.8 |
| VHF160808H4N7T | 4.7 | S/D (for Ls<6.8nH) | 10 | 0.20 | 100 | 50 | 6000 | 500 | 1.60.80.8 | |
| VHF160808H5N1T | 5.1 | S/D (for Ls<6.8nH) | 10 | 0.25 | 100 | 50 | 5500 | 500 | 1.60.80.8 | |
| VHF160808H5N6T | 5.6 | S/D (for Ls<6.8nH) | 10 | 0.25 | 100 | 50 | 5000 | 500 | 1.60.80.8 | |
| VHF160808H6N8T | 6.8 | J/K (for Ls6.8nH) | 10 | 0.30 | 100 | 50 | 5000 | 500 | 1.60.80.8 | |
| VHF160808H7N5T | 7.5 | J/K (for Ls6.8nH) | 10 | 0.35 | 100 | 50 | 4500 | 500 | 1.60.80.8 | |
| VHF160808H8N2T | 8.2 | J/K (for Ls6.8nH) | 10 | 0.35 | 100 | 50 | 4500 | 500 | 1.60.80.8 | |
| VHF160808H9N1T | 9.1 | J/K (for Ls6.8nH) | 10 | 0.40 | 100 | 50 | 3500 | 500 | 1.60.80.8 | |
| VHF160808H10NT | 10 | J/K (for Ls6.8nH) | 12 | 0.40 | 100 | 50 | 3500 | 300 | 1.60.80.8 | |
| VHF160808H12NT | 12 | J/K (for Ls6.8nH) | 12 | 0.45 | 100 | 50 | 3000 | 300 | 1.60.80.8 | |
| VHF160808H15NT | 15 | J/K (for Ls6.8nH) | 12 | 0.50 | 100 | 50 | 2300 | 300 | 1.60.80.8 | |
| VHF160808H18NT | 18 | J/K (for Ls6.8nH) | 12 | 0.55 | 100 | 50 | 2200 | 300 | 1.60.80.8 | |
| VHF160808H22NT | 22 | J/K (for Ls6.8nH) | 12 | 0.60 | 100 | 50 | 2000 | 300 | 1.60.80.8 | |
| VHF160808H24NT | 24 | J/K (for Ls6.8nH) | 12 | 0.60 | 100 | 50 | 2000 | 300 | 1.60.80.8 | |
| VHF160808H27NT | 27 | J/K (for Ls6.8nH) | 12 | 0.65 | 100 | 50 | 1700 | 300 | 1.60.80.8 | |
| VHF160808H33NT | 33 | J/K (for Ls6.8nH) | 12 | 0.70 | 100 | 50 | 1500 | 300 | 1.60.80.8 | |
| VHF160808H36NT | 36 | J/K (for Ls6.8nH) | 12 | 0.70 | 100 | 50 | 1400 | 300 | 1.60.80.8 | |
| VHF160808H39NT | 39 | J/K (for Ls6.8nH) | 12 | 0.70 | 100 | 50 | 1400 | 300 | 1.60.80.8 | |
| VHF160808H47NT | 47 | J/K (for Ls6.8nH) | 12 | 0.70 | 100 | 50 | 1200 | 300 | 1.60.80.8 | |
| VHF160808H56NT | 56 | J/K (for Ls6.8nH) | 12 | 0.75 | 100 | 50 | 1100 | 300 | 1.60.80.8 | |
| VHF160808H68NT | 68 | J/K (for Ls6.8nH) | 12 | 0.85 | 100 | 50 | 900 | 300 | 1.60.80.8 | |
| VHF160808H82NT | 82 | J/K (for Ls6.8nH) | 8 | 1.00 | 100 | 50 | 800 | 300 | 1.60.80.8 | |
| VHF160808HR10T | 100 | J/K (for Ls6.8nH) | 8 | 1.20 | 100 | 50 | 700 | 300 | 1.60.80.8 | |
| VHF160808HR12T | 120 | J/K (for Ls6.8nH) | 8 | 1.40 | 50 | 50 | 600 | 200 | 1.60.80.8 | |
| VHF160808HR15T | 150 | J/K (for Ls6.8nH) | 8 | 1.60 | 50 | 50 | 500 | 200 | 1.60.80.8 | |
| VHF160808HR18T | 180 | J/K (for Ls6.8nH) | 8 | 1.90 | 50 | 50 | 400 | 200 | 1.60.80.8 | |
| VHF160808HR22T | 220 | J/K (for Ls6.8nH) | 8 | 2.40 | 50 | 50 | 350 | 200 | 1.60.80.8 | |
| VHF160808HR27T | 270 | J/K (for Ls6.8nH) | 8 | 2.60 | 50 | 50 | 350 | 150 | 1.60.80.8 | |
| VHF160808HR33T | 330 | J/K (for Ls6.8nH) | 8 | 2.80 | 50 | 50 | 350 | 150 | 1.60.80.8 | |
| VHF160808HR39T | 390 | J/K (for Ls6.8nH) | 8 | 3.20 | 50 | 50 | 300 | 150 | 1.60.80.8 | |
| VHF160808HR43T | 430 | J/K (for Ls6.8nH) | 8 | 3.40 | 50 | 50 | 280 | 150 | 1.60.80.8 | |
| VHF160808HR47T | 470 | J/K (for Ls6.8nH) | 8 | 3.60 | 50 | 50 | 250 | 150 | 1.60.80.8 |
Reliability Testing Items
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder. | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance: H: change within 10%; Q value change (ceramic): within 20% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 7N for 1608 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: within 10%; Q value change (ceramic): within 20% | Temperature: -402; Testing time: 1000+240/-0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| 7 | Vibration | No mechanical damage. Inductance change: within 10%; Q value change (ceramic): within 20% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Inductance change: within 10%; Q value change (ceramic): within 20% | Testing time: 1000+240/-0 h; Temperature: 852 |
| 9 | Static Humidity | No mechanical damage. Inductance change: within 10%; Q value change (ceramic): within 20% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000+240/-0 h |
| 10 | High temperature load | No mechanical damage. Inductance change: within 10%; Q value change (ceramic): within 20% | Impose current: rated current; Testing time: 1000+240/-0 h; Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Inductance change: within 10%; Q value change (ceramic): within 20% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
Product Packaging
| Size | Pieces per Reel | Pieces per Box | Pieces per Case |
|---|---|---|---|
| 160808 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
Products are suitable for reflow soldering.
- Soldering Conditions: Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 max. Cooling into solvent after soldering should be limited to 100 max.
- Iron Soldering: Soldering Iron Temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S. Take care not to apply the tip of the soldering iron to the terminal electrodes.
Cleaning
- Cleaning Temperature: 60 max
- Cleaning Time: 1 minute min.
- Ultrasonic Output Power: 200W max
Storage Requirements
- Storage Period: Within 1 year from the factory inspection date. If exceeding 1 year, solderability should be checked before use.
- Storage Conditions:
- Warehouse Temperature: -10+40; Relative Humidity: 3070%.
- Do not store in corrosive gases (sulfur, chlorine gas, acid) to prevent electrode oxidation.
- Store on pallets to prevent influence from humidity and dust.
- Avoid heat shock, vibration, and direct sunlight.
- Products should be stored in airtight packaging.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 and HCFC in its production process.
Notes
- If the product is marked "Unitary lead free", it complies with RoHS directive requirements.
- This product specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
- The company does not warrant against failure caused by any use of the product that deviates from the intended use as described in this product specification.
2410121258_FH-VHF160808H2N2ST_C1028.pdf
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