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Specifications
Mfr. Part #:
CMH201209B4R7MT
Package:
0805
Key Attributes
Model Number:
CMH201209B4R7MT
Product Description
Product Overview
The CMH201209B Series is a multilayer chip ferrite power inductor designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes featuring a silver layer with Ni/Sn plating. They offer reliable performance with specified electrical characteristics, including inductance, DC resistance, and self-resonant frequency, making them suitable for integration into electronic circuits requiring efficient power management.
Product Attributes
- Product Type: Multilayer Chip Ferrite Power Inductor
- Series: CMH201209B Series
- Body Material: Ferrite (Ni-Cu-Zn system) or Ceramic
- Inner Electrode Material: Pure Silver (Ag)
- Terminal Electrode Material: Silver Layer (Ag) with Ni/Sn Plating
- Packaging: Tape & Reel (T)
- Certifications: RoHS compliant (if specified as "Unitary lead free")
Technical Specifications
| Part Number | Dimensions (LWT) mm (inch) | Inductance (H) | Tolerance (%) | DC Resistance () max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA) max |
|---|---|---|---|---|---|---|---|---|
| CMH201209B1R0MT | 2.00.20 1.20.20 0.90.20 (0.0790.008 0.0470.008 0.0350.008) | 1.0 | 20 | 0.1125% | 1 | 50 | 1150 | 75 |
| CMH201209B2R2MT | 2.00.20 1.20.20 0.90.20 (0.0790.008 0.0470.008 0.0350.008) | 2.2 | 20 | 0.2025% | 1 | 50 | 950 | 50 |
| CMH201209B3R3MT | 2.00.20 1.20.20 0.90.20 (0.0790.008 0.0470.008 0.0350.008) | 3.3 | 20 | 0.2225% | 1 | 50 | 800 | 35 |
| CMH201209B4R7MT | 2.00.20 1.20.20 0.90.20 (0.0790.008 0.0470.008 0.0350.008) | 4.7 | 20 | 0.3025% | 1 | 50 | 750 | 25 |
| CMH201209B6R8MT | 2.00.20 1.20.20 0.90.20 (0.0790.008 0.0470.008 0.0350.008) | 6.8 | 20 | 0.3025% | 1 | 50 | 600 | 25 |
Reliability Testing Items
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | |
| Solder ability | At least 95% of terminal electrode should be covered with solder. | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s |
| Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: within 30% (Ferrite Inductor B process / A process) | Preheating temperature: 120~150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 2012 series; Keep time: 101S |
| Low temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature: -402; Testing time: 1000 (+240/-0) h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; Compression speed: 0.5mm/s; Curvature: 2mm; Hold time: 20s1s |
| Vibration | No mechanical damage. Inductance change: within 10% | Amplitude: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz (for 1min) |
| High temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature: 852; Testing time: 1000 (+240/-0) h |
| Static Humidity | No mechanical damage. Inductance change: within 10% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 (+240/-0) h |
| High temperature load | No mechanical damage. Inductance change: within 10% | Imposed current: rated current; Temperature: 852; Testing time: 1000 (+240/-0) h |
| Temperature Shock | No mechanical damage. Inductance change: within 10% | Temperature: -40 for 303min +85 for 303min; Number of cycles: 32 |
Product Packaging
Packaging Quantity (Unit: Pcs):
- 201209 Size: 4000 Pcs/Reel, 40000 Pcs/Box, 240000 Pcs/Case
Taping Dimensions (Unit: mm):
- Paper tape
Peeling Off Force:
- Cover tape peeling force: 0.1N0.7N
- Peeling speed: 300mm/min
- Cover bond should not be damaged and bond the tape when it peeled off.
Recommended Soldering Conditions
Reflow Soldering:
- Temperature difference between solder and ferrite surface during pre-heating: max 150.
- Temperature difference during cooling into solvent after soldering: max 100.
- Ensure soldering is within the allowable profile range to prevent product quality deterioration and electrode corrosion.
Iron Soldering:
- Soldering iron temperature: 350 (max 30W)
- Soldering iron dwell time: < 5s (Avoid contact with terminal electrodes)
Cleaning Conditions
- Cleaning temperature: 60 max
- Cleaning time: 1 minute min.
- Ultrasonic output power: 200W max
Storage Requirements
Storage Period:
- Within 1 year from the inductor company's inspection date. If exceeded, solder ability must be checked.
Storage Conditions:
- Warehouse temperature: -10 to +40; Relative humidity: 30% to 70%.
- Avoid storage in corrosive substances (sulfur, chlorine gas, acid).
- Store on a palette to prevent influence from humidity and dust.
- Avoid heat shock, vibration, and direct sunlight.
- Products should be stored under airtight packaged condition.
Usage Of ODS (Ozone Depleting Substances)
- The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.
Notes
- If the product is labeled "Unitary lead free", it complies with RoHS directive requirements.
- This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when this product is mounted.
- The company is not liable for failures caused by uses deviating from this product specification.
2409271733_FH-CMH201209B4R7MT_C394959.pdf
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