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Quality multilayer chip ferrite inductors FH CMI201209V47NKT with Ni Cu Zn ferrite material and silver inner electrodes factory
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Quality multilayer chip ferrite inductors FH CMI201209V47NKT with Ni Cu Zn ferrite material and silver inner electrodes factory
>
Specifications
Current Rating:
300mA
Inductance:
47nH
Frequency - Self Resonant:
320MHz
Tolerance:
±10%
DC Resistance(DCR):
150mΩ
Type:
Multilayer Inductor
Q @ Frequency:
25@50MHz
Mfr. Part #:
CMI201209V47NKT
Package:
0805
Key Attributes
Model Number: CMI201209V47NKT
Product Description

Product Overview

The CMI2012 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors offer reliable performance with a compact multilayer chip structure. They are suitable for use in a wide range of operating temperatures and are manufactured with high-quality ferrite or ceramic bodies, silver inner electrodes, and terminal electrodes with Ni/Sn plating.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Inductors
  • Series: CMI2012 Series
  • Material: Ferrite (Ni-Cu-Zn system)
  • Inner Electrode Material: Pure Silver (Ag)
  • Terminal Electrode Plating: Ni/Sn plating
  • Body Material: Ferrite or Ceramic
  • Certifications: RoHS compliant (if specified as "Unitary lead free")

Technical Specifications

Model Size (L x W x T) (mm) Inductance (H) Tolerance Q Value (min) DCR () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max
CMI201209V47NKT 2.0 x 1.2 x 0.9 0.047 10% 25 0.15 50 50 320 300
CMI201209V56NKT 2.0 x 1.2 x 0.9 0.056 10% 25 0.15 50 50 320 300
CMI201209V68NKT 2.0 x 1.2 x 0.9 0.068 10% 25 0.20 50 50 280 300
CMI201209V82NKT 2.0 x 1.2 x 0.9 0.082 10% 25 0.20 50 50 280 300
CMI201209VR10KT 2.0 x 1.2 x 0.9 0.10 10% 20 0.20 25 50 235 250
CMI201209VR12KT 2.0 x 1.2 x 0.9 0.12 10% 20 0.25 25 50 220 250
CMI201209VR15KT 2.0 x 1.2 x 0.9 0.15 10% 20 0.25 25 50 200 250
CMI201209VR18KT 2.0 x 1.2 x 0.9 0.18 10% 20 0.30 25 50 185 250
CMI201209VR22KT 2.0 x 1.2 x 0.9 0.22 10% 20 0.30 25 50 170 250
CMI201209VR27KT 2.0 x 1.2 x 0.9 0.27 10% 20 0.40 25 50 150 250
CMI201209VR33KT 2.0 x 1.2 x 0.9 0.33 10% 20 0.40 25 50 145 250
CMI201209VR39KT 2.0 x 1.2 x 0.9 0.39 10% 25 0.50 25 50 135 200
CMI201209VR47KT 2.0 x 1.2 x 0.9 0.47 10% 25 0.50 25 50 125 200
CMI201209VR56KT 2.0 x 1.2 x 0.9 0.56 10% 25 0.60 25 50 115 150
CMI201209VR68KT 2.0 x 1.2 x 0.9 0.68 10% 25 0.65 25 50 105 150
CMI201209VR82KT 2.0 x 1.2 x 0.9 0.82 10% 25 0.70 25 50 100 150
CMI201209U1R0KT 2.0 x 1.2 x 0.9 1.0 10% 35 0.40 10 50 75 50
CMI201209U1R2KT 2.0 x 1.2 x 0.9 1.2 10% 35 0.40 10 50 65 50
CMI201209U1R5KT 2.0 x 1.2 x 0.9 1.5 10% 35 0.40 10 50 60 50
CMI201209U1R8KT 2.0 x 1.2 x 0.9 1.8 10% 35 0.40 10 50 55 50
CMI201209U2R2KT 2.0 x 1.2 x 0.9 2.2 10% 35 0.60 10 50 50 50
CMI201209U2R7KT 2.0 x 1.2 x 0.9 2.7 10% 35 0.60 10 50 45 50
CMI201209U3R3KT 2.0 x 1.2 x 0.9 3.3 10% 35 0.60 10 50 41 50
CMI201209U3R9KT 2.0 x 1.2 x 0.9 3.9 10% 35 0.80 10 50 38 50
CMI201209U4R7KT 2.0 x 1.2 x 0.9 4.7 10% 35 0.90 10 50 35 30
CMI201209X5R6KT 2.0 x 1.2 x 0.9 5.6 10% 30 1.00 4 50 32 15
CMI201209X6R8KT 2.0 x 1.2 x 0.9 6.8 10% 30 1.05 4 50 29 15
CMI201209X8R2KT 2.0 x 1.2 x 0.9 8.2 10% 30 1.05 4 50 26 15
CMI201209X100KT 2.0 x 1.2 x 0.9 10 10% 30 1.15 2 50 24 15
CMI201209X120KT 2.0 x 1.2 x 0.9 12 10% 30 1.15 2 50 22 15
CMI201209J150KT 2.0 x 1.2 x 0.9 15 10% 25 1.15 1 50 19 5
CMI201209J180KT 2.0 x 1.2 x 0.9 18 10% 25 1.20 1 50 18 5
CMI201209J220KT 2.0 x 1.2 x 0.9 22 10% 25 1.20 1 50 16 5
CMI201209J270KT 2.0 x 1.2 x 0.9 27 10% 25 1.50 1 50 16 5
CMI201212J330MT 2.0 x 1.2 x 1.2 33 20% 25 1.50 1 50 16 5
CMI201212J390MT 2.0 x 1.2 x 1.2 39 20% 25 1.50 1 50 16 5
CMI201212J470MT 2.0 x 1.2 x 1.2 47 20% 25 1.70 1 50 15 5
CMI201212J560MT 2.0 x 1.2 x 1.2 56 20% 25 2.60 1 50 10 5
CMI201212J680MT 2.0 x 1.2 x 1.2 68 20% 25 2.60 1 50 10 5
Item Requirements Test Methods and Remarks
Operating Temperature Range -40+85
Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s
Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: V,U within 20%, X within 25%, J within 30%. Q value change(ferrite): within 30% Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s
Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 2012 series. Keep time: 101S
Low temperature resistance No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Temperature: -402, Testing time: 100024h
Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate, For 0.5 mm/s compression speed, curvature: 2mm, hold time: 20s1s
Vibration No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Amplitude modulation: 1.5mm, Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
High temperature resistance No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Testing time: 100024h, Temperature: 852
Static Humidity No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Humidity: 90% to 95% RH, Temperature: 602, Testing time: 100024h
High temperature load No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Impose current: rated current, Testing time: 100024h, Temperature: 852
Temperature Shock No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30% Temperature: -40 for 303min +85 for 303min, Number of cycles: 32

Packaging

Taping Dimensions (Unit: mm)

Model Size A B C N G
Reel CF-8 1782.0 22.02.0 12.51.5 572.0 8
Model Size A0 B0 W F E P1 P2 P0 D0 T
201212 Embossed tape 1.520.10 2.410.10 8.00+/-0.2 3.50+/-0.10 1.75+/-0.10 4.00+/-0.10 2.00+/-0.10 4.00+/-0.10 1.50+/-0.10 0.23+/-0.20
201209 Embossed tape 1.500.2 2.300.2 8.00.2 3.50.1 1.750.2 4.00.2 2.00.1 4.00.2 1.550.1 0.950.1

Peeling off force: 0.1N0.7N (pulling in the direction of arrow), Speed: 300mm/min.

Packaging Quantity (Unit: Pcs)

Model Size REEL BOX CASE
201212 3000 30000 180000
201209 4000 40000 240000

Recommended Soldering Conditions

Reflow Soldering:

  • Temperature difference between solder and ferrite surface during pre-heating: max 150.
  • Temperature difference between product surface and solvent during cooling after soldering: max 100.
  • Products should be soldered within the allowable range indicated by the reflow soldering profile curve.

Iron Soldering:

  • Soldering Iron Temperature: 350 (Max)
  • Power: 30W (Max)
  • Soldering Time: < 5S (Avoid touching terminal electrodes with the soldering iron tip)

Cleaning

  • Cleaning Temperature: 60 (max)
  • Cleaning Time: 1 minute (min)
  • Ultrasonic Output Power: 200W (max)

Storage Requirements

Storage Period: Within 1 year from the factory inspection date. If exceeding 1 year, solderability must be checked before use.

Storage Conditions:

  • Warehouse Temperature: -10 to +40, Relative Humidity: 30% to 70%.
  • Do not store in corrosive substances (sulfur, chlorine gas, acid) to prevent electrode oxidation.
  • Store on shelves to avoid moisture and dust.
  • Avoid heat shock, vibration, and direct sunlight.
  • Products should be stored in airtight packaging.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 and HCFC in its production process.

Notes

  • If the product is labeled "Unitary lead free", it complies with RoHS directive requirements.
  • This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when integrating our product.
  • The company does not warrant against failure caused by any use deviating from the intended use described in this specification.

2410121256_FH-CMI201209V47NKT_C3032659.pdf

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