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Specifications
Current - Saturation (Isat):
-
Mfr. Part #:
CMP201209UD1R0MT
Package:
0805
Key Attributes
Model Number:
CMP201209UD1R0MT
Product Description
Product Overview
The CMP201209 Series is a Multilayer Chip Ferrite Power Inductor designed for various electronic applications. These inductors offer reliable performance with precise electrical characteristics, suitable for integration into compact electronic devices. They are manufactured with high-quality ferrite or ceramic bodies, silver inner electrodes, and terminal electrodes featuring Ni/Sn plating for robust connectivity.
Product Attributes
- Product Type: Multilayer Chip Ferrite Power Inductor
- Series: CMP201209-D Series
- Manufacturer: (Implied, not explicitly stated)
- Material: Ferrite (Ni-Cu-Zn system for body), Pure Silver (Ag) for inner electrode, Silver (Ag) layer and Ni/Sn plating for terminal electrode.
- Certifications: RoHS compliant (if marked "Unitary lead free")
Technical Specifications
Dimensions & Inner Configuration
| Component | Material | Unit | L | W | T | Terminal Electrode Width |
|---|---|---|---|---|---|---|
| Body | Ferrite (Ni-Cu-Zn system) | mm (inch) | 2.0 0.20 (0.079 0.008) | 1.2 0.20 (0.047 0.008) | 0.9 0.20 (0.035 0.008) | 0.5 0.3 (0.020 0.012) |
| Inner electrode | Pure Silver (Ag) | |||||
| Terminal electrode | Silver (Ag) layer / Ni/Sn plating |
Product Model Composition Example
| Component | Description |
|---|---|
| CMP | Multilayer Chip Ferrite Power Inductor |
| 201209 | Dimensions (LWT) (2.01.20.9mm) |
| UD | Material code |
| 1R0 | Inductance: 1.0H |
| M | Tolerance: 20% |
| T | Packaging: Tape & Reel |
Electrical Characteristics List
| Part NO. | Tolerance (%) | Inductance (H) | RDC ()max | Test frequency (MHz) | Test voltage (mV) | SRF (MHz) min | Rated current (mA)max |
|---|---|---|---|---|---|---|---|
| CMP201209VD47NMT | 20 | 0.047 | 0.10 | 1 | 50 | 280 | 1100 |
| CMP201209VD56NMT | 20 | 0.056 | 0.10 | 1 | 50 | 280 | 1100 |
| CMP201209VD68NMT | 20 | 0.068 | 0.15 | 1 | 50 | 250 | 1100 |
| CMP201209VD82NMT | 20 | 0.082 | 0.15 | 1 | 50 | 250 | 1100 |
| CMP201209VDR10MT | 20 | 0.10 | 0.15 | 1 | 50 | 210 | 1100 |
| CMP201209VDR12MT | 20 | 0.12 | 0.15 | 1 | 50 | 200 | 1100 |
| CMP201209VDR15MT | 20 | 0.15 | 0.15 | 1 | 50 | 175 | 1100 |
| CMP201209VDR18MT | 20 | 0.18 | 0.15 | 1 | 50 | 160 | 1100 |
| CMP201209VDR22MT | 20 | 0.22 | 0.15 | 1 | 50 | 150 | 1100 |
| CMP201209VDR27MT | 20 | 0.27 | 0.15 | 1 | 50 | 130 | 1100 |
| CMP201209VDR33MT | 20 | 0.33 | 0.15 | 1 | 50 | 120 | 1100 |
| CMP201209VDR39MT | 20 | 0.39 | 0.15 | 1 | 50 | 110 | 1100 |
| CMP201209VDR47MT | 20 | 0.47 | 0.15 | 1 | 50 | 100 | 1100 |
| CMP201209VDR56MT | 20 | 0.56 | 0.36 | 1 | 50 | 100 | 800 |
| CMP201209VDR68MT | 20 | 0.68 | 0.36 | 1 | 50 | 95 | 800 |
| CMP201209VDR82MT | 20 | 0.82 | 0.36 | 1 | 50 | 90 | 800 |
| CMP201209UD1R0MT | 20 | 1.0 | 0.24 | 1 | 50 | 75 | 800 |
| CMP201209UD1R2MT | 20 | 1.2 | 0.24 | 1 | 50 | 65 | 800 |
| CMP201209UD1R5MT | 20 | 1.5 | 0.30 | 1 | 50 | 60 | 700 |
| CMP201209UD1R8MT | 20 | 1.8 | 0.36 | 1 | 50 | 55 | 600 |
| CMP201209UD2R2MT | 20 | 2.2 | 0.36 | 1 | 50 | 50 | 600 |
| CMP201209UD2R7MT | 20 | 2.7 | 0.36 | 1 | 50 | 45 | 600 |
| CMP201209UD3R3MT | 20 | 3.3 | 0.40 | 1 | 50 | 41 | 350 |
| CMP201209UD3R9MT | 20 | 3.9 | 0.40 | 1 | 50 | 38 | 350 |
| CMP201209UD4R7MT | 20 | 4.7 | 0.40 | 1 | 50 | 35 | 350 |
| CMP201209XD5R6MT | 20 | 5.6 | 0.50 | 1 | 50 | 32 | 250 |
| CMP201209XD6R8MT | 20 | 6.8 | 0.50 | 1 | 50 | 29 | 250 |
| CMP201209XD8R2MT | 20 | 8.2 | 0.56 | 1 | 50 | 26 | 250 |
| CMP201209XD100MT | 20 | 10 | 0.56 | 1 | 50 | 24 | 250 |
| CMP201209XD120MT | 20 | 12 | 0.56 | 1 | 50 | 22 | 250 |
| CMP201209JD150MT | 20 | 15 | 0.65 | 1 | 50 | 19 | 100 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temp: 120-150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temp: 2455, Immersion depth: 10mm, Duration: 51s, Dip to flux: 3-5s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: VD,UD: 20%; JD: 30% | Preheating temp: 120-150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temp: 2605, Immersion depth: 10mm, Duration: 101s, Dip to flux: 3-5s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 2012 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature: -402, Testing time: 1000+24-0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate. Compression speed: 0.5mm/s, Curvature: 2mm, Hold time: 20s1s |
| 7 | Vibration | No mechanical damage. Inductance change: within 10% | Amplitude: 1.5mm, Test time: 2h in each of 3 directions. Frequency range: 10Hz-55Hz-10Hz (1 min) |
| 8 | High temperature resistance | No mechanical damage. Inductance change: within 10% | Testing time: 1000+24-0 h, Temperature: 852 |
| 9 | Static Humidity | No mechanical damage. Inductance change: within 10% | Humidity: 90%-95% RH, Temperature: 602, Testing time: 1000+24-0 h |
| 10 | High temperature load | No mechanical damage. Inductance change: within 10% | Imposed current: rated current, Testing time: 1000+24-0 h, Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Inductance change: within 10% | Temperature: -40 (303 min) +85 (303 min), Number of cycles: 32 |
Note: Measurements for electrical performance tests should be made after 242hrs of recovery under standard conditions.
Packaging
| Size | Quantity per REEL | Quantity per BOX | Quantity per CASE |
|---|---|---|---|
| 201209 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions (Reflow Soldering)
Soldering Conditions: Products can be applied to reflow soldering.
- Temperature difference between solder and ferrite surface during pre-heating should not exceed 150. Temperature difference during cooling into solvent after soldering should not exceed 100.
- Soldering should be performed within the allowable range indicated by the profile curve.
Recommended Soldering Conditions (Iron Soldering)
- Soldering Iron Temperature: 350 (max 30W)
- Soldering Iron Dwell Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes)
Cleaning Conditions
- Cleaning Temperature: 60 max
- Cleaning Time: 1 minute min.
- Ultrasonic Output Power: 200W max
Storage Requirements
- Storage Period: Within 1 year from the inspection date by the inductor company. If exceeded, solder ability should be checked before use.
- Storage Conditions:
- Warehouse Temperature: -10 to +40, Relative Humidity: 30% to 70%.
- Do not store in corrosive gases (sulfur, chlorine gas, acid) to prevent electrode oxidation.
- Store on a pallet to prevent influence from humidity and dust.
- Avoid heat shock, vibration, and direct sunlight.
- Store in airtight packaged condition.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.
Notes
- If the product is marked "Unitary lead free", it complies with RoHS directive requirements.
- This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
- The company does not warrant against failure caused by any use of the product that deviates from the intended use described in this specification.
2410121310_FH-CMP201209UD1R0MT_C401475.pdf
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