Product Overview
The FHW-UC Series Wire Wound Chip Inductors are designed for various electronic applications. These ceramic core inductors offer a range of inductance values from 2.2nH to 1000H with tight tolerances. They are manufactured with a ceramic core and copper wire, encapsulated with UV adhesive, and feature tin or gold plated terminals. The series is suitable for applications requiring reliable performance across a wide operating temperature range of -40 to +125 and meets stringent reliability testing standards.
Product Attributes
- Brand: FHW
- Series: FHW-UC Series
- Type: Wire Wound Chip Inductor
- Core Material: Ceramic (Al2O3)
- Terminal Plating: Tin or Gold
- Encapsulation: UV Adhesive
- Marking: UV printing ink
- Compliance: RoHS compliant
Technical Specifications
| Part Number Prefix | Size | Core Type | Inductance Range (nH) | Tolerance | Operating Temperature Range | Dimensions (mm) L x W x T (Max) | Rated Current (mA) Max (Example for 10nH) | Self-Resonant Frequency (MHz) Min (Example for 10nH) | DC Resistance () Max (Example for 10nH) |
|---|---|---|---|---|---|---|---|---|---|
| FHW0805UC | 0805 (2012) | Ceramic Core | 2.2nH - 1000H | 2% (G), 5% (J), 10% (K) | -40 to +125 | 2.30 x 1.70 x 1.52 | 600 mA (for 10nH) | 4200 MHz (for 10nH) | 0.15 (for 10nH) |
| Specific Model Examples: | |||||||||
| FHW0805UC2N2GT | 0805 | UC (Ceramic) | 2.2nH | K (10%) | -40 to +125 | 2.30 x 1.70 x 1.52 | 800 mA | 8500 MHz | 0.03 |
| FHW0805UC10GT | 0805 | UC (Ceramic) | 10nH | G, J, K (2%, 5%, 10%) | -40 to +125 | 2.30 x 1.70 x 1.52 | 600 mA | 4200 MHz | 0.15 |
| FHW0805UCR10GT | 0805 | UC (Ceramic) | 100nH | G, J, K (2%, 5%, 10%) | -40 to +125 | 2.30 x 1.70 x 1.52 | 400 mA | 1200 MHz | 0.46 |
| FHW0805UC2R2GT | 0805 | UC (Ceramic) | 2.2H | J, K (5%, 10%) | -40 to +125 | 2.30 x 1.70 x 1.52 | 150 mA | 50 MHz | 4.20 |
| Dimensions (mm): | |||||||||
| Size | L (Max) | W (Max) | T (Max) | A | B | C | D | E | |
| 2012(0805) | 2.30 | 1.70 | 1.52 | 1.27 | 0.50 | 1.78 | 1.02 | 0.76 | |
Reliability Testing Items
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+125 | FHW-UC series |
| Solder Ability | Electrode surface solder coverage 90% | Dip in solder (96.5Sn/3.0Ag/0.5Cu) at 2455 for 51s. |
| Resistance to Soldering | Inductance change 5%; Q value change 10% | Dip in solder (96.5Sn/3.0Ag/0.5Cu) at 2605 for 101s. |
| Vibration | Inductance change 5%; Q value change 10% | Amplitude 1.5mm, frequency 10~55Hz, 2 hours per direction (X, Y, Z). |
| Adhesion of electrode | No electrode detachment after test. | Weld on PCB, apply force as specified (0805UC Series: 20N, 101s, 1.0 mm/s). |
| Low temperature resistance | Inductance change 5%; Q value change 10% | -402 for 1000 +24/-0 h. |
| High temperature resistance | Inductance change 5%; Q value change 10% | +1255 for 1000 +24/-0 h. |
| Temperature Shock | Inductance change 5%; Q value change 10% | +125 (30 min) -40 (30 min), 100 cycles. |
| High temperature load | Inductance change 5%; Q value change 10% | 1252 for 1000 +24/-0 h with rated current applied. |
| Static Humidity | Inductance change 5%; Q value change 10% | 90%95%RH at 602 for 1000 +24/-0 h. |
| Bending strength | No visible mechanical damage. | Install on PCB, apply force vertically, bend plate 20.2 mm at 10.5 mm/s, hold 201s. |
| Solvent Resistance | Inductance change 5%; Q value change 10% | Soak in isopropyl alcohol at 235 for 50.5 min. |
Product Packaging
| Size | Pieces per Reel | Pieces per Box | Pieces per Case |
|---|---|---|---|
| 0805 | 3000 | 9000 (3 Reels) - 180000 (6 Reels) | 45000 (1.5 Boxes) - 120000 (4 Boxes) |
Recommended Soldering Conditions
Soldering Method: Reflow soldering
Flux: Rosin-based flux, avoid highly acidic flux with halide content exceeding 0.2(wt)%.
Solder: Lead-free solder (96.5Sn /3.0Ag/0.5Cu).
Temperature Difference: Max 150 between solder and ferrite surface during pre-heating. Max 100 between product surface and solvent during cooling.
Hand Soldering: Soldering Iron Temperature: 350 (Max), Power: 30W (Max), Dwell Time: < 5S. Avoid touching coil and encapsulation layer.
Cleaning
- Cleaning Temperature: 60 (Max)
- Cleaning Time: 5 minutes (Max)
- Ultrasonic Power: 200W (Max)
Storage Requirements
- Storage Period: Within 1 year from the factory inspection date. If over 1 year, check solderability before use.
- Storage Conditions: Temperature: -10 to +40, Relative Humidity: 30% to 70%.
- Avoid storage in corrosive substances (sulfur, chlorine gas, acid).
- Store on pallets to prevent influence from humidity and dust.
- Avoid heat shock, vibration, and direct sunlight.
- Products should be stored in airtight packaging.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production processes.
Notes
- Products are RoHS compliant.
- This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when our product is mounted.
- The company does not warrant against failure caused by any use of the product that deviates from the intended use described in this specification.
- Do not touch the coil with sharp objects such as tweezers to prevent wire breakage.
2409271832_FH-FHW0805UCR56JGT_C139264.pdf
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