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Quality Multilayer Chip Ferrite Inductor FH CMI201209U1R5KT with Silver Electrodes and Ni Cu Zn Ferrite Body factory
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Quality Multilayer Chip Ferrite Inductor FH CMI201209U1R5KT with Silver Electrodes and Ni Cu Zn Ferrite Body factory
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Specifications
Current Rating:
50mA
Inductance:
1.5uH
Tolerance:
±10%
Frequency - Self Resonant:
60MHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
400mΩ
Ratings:
-
Q @ Frequency:
35@10MHz
Mfr. Part #:
CMI201209U1R5KT
Package:
0805
Key Attributes
Model Number: CMI201209U1R5KT
Product Description

Product Overview

The CMI2012 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes featuring silver layers with Ni/Sn plating. They offer a range of inductance values with specified tolerances and electrical characteristics suitable for signal processing and power supply filtering.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Inductors
  • Series: CMI2012 Series
  • Material: Ferrite (Ni-Cu-Zn system), Pure Silver (Inner Electrode), Silver Layer (Terminal Electrode)
  • Plating: Ni/Sn plating
  • RoHS Compliance: Indicated by "Unitary lead free" label.

Technical Specifications

Dimensions:

Model Size (L x W x T) (mm) Terminal Electrode Width (mm)
CMI201209 2.0 0.20 x 1.2 0.20 x 0.9 0.20 0.5 0.3
CMI201212 2.0 0.20 x 1.2 0.20 x 1.2 0.20 0.5 0.3

Product Model Composition Example: CMI 201209 U 1R0 K T

  • CMI: Multilayer Chip Ferrite Chip Inductors
  • 201209: Dimensions (L x W x T) (2.0 x 1.2 x 0.9mm)
  • U: Material Code
  • 1R0: Inductance (1.0H)
  • K: Tolerance (10%)
  • T: Packaging (Tape & Reel)

Electrical Characteristics:

Part NO. Tolerance (%) Inductance (H) Q Value (min) RDC ()max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA)max
CMI201209V47NKT 10 0.047 25 0.15 50 50 320 300
CMI201209V56NKT 10 0.056 25 0.15 50 50 320 300
CMI201209V68NKT 10 0.068 25 0.20 50 50 280 300
CMI201209V82NKT 10 0.082 25 0.20 50 50 280 300
CMI201209VR10KT 10 0.10 20 0.20 25 50 235 250
CMI201209VR12KT 10 0.12 20 0.25 25 50 220 250
CMI201209VR15KT 10 0.15 20 0.25 25 50 200 250
CMI201209VR18KT 10 0.18 20 0.30 25 50 185 250
CMI201209VR22KT 10 0.22 20 0.30 25 50 170 250
CMI201209VR27KT 10 0.27 20 0.40 25 50 150 250
CMI201209VR33KT 10 0.33 20 0.40 25 50 145 250
CMI201209VR39KT 10 0.39 25 0.50 25 50 135 200
CMI201209VR47KT 10 0.47 25 0.50 25 50 125 200
CMI201209VR56KT 10 0.56 25 0.60 25 50 115 150
CMI201209VR68KT 10 0.68 25 0.65 25 50 105 150
CMI201209VR82KT 10 0.82 25 0.70 25 50 100 150
CMI201209U1R0KT 10 1.0 35 0.40 10 50 75 50
CMI201209U1R2KT 10 1.2 35 0.40 10 50 65 50
CMI201209U1R5KT 10 1.5 35 0.40 10 50 60 50
CMI201209U1R8KT 10 1.8 35 0.40 10 50 55 50
CMI201209U2R2KT 10 2.2 35 0.60 10 50 50 50
CMI201209U2R7KT 10 2.7 35 0.60 10 50 45 50
CMI201209U3R3KT 10 3.3 35 0.60 10 50 41 50
CMI201209U3R9KT 10 3.9 35 0.80 10 50 38 50
CMI201209U4R7KT 10 4.7 35 0.90 10 50 35 30
CMI201209X5R6KT 10 5.6 30 1.00 4 50 32 15
CMI201209X6R8KT 10 6.8 30 1.05 4 50 29 15
CMI201209X8R2KT 10 8.2 30 1.05 4 50 26 15
CMI201209X100KT 10 10 30 1.15 2 50 24 15
CMI201209X120KT 10 12 30 1.15 2 50 22 15
CMI201209J150KT 10 15 25 1.15 1 50 19 5
CMI201209J180KT 10 18 25 1.20 1 50 18 5
CMI201209J220KT 10 22 25 1.20 1 50 16 5
CMI201209J270KT 10 27 25 1.50 1 50 16 5
CMI201209J330MT 20 33 25 1.50 1 50 16 5
CMI201212J390MT 20 39 25 1.50 1 50 16 5
CMI201212J470MT 20 47 25 1.70 1 50 15 5
CMI201212J560MT 20 56 25 2.60 1 50 10 5
CMI201212J680MT 20 68 25 2.60 1 50 10 5

Reliability Testing Items:

No. Items Requirements Test Methods and Remarks
1 Operating Temperature Range -40+85
2 Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s
3 Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: V,U within 20%; X within 25%; J within 30%. Q value change(ferrite): within 30%. Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s
4 Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 2012 series. Keep time: 101S
5 Low temperature resistance No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Temperature: -402, Testing time: 1000 +24/-0 h
6 Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate. For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s.
7 Vibration No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Amplitude modulation: 1.5mm. Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
8 High temperature resistance No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Testing time: 1000 +24/-0 h, Temperature: 852
9 Static Humidity No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Humidity: 90% to 95% RH, Temperature: 602, Testing time: 1000 +24/-0 h
10 High temperature load No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Impose current: rated current. Testing time: 1000 +24/-0 h, Temperature: 852
11 Temperature Shock No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. Temperature: -40 for 303min +85 for 303min. Number of cycles: 32.

Note: Measurements shall be made after 242hrs of recovery under standard conditions.

Packaging:

Model Size Pieces per REEL Pieces per BOX Pieces per CASE
201212 3000 30000 180000
201209 4000 40000 240000

Recommended Soldering Conditions:

  • Reflow Soldering: Temperature difference between solder and ferrite surface should not exceed 150 during pre-heating. Temperature difference between product surface and solvent after soldering should not exceed 100.
  • Hand Soldering: Iron temperature: 350 (Max), Power: 30W (Max), Soldering Time: < 5S. Avoid applying the soldering iron tip to the terminal electrodes.

Cleaning Conditions:

  • Cleaning temperature: 60 (Max)
  • Cleaning time: 1 minute (Min)
  • Ultrasonic output power: 200W (Max)

Storage Requirements:

  • Storage Period: Within 1 year from the factory inspection date. If exceeding 1 year, solderability must be checked before use.
  • Storage Conditions: Warehouse temperature: -10 to +40, Relative humidity: 30% to 70%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Products should be stored in airtight packaging.

Usage Of ODS (Ozone Depleting Substances): The company does not use ODS such as CCl4, HCFC in the production process.

Notes:

  • "Unitary lead free" products comply with RoHS directive requirements.
  • This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when this product is mounted.
  • The company cannot warrant against failure caused by any use deviating from the intended use described in this specification.

2410121256_FH-CMI201209U1R5KT_C139220.pdf

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