Product Overview
The CMI2012 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes featuring silver layers with Ni/Sn plating. They offer a range of inductance values with specified tolerances and electrical characteristics suitable for signal processing and power supply filtering.
Product Attributes
- Product Type: Multilayer Chip Ferrite Inductors
- Series: CMI2012 Series
- Material: Ferrite (Ni-Cu-Zn system), Pure Silver (Inner Electrode), Silver Layer (Terminal Electrode)
- Plating: Ni/Sn plating
- RoHS Compliance: Indicated by "Unitary lead free" label.
Technical Specifications
Dimensions:
| Model | Size (L x W x T) (mm) | Terminal Electrode Width (mm) |
|---|---|---|
| CMI201209 | 2.0 0.20 x 1.2 0.20 x 0.9 0.20 | 0.5 0.3 |
| CMI201212 | 2.0 0.20 x 1.2 0.20 x 1.2 0.20 | 0.5 0.3 |
Product Model Composition Example: CMI 201209 U 1R0 K T
- CMI: Multilayer Chip Ferrite Chip Inductors
- 201209: Dimensions (L x W x T) (2.0 x 1.2 x 0.9mm)
- U: Material Code
- 1R0: Inductance (1.0H)
- K: Tolerance (10%)
- T: Packaging (Tape & Reel)
Electrical Characteristics:
| Part NO. | Tolerance (%) | Inductance (H) | Q Value (min) | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA)max |
|---|---|---|---|---|---|---|---|---|
| CMI201209V47NKT | 10 | 0.047 | 25 | 0.15 | 50 | 50 | 320 | 300 |
| CMI201209V56NKT | 10 | 0.056 | 25 | 0.15 | 50 | 50 | 320 | 300 |
| CMI201209V68NKT | 10 | 0.068 | 25 | 0.20 | 50 | 50 | 280 | 300 |
| CMI201209V82NKT | 10 | 0.082 | 25 | 0.20 | 50 | 50 | 280 | 300 |
| CMI201209VR10KT | 10 | 0.10 | 20 | 0.20 | 25 | 50 | 235 | 250 |
| CMI201209VR12KT | 10 | 0.12 | 20 | 0.25 | 25 | 50 | 220 | 250 |
| CMI201209VR15KT | 10 | 0.15 | 20 | 0.25 | 25 | 50 | 200 | 250 |
| CMI201209VR18KT | 10 | 0.18 | 20 | 0.30 | 25 | 50 | 185 | 250 |
| CMI201209VR22KT | 10 | 0.22 | 20 | 0.30 | 25 | 50 | 170 | 250 |
| CMI201209VR27KT | 10 | 0.27 | 20 | 0.40 | 25 | 50 | 150 | 250 |
| CMI201209VR33KT | 10 | 0.33 | 20 | 0.40 | 25 | 50 | 145 | 250 |
| CMI201209VR39KT | 10 | 0.39 | 25 | 0.50 | 25 | 50 | 135 | 200 |
| CMI201209VR47KT | 10 | 0.47 | 25 | 0.50 | 25 | 50 | 125 | 200 |
| CMI201209VR56KT | 10 | 0.56 | 25 | 0.60 | 25 | 50 | 115 | 150 |
| CMI201209VR68KT | 10 | 0.68 | 25 | 0.65 | 25 | 50 | 105 | 150 |
| CMI201209VR82KT | 10 | 0.82 | 25 | 0.70 | 25 | 50 | 100 | 150 |
| CMI201209U1R0KT | 10 | 1.0 | 35 | 0.40 | 10 | 50 | 75 | 50 |
| CMI201209U1R2KT | 10 | 1.2 | 35 | 0.40 | 10 | 50 | 65 | 50 |
| CMI201209U1R5KT | 10 | 1.5 | 35 | 0.40 | 10 | 50 | 60 | 50 |
| CMI201209U1R8KT | 10 | 1.8 | 35 | 0.40 | 10 | 50 | 55 | 50 |
| CMI201209U2R2KT | 10 | 2.2 | 35 | 0.60 | 10 | 50 | 50 | 50 |
| CMI201209U2R7KT | 10 | 2.7 | 35 | 0.60 | 10 | 50 | 45 | 50 |
| CMI201209U3R3KT | 10 | 3.3 | 35 | 0.60 | 10 | 50 | 41 | 50 |
| CMI201209U3R9KT | 10 | 3.9 | 35 | 0.80 | 10 | 50 | 38 | 50 |
| CMI201209U4R7KT | 10 | 4.7 | 35 | 0.90 | 10 | 50 | 35 | 30 |
| CMI201209X5R6KT | 10 | 5.6 | 30 | 1.00 | 4 | 50 | 32 | 15 |
| CMI201209X6R8KT | 10 | 6.8 | 30 | 1.05 | 4 | 50 | 29 | 15 |
| CMI201209X8R2KT | 10 | 8.2 | 30 | 1.05 | 4 | 50 | 26 | 15 |
| CMI201209X100KT | 10 | 10 | 30 | 1.15 | 2 | 50 | 24 | 15 |
| CMI201209X120KT | 10 | 12 | 30 | 1.15 | 2 | 50 | 22 | 15 |
| CMI201209J150KT | 10 | 15 | 25 | 1.15 | 1 | 50 | 19 | 5 |
| CMI201209J180KT | 10 | 18 | 25 | 1.20 | 1 | 50 | 18 | 5 |
| CMI201209J220KT | 10 | 22 | 25 | 1.20 | 1 | 50 | 16 | 5 |
| CMI201209J270KT | 10 | 27 | 25 | 1.50 | 1 | 50 | 16 | 5 |
| CMI201209J330MT | 20 | 33 | 25 | 1.50 | 1 | 50 | 16 | 5 |
| CMI201212J390MT | 20 | 39 | 25 | 1.50 | 1 | 50 | 16 | 5 |
| CMI201212J470MT | 20 | 47 | 25 | 1.70 | 1 | 50 | 15 | 5 |
| CMI201212J560MT | 20 | 56 | 25 | 2.60 | 1 | 50 | 10 | 5 |
| CMI201212J680MT | 20 | 68 | 25 | 2.60 | 1 | 50 | 10 | 5 |
Reliability Testing Items:
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: V,U within 20%; X within 25%; J within 30%. Q value change(ferrite): within 30%. | Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 2012 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Temperature: -402, Testing time: 1000 +24/-0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate. For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s. |
| 7 | Vibration | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Amplitude modulation: 1.5mm. Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Testing time: 1000 +24/-0 h, Temperature: 852 |
| 9 | Static Humidity | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Humidity: 90% to 95% RH, Temperature: 602, Testing time: 1000 +24/-0 h |
| 10 | High temperature load | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Impose current: rated current. Testing time: 1000 +24/-0 h, Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Temperature: -40 for 303min +85 for 303min. Number of cycles: 32. |
Note: Measurements shall be made after 242hrs of recovery under standard conditions.
Packaging:
| Model Size | Pieces per REEL | Pieces per BOX | Pieces per CASE |
|---|---|---|---|
| 201212 | 3000 | 30000 | 180000 |
| 201209 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions:
- Reflow Soldering: Temperature difference between solder and ferrite surface should not exceed 150 during pre-heating. Temperature difference between product surface and solvent after soldering should not exceed 100.
- Hand Soldering: Iron temperature: 350 (Max), Power: 30W (Max), Soldering Time: < 5S. Avoid applying the soldering iron tip to the terminal electrodes.
Cleaning Conditions:
- Cleaning temperature: 60 (Max)
- Cleaning time: 1 minute (Min)
- Ultrasonic output power: 200W (Max)
Storage Requirements:
- Storage Period: Within 1 year from the factory inspection date. If exceeding 1 year, solderability must be checked before use.
- Storage Conditions: Warehouse temperature: -10 to +40, Relative humidity: 30% to 70%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Products should be stored in airtight packaging.
Usage Of ODS (Ozone Depleting Substances): The company does not use ODS such as CCl4, HCFC in the production process.
Notes:
- "Unitary lead free" products comply with RoHS directive requirements.
- This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when this product is mounted.
- The company cannot warrant against failure caused by any use deviating from the intended use described in this specification.
2410121256_FH-CMI201209U1R5KT_C139220.pdf
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