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Specifications
Current Rating:
15mA
Inductance:
3.3uH
Tolerance:
±10%
Frequency - Self Resonant:
40MHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
1Ω
Type:
Multilayer Inductor;High-frequency Inductor
Ratings:
-
Q @ Frequency:
25@10MHz
Mfr. Part #:
CMI160808U3R3KT
Package:
0603
Key Attributes
Model Number:
CMI160808U3R3KT
Product Description
Product Overview
The CMI160808 Series are multilayer chip ferrite inductors designed for various electronic applications. These components offer reliable performance with specific electrical characteristics, dimensions, and operating requirements suitable for modern electronic designs. They are manufactured with precision and adhere to strict quality and reliability testing standards.
Product Attributes
- Product Type: Multilayer Chip Ferrite Inductors
- Brand/Manufacturer: Not explicitly stated, but identified by CMI prefix.
- Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Ni/Sn plating.
- Internal Configuration: Composed of ferrite body, inner electrodes (pure silver), and terminal electrodes (silver layer with Ni/Sn plating).
- Packaging: Tape & Reel (T).
- Certifications: RoHS compliant for "Unitary lead free" products.
Technical Specifications
| Part No. | Tolerance (%) | Inductance (H) | Q Value (min) | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA)max |
|---|---|---|---|---|---|---|---|---|
| CMI160808V47NKT | 10 | 0.047 | 15 | 0.20 | 50 | 50 | 260 | 50 |
| CMI160808V56NKT | 10 | 0.056 | 15 | 0.20 | 50 | 50 | 260 | 50 |
| CMI160808V68NKT | 10 | 0.068 | 15 | 0.20 | 50 | 50 | 250 | 50 |
| CMI160808V82NKT | 10 | 0.082 | 15 | 0.20 | 50 | 50 | 245 | 50 |
| CMI160808VR10KT | 10 | 0.10 | 20 | 0.25 | 25 | 50 | 240 | 50 |
| CMI160808VR12KT | 10 | 0.12 | 20 | 0.30 | 25 | 50 | 205 | 50 |
| CMI160808VR15KT | 10 | 0.15 | 20 | 0.30 | 25 | 50 | 180 | 50 |
| CMI160808VR18KT | 10 | 0.18 | 20 | 0.30 | 25 | 50 | 165 | 50 |
| CMI160808VR22KT | 10 | 0.22 | 20 | 0.40 | 25 | 50 | 150 | 50 |
| CMI160808VR27KT | 10 | 0.27 | 20 | 0.45 | 25 | 50 | 136 | 50 |
| CMI160808VR33KT | 10 | 0.33 | 20 | 0.50 | 25 | 50 | 125 | 50 |
| CMI160808VR39KT | 10 | 0.39 | 20 | 0.60 | 25 | 50 | 110 | 50 |
| CMI160808VR47KT | 10 | 0.47 | 20 | 0.70 | 25 | 50 | 105 | 50 |
| CMI160808VR56KT | 10 | 0.56 | 20 | 0.70 | 25 | 50 | 95 | 50 |
| CMI160808VR68KT | 10 | 0.68 | 20 | 0.90 | 25 | 50 | 90 | 50 |
| CMI160808VR82KT | 10 | 0.82 | 20 | 1.00 | 25 | 50 | 85 | 50 |
| CMI160808U1R0KT | 10 | 1.0 | 25 | 0.50 | 10 | 50 | 75 | 25 |
| CMI160808U1R2KT | 10 | 1.2 | 25 | 0.55 | 10 | 50 | 65 | 25 |
| CMI160808U1R5KT | 10 | 1.5 | 25 | 0.70 | 10 | 50 | 60 | 25 |
| CMI160808U1R8KT | 10 | 1.8 | 25 | 0.75 | 10 | 50 | 55 | 25 |
| CMI160808U2R2KT | 10 | 2.2 | 25 | 0.80 | 10 | 50 | 50 | 25 |
| CMI160808U2R7KT | 10 | 2.7 | 25 | 0.90 | 10 | 50 | 45 | 15 |
| CMI160808U3R3KT | 10 | 3.3 | 25 | 1.00 | 10 | 50 | 40 | 15 |
| CMI160808U3R9KT | 10 | 3.9 | 25 | 1.30 | 10 | 50 | 35 | 15 |
| CMI160808U4R7KT | 10 | 4.7 | 25 | 1.50 | 10 | 50 | 33 | 15 |
| CMI160808J5R6KT | 10 | 5.6 | 12 | 1.55 | 4 | 50 | 22 | 5 |
| CMI160808J6R8KT | 10 | 6.8 | 12 | 1.55 | 4 | 50 | 20 | 5 |
| CMI160808J8R2KT | 10 | 8.2 | 12 | 1.65 | 4 | 50 | 18 | 5 |
| CMI160808J100KT | 10 | 10 | 20 | 1.75 | 2 | 50 | 17 | 3 |
| CMI160808J120KT | 10 | 12 | 20 | 1.85 | 2 | 50 | 15 | 3 |
| CMI160808J150MT | 20 | 15 | 20 | 2.50 | 1 | 50 | 14 | 1 |
| CMI160808J180MT | 20 | 18 | 20 | 2.70 | 1 | 50 | 13 | 1 |
| CMI160808J220MT | 20 | 22 | 20 | 3.00 | 1 | 50 | 12 | 1 |
| Size | L (mm) | W (mm) | T (mm) | a (mm) |
|---|---|---|---|---|
| 160808 | 1.60.20 | 0.80.20 | 0.80.20 | 0.30.2 |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | |
| Solder ability | At least 95% of terminal electrode should be covered with solder. | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s |
| Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance: V, U: change within 20%; X: change within 25%; J: change within 30%. Q value change(ferrite): within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 7N for 1608 series. Keep time: 101S |
| Low temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Temperature: -402; Testing time: 1000 +24/-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s. |
| Vibration | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Testing time: 1000 +24/-0 h; Temperature: 852 |
| Static Humidity | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +24/-0 h |
| High temperature load | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Impose current: at rated current; Testing time: 1000 +24/-0 h; Temperature: 852 |
| Temperature Shock | No mechanical damage. Inductance change: within 10%. Q value change(ferrite): within 30%. | Temperature: -40 for 303min +85 for 303min; Number of cycles: 32 |
| Size | Quantity per REEL | Quantity per BOX | Quantity per CASE |
|---|---|---|---|
| 160808 | 4000 | 40000 | 240000 |
| Reel Dimensions (mm) | A | B | C | N | G |
|---|---|---|---|---|---|
| CF-8 | 1782.0 | 22.02.0 | 12.51.5 | 572.0 | 8 |
| Taping Dimensions (mm) | |
|---|---|
| Paper tape | (Dimensions not specified in detail, only indicated as ) |
| Peeling off force | Requirement | Speed |
|---|---|---|
| Cover tape peeling force | 0.1N0.7N | 300mm/min |
Recommended Soldering Conditions
Reflow Soldering:
- Temperature difference between solder and ferrite surface during pre-heating: Max 150.
- Temperature difference during cooling into solvent after soldering: Max 100.
- Products should be soldered within the specified allowable range.
Iron Soldering:
- Soldering Iron Temperature: 350 (Max)
- Power: 30W (Max)
- Soldering Time: < 5S (Avoid contact with terminal electrodes).
Cleaning Conditions
- Cleaning Temperature: 60 (Max)
- Cleaning Time: 1 minute (Min)
- Ultrasonic Output Power: 200W (Max)
Storage Requirements
Storage Period: Within 1 year from the factory inspection date. For periods exceeding 1 year, solderability must be checked.
Storage Conditions:
- Warehouse Temperature: -10 to +40
- Relative Humidity: 30% to 70%
- Avoid storage in corrosive gases (sulfur, chlorine gas, acid).
- Store on shelves to prevent influence from humidity and dust.
- Avoid heat shock, vibration, and direct sunlight.
- Products should be stored in airtight packaging.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.
Notes
- "Unitary lead free" products comply with RoHS directive requirements.
- This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when our product is mounted.
- Failure caused by uses deviating from the intended use described in this specification is not warranted.
2410121258_FH-CMI160808U3R3KT_C139209.pdf
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