Online Service

Online Service

Contact Person
+86 13528435210
Quality Ceramic body chip high frequency inductors FH VHF201209H22NJT featuring silver inner and terminal electrodes factory
<
Quality Ceramic body chip high frequency inductors FH VHF201209H22NJT featuring silver inner and terminal electrodes factory
>
Specifications
Current Rating:
300mA
Inductance:
22nH
Tolerance:
±5%
Frequency - Self Resonant:
1.5GHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
500mΩ
Type:
Multilayer Inductor;High-frequency Inductor
Ratings:
-
Q @ Frequency:
15@100MHz
Mfr. Part #:
VHF201209H22NJT
Package:
0805
Key Attributes
Model Number: VHF201209H22NJT
Product Description

Product Overview

The VHF201209H Series Chip High Frequency Inductors are designed for high-frequency applications. These multilayer chip inductors feature a ceramic body and are available in various inductance values with tight tolerances. They are suitable for applications requiring reliable performance and stability.

Product Attributes

  • Product Type: Chip high frequency inductors
  • Series: VHF201209H
  • Body Material: Ceramic (Al2O3)
  • Inner Electrode Material: Silver (Ag)
  • Terminal Electrode Material: Silver (Ag) layer with Ni/Sn plating
  • Packaging: Tape & Reel
  • ODS Usage: Free of CCl4, HCFC, and other ODS.
  • Lead Free: Compliant with RoHS directive if specified as "Unitary lead free".

Technical Specifications

Part No. Inductance (nH) Q Value (min) DCR () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max
VHF201209H1N5T 1.5 10 0.10 100 50 6000 500
VHF201209H1N8T 1.8 10 0.10 100 50 6000 500
VHF201209H2N2T 2.2 10 0.10 100 50 6000 500
VHF201209H2N7T 2.7 12 0.10 100 50 5500 500
VHF201209H3N3T 3.3 12 0.13 100 50 5000 500
VHF201209H3N9T 3.9 12 0.15 100 50 4500 500
VHF201209H4N3T 4.3 12 0.20 100 50 4000 500
VHF201209H4N7T 4.7 12 0.20 100 50 4000 500
VHF201209H5N6T 5.6 15 0.23 100 50 3500 500
VHF201209H6N8T 6.8 15 0.25 100 50 3000 500
VHF201209H8N2T 8.2 15 0.28 100 50 2500 500
VHF201209H10NT 10 15 0.30 100 50 2200 500
VHF201209H12NT 12 15 0.35 100 50 2000 500
VHF201209H15NT 15 15 0.40 100 50 1800 500
VHF201209H18NT 18 15 0.45 100 50 1600 300
VHF201209H22NT 22 15 0.50 100 50 1500 300
VHF201209H27NJT 27 15 0.55 100 50 1400 300
VHF201209H33NT 33 15 0.60 100 50 1300 300
VHF201209H39NT 39 15 0.65 100 50 1100 300
VHF201209H43NT 43 18 0.70 100 50 1000 300
VHF201209H47NT 47 18 0.70 100 50 1000 300
VHF201209H56NT 56 18 0.75 100 50 900 300
VHF201209H68NT 68 18 0.80 100 50 850 300
VHF201209H82NT 82 18 0.90 100 50 800 300
VHF201209HR10T 100 18 0.90 100 50 700 300
VHF201209HR12T 120 13 0.95 50 50 600 300
VHF201209HR15T 150 13 1.20 50 50 550 300
VHF201209HR18T 180 13 1.30 50 50 500 300
VHF201209HR22T 220 12 1.50 50 50 400 300
VHF201209HR27T 270 12 1.80 50 50 350 300
VHF201209HR33T 330 12 2.00 50 50 300 300
VHF201209HR39T 390 10 2.00 50 50 250 300
VHF201209HR47T 470 10 2.00 50 50 200 300
VHF201209H4N3ST 4.3 12 0.20 100 50 4000 500
VHF201209H43NJT 43 18 0.70 100 50 1000 300

Dimensions

Size L (mm) W (mm) T (mm)
201209 2.00.20 1.20.20 0.90.20

Inductance Tolerance

  • Ls < 6.8nH: Select "S/D" level (S: 0.3nH, D: 0.5nH)
  • Ls 6.8nH: Select "J/K" level (J: 5%, K: 10%)

Compensation Value Table

Product Series Inductance Range Test Frequency Compensation Value
VHF201209H LsR12 100MHz Ls39N: 0nH; 39NLs68N: -1nH; 75NLsR12: -2nH
LsR12 50MHz Ls=R12: -2nH; R15LsR18: -4nH; Ls=R22: -5nH; Ls=R27: -8nH; Ls=R33: -9nH; Ls=R39: -11nH; Ls=R47: -13nH

Explanation: Test values = Nominal inductance - Compensation value. Example: For VHF201209H56NJT, nominal inductance is 56nH, compensation value is -1nH, so the actual test center value is 57nH (57nH = 56nH - (-1nH)).

Reliability Testing Items

No. Item Requirements Test Methods and Remarks
1 Operating Temperature Range -40+85
2 Solder ability At least 95% of terminal electrode should be covered with solder. Preheating: 120-150 (60s); Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder Temp: 2455; Immersion Depth: 10mm; Duration: 51s.
3 Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: 10% (H material); Q value change: 20% (ceramic). Preheating: 120-150 (60s); Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder Temp: 2605; Immersion Depth: 10mm; Duration: 101s.
4 Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 2012 series. Keep time: 101S.
5 Low temperature resistance No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). Temperature: -402; Testing time: 1000 24 0 h.
6 Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate; Curvature: 2mm; Hold time: 20s1s; Compression speed: 0.5mm/s.
7 Vibration No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). Amplitude: 1.5mm; Test time: 2h in each of 3 perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz (1 min).
8 High temperature resistance No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). Testing time: 1000 24 0 h; Temperature: 852.
9 Static Humidity No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). Humidity: 90-95% RH; Temperature: 602; Testing time: 1000 24 0 h.
10 High temperature load No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). Imposed current: rated current; Testing time: 1000 24 0 h; Temperature: 852.
11 Temperature Shock No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). Temperature: -55 (303 min) +125 (303 min); Number of cycles: 100.

Note: For electrical performance tests, measurements shall be made after 242hrs of recovery under standard conditions.

Packaging

Size Pieces per Reel Pieces per Box Pieces per Case
201209 4000 40000 240000

Recommended Soldering Conditions

  • Reflow Soldering: Products are suitable for reflow soldering.
  • Preheating: Temperature difference between product surface and solder should not exceed 150. Cooling difference after soldering should not exceed 100.
  • Hand Soldering: Iron Temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S (Avoid touching terminal electrodes).

Cleaning

  • Cleaning Temperature: 60 (Max)
  • Cleaning Time: 1 minute (Min)
  • Ultrasonic Power: 200W (Max)

Storage Requirements

  • Storage Period: Within 1 year from the inspection date. If exceeding 1 year, solderability must be checked before use.
  • Storage Conditions:
    • Warehouse Temperature: -10+40, Relative Humidity: 3070%.
    • Avoid storage in corrosive substances (sulfur, chlorine gas, acid).
    • Store on shelves to prevent influence from moisture and dust.
    • Avoid heat shock, vibration, and direct sunlight.
    • Products should be stored in airtight packaging.

Notes

  • If the product is designated "Unitary lead free", it complies with RoHS directive requirements.
  • This product specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
  • The manufacturer does not warrant against failure caused by any use of the product that deviates from the intended use described in this specification.

2411220522_FH-VHF201209H22NJT_C139277.pdf

Request A Quote

Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible

You Can Upload Up To 5 Files And Each File Sized 10M Max