Product Overview
The VHF201209H Series Chip High Frequency Inductors are designed for high-frequency applications. These multilayer chip inductors feature a ceramic body and are available in various inductance values with tight tolerances. They are suitable for applications requiring reliable performance and stability.
Product Attributes
- Product Type: Chip high frequency inductors
- Series: VHF201209H
- Body Material: Ceramic (Al2O3)
- Inner Electrode Material: Silver (Ag)
- Terminal Electrode Material: Silver (Ag) layer with Ni/Sn plating
- Packaging: Tape & Reel
- ODS Usage: Free of CCl4, HCFC, and other ODS.
- Lead Free: Compliant with RoHS directive if specified as "Unitary lead free".
Technical Specifications
| Part No. | Inductance (nH) | Q Value (min) | DCR () max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA) max |
|---|---|---|---|---|---|---|---|
| VHF201209H1N5T | 1.5 | 10 | 0.10 | 100 | 50 | 6000 | 500 |
| VHF201209H1N8T | 1.8 | 10 | 0.10 | 100 | 50 | 6000 | 500 |
| VHF201209H2N2T | 2.2 | 10 | 0.10 | 100 | 50 | 6000 | 500 |
| VHF201209H2N7T | 2.7 | 12 | 0.10 | 100 | 50 | 5500 | 500 |
| VHF201209H3N3T | 3.3 | 12 | 0.13 | 100 | 50 | 5000 | 500 |
| VHF201209H3N9T | 3.9 | 12 | 0.15 | 100 | 50 | 4500 | 500 |
| VHF201209H4N3T | 4.3 | 12 | 0.20 | 100 | 50 | 4000 | 500 |
| VHF201209H4N7T | 4.7 | 12 | 0.20 | 100 | 50 | 4000 | 500 |
| VHF201209H5N6T | 5.6 | 15 | 0.23 | 100 | 50 | 3500 | 500 |
| VHF201209H6N8T | 6.8 | 15 | 0.25 | 100 | 50 | 3000 | 500 |
| VHF201209H8N2T | 8.2 | 15 | 0.28 | 100 | 50 | 2500 | 500 |
| VHF201209H10NT | 10 | 15 | 0.30 | 100 | 50 | 2200 | 500 |
| VHF201209H12NT | 12 | 15 | 0.35 | 100 | 50 | 2000 | 500 |
| VHF201209H15NT | 15 | 15 | 0.40 | 100 | 50 | 1800 | 500 |
| VHF201209H18NT | 18 | 15 | 0.45 | 100 | 50 | 1600 | 300 |
| VHF201209H22NT | 22 | 15 | 0.50 | 100 | 50 | 1500 | 300 |
| VHF201209H27NJT | 27 | 15 | 0.55 | 100 | 50 | 1400 | 300 |
| VHF201209H33NT | 33 | 15 | 0.60 | 100 | 50 | 1300 | 300 |
| VHF201209H39NT | 39 | 15 | 0.65 | 100 | 50 | 1100 | 300 |
| VHF201209H43NT | 43 | 18 | 0.70 | 100 | 50 | 1000 | 300 |
| VHF201209H47NT | 47 | 18 | 0.70 | 100 | 50 | 1000 | 300 |
| VHF201209H56NT | 56 | 18 | 0.75 | 100 | 50 | 900 | 300 |
| VHF201209H68NT | 68 | 18 | 0.80 | 100 | 50 | 850 | 300 |
| VHF201209H82NT | 82 | 18 | 0.90 | 100 | 50 | 800 | 300 |
| VHF201209HR10T | 100 | 18 | 0.90 | 100 | 50 | 700 | 300 |
| VHF201209HR12T | 120 | 13 | 0.95 | 50 | 50 | 600 | 300 |
| VHF201209HR15T | 150 | 13 | 1.20 | 50 | 50 | 550 | 300 |
| VHF201209HR18T | 180 | 13 | 1.30 | 50 | 50 | 500 | 300 |
| VHF201209HR22T | 220 | 12 | 1.50 | 50 | 50 | 400 | 300 |
| VHF201209HR27T | 270 | 12 | 1.80 | 50 | 50 | 350 | 300 |
| VHF201209HR33T | 330 | 12 | 2.00 | 50 | 50 | 300 | 300 |
| VHF201209HR39T | 390 | 10 | 2.00 | 50 | 50 | 250 | 300 |
| VHF201209HR47T | 470 | 10 | 2.00 | 50 | 50 | 200 | 300 |
| VHF201209H4N3ST | 4.3 | 12 | 0.20 | 100 | 50 | 4000 | 500 |
| VHF201209H43NJT | 43 | 18 | 0.70 | 100 | 50 | 1000 | 300 |
Dimensions
| Size | L (mm) | W (mm) | T (mm) |
|---|---|---|---|
| 201209 | 2.00.20 | 1.20.20 | 0.90.20 |
Inductance Tolerance
- Ls < 6.8nH: Select "S/D" level (S: 0.3nH, D: 0.5nH)
- Ls 6.8nH: Select "J/K" level (J: 5%, K: 10%)
Compensation Value Table
| Product Series | Inductance Range | Test Frequency | Compensation Value |
|---|---|---|---|
| VHF201209H | LsR12 | 100MHz | Ls39N: 0nH; 39NLs68N: -1nH; 75NLsR12: -2nH |
| LsR12 | 50MHz | Ls=R12: -2nH; R15LsR18: -4nH; Ls=R22: -5nH; Ls=R27: -8nH; Ls=R33: -9nH; Ls=R39: -11nH; Ls=R47: -13nH |
Explanation: Test values = Nominal inductance - Compensation value. Example: For VHF201209H56NJT, nominal inductance is 56nH, compensation value is -1nH, so the actual test center value is 57nH (57nH = 56nH - (-1nH)).
Reliability Testing Items
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder. | Preheating: 120-150 (60s); Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder Temp: 2455; Immersion Depth: 10mm; Duration: 51s. |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: 10% (H material); Q value change: 20% (ceramic). | Preheating: 120-150 (60s); Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder Temp: 2605; Immersion Depth: 10mm; Duration: 101s. |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 2012 series. Keep time: 101S. |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). | Temperature: -402; Testing time: 1000 24 0 h. |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; Curvature: 2mm; Hold time: 20s1s; Compression speed: 0.5mm/s. |
| 7 | Vibration | No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). | Amplitude: 1.5mm; Test time: 2h in each of 3 perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz (1 min). |
| 8 | High temperature resistance | No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). | Testing time: 1000 24 0 h; Temperature: 852. |
| 9 | Static Humidity | No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). | Humidity: 90-95% RH; Temperature: 602; Testing time: 1000 24 0 h. |
| 10 | High temperature load | No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). | Imposed current: rated current; Testing time: 1000 24 0 h; Temperature: 852. |
| 11 | Temperature Shock | No mechanical damage. Inductance change: < 10%; Q value change: < 20% (ceramic). | Temperature: -55 (303 min) +125 (303 min); Number of cycles: 100. |
Note: For electrical performance tests, measurements shall be made after 242hrs of recovery under standard conditions.
Packaging
| Size | Pieces per Reel | Pieces per Box | Pieces per Case |
|---|---|---|---|
| 201209 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
- Reflow Soldering: Products are suitable for reflow soldering.
- Preheating: Temperature difference between product surface and solder should not exceed 150. Cooling difference after soldering should not exceed 100.
- Hand Soldering: Iron Temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S (Avoid touching terminal electrodes).
Cleaning
- Cleaning Temperature: 60 (Max)
- Cleaning Time: 1 minute (Min)
- Ultrasonic Power: 200W (Max)
Storage Requirements
- Storage Period: Within 1 year from the inspection date. If exceeding 1 year, solderability must be checked before use.
- Storage Conditions:
- Warehouse Temperature: -10+40, Relative Humidity: 3070%.
- Avoid storage in corrosive substances (sulfur, chlorine gas, acid).
- Store on shelves to prevent influence from moisture and dust.
- Avoid heat shock, vibration, and direct sunlight.
- Products should be stored in airtight packaging.
Notes
- If the product is designated "Unitary lead free", it complies with RoHS directive requirements.
- This product specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
- The manufacturer does not warrant against failure caused by any use of the product that deviates from the intended use described in this specification.
2411220522_FH-VHF201209H22NJT_C139277.pdf
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