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Quality Wire Wound Chip Inductor FH FHW1812IF101JST Ferrite Core 1812 Size Reel Packaging RoHS Compliant factory
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Quality Wire Wound Chip Inductor FH FHW1812IF101JST Ferrite Core 1812 Size Reel Packaging RoHS Compliant factory
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Specifications
Current Rating:
220mA
Inductance:
100uH
Tolerance:
±5%
Frequency - Self Resonant:
4MHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
Ratings:
-
Q @ Frequency:
10@796kHz
Mfr. Part #:
FHW1812IF101JST
Package:
1812
Key Attributes
Model Number: FHW1812IF101JST
Product Description

Product Overview

The FHW1812IF series wire wound chip inductors are designed for various electronic applications. These inductors feature a ferrite core construction and are available in the 1812 size. They are manufactured by APP and are suitable for reflow soldering processes. The series offers a range of inductance values with specified tolerances and electrical characteristics, including DC resistance and rated current. They are designed to meet stringent reliability testing standards, ensuring performance in diverse operating conditions.

Product Attributes

  • Manufacturer: APP
  • Series: FHW1812IF
  • Type: Wire Wound Chip Inductor
  • Core Material: Ferrite (Ni-Zn ferrite)
  • Terminal Material: Tin (Sn)
  • Packaging Type: Reel (T)
  • Compliance: RoHS directive

Technical Specifications

Part Number Inductance (H) Tolerance Test Frequency (MHz) Q Value (Min) Q Test Frequency (MHz) Max. DC Resistance () Test Voltage (mV) Min. SRF (MHz) Max. Rated Current (mA) Dimensions (L x W x T)
FHW1812IFR33ST 0.33 J, K 25.2 10 25.2 0.13 500 380 1000 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IFR56ST 0.56 J, K 25.2 10 25.2 0.15 500 300 1000 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IFR82ST 0.82 J, K 25.2 10 25.2 0.20 500 250 1000 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF1R0ST 1.0 J, K 7.96 15 7.96 0.22 500 200 1000 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF1R2ST 1.2 J, K 7.96 15 7.96 0.35 500 200 1000 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF1R5ST 1.5 J, K 7.96 15 7.96 0.32 500 180 1000 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF1R8ST 1.8 J, K 7.96 15 7.96 0.35 500 160 950 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF2R2ST 2.2 J, K 7.96 15 7.96 0.37 500 150 900 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF2R7ST 2.7 J, K 7.96 15 7.96 0.37 500 145 850 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF3R3ST 3.3 J, K 7.96 15 7.96 0.48 500 140 800 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF3R9ST 3.9 J, K 7.96 15 7.96 0.60 500 135 750 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF4R7ST 4.7 J, K 7.96 15 7.96 1.00 500 120 700 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF5R6ST 5.6 J, K 7.96 15 7.96 0.55 500 110 650 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF6R8ST 6.8 J, K 7.96 15 7.96 0.80 500 80 600 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF8R2ST 8.2 J, K 7.96 10 7.96 0.85 500 70 600 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF100ST 10 J, K 2.52 10 2.52 1.00 500 65 550 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF101ST 100 J, K 0.796 10 0.796 3.00 500 4.0 220 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
FHW1812IF102ST 1000 K 0.252 6 0.252 16.5 500 1.4 90 4.80(0.189) x 3.40(0.134) x 3.15(0.124)
Dimensions (Size 1812): L: 4.80(0.189) mm(inch), W: 3.40(0.134) mm(inch), T: 3.15(0.124) mm(inch)
Operating Temperature Range: -40 to +85

Reliability Testing Items

Item Requirements Test Methods and Remarks
Solder ability Electrode surface solder coverage: 80% Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for 51s.
Resistance to Soldering Heat Inductance change: 5% max.
Q value change: 10% max.
Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for 101s.
Vibration Inductance change: 5% max.
Q value change: 10% max.
Amplitude 1.5mm, frequency 10~55Hz, for 2h in each of three axes (X, Y, Z).
Low temperature resistance Inductance change: 5% max.
Q value change: 10% max.
Subjected to -402 for 1000+24/-0 h.
High temperature resistance Inductance change: 5% max.
Q value change: 10% max.
Subjected to +855 for 1000+24/-0 h.
Temperature Shock Inductance change: 5% max.
Q value change: 10% max.
+85 for 30 minutes -40 for 30 minutes, 100 Cycles.
High temperature load Inductance change: 5% max.
Q value change: 10% max.
Store at 852 for 1000+24/-0 h with rated current applied.
Static Humidity Inductance change: 5% max.
Q value change: 10% max.
Subjected to 90%95% RH at 602 for 1000+24/-0 h.
Solvent Resistance Inductance change: 5% max.
Q value change: 10% max.
Soak in isopropyl alcohol solution at 235 for 50.5 min.

Product Packaging

Packaging Type: Reel (T)

Reel Dimensions (Unit: mm): A typ. 330, B typ. 98, C typ. 13, D typ. 12.4

Taping Dimensions (Unit: mm) for 1812 series: W: 12.00, E: 1.75, F: 5.50, D0: 1.55, D1: 1.50, P0: 4, P1: 8, P2: 2, P010: 40, t: 0.25, A0: 3.22, B0: 4.82, K0: 2.98

Peeling off force (1812 series): 20g100g

Packaging Quantity (Unit: Pcs):

  • Per Reel (1812): 2000
  • Per Box (3 Reel Box): 6000
  • Per Box (5 Reel Box): 10000
  • Per Case (1.5 Box Case): 9000
  • Per Case (2 Box Case): 12000
  • Per Case (3 Box Case): 18000
  • Per Case (4 Box Case): 24000
  • Per Case (6 Box Case): 36000
  • Per Case (Large 3 Box Case): 30000

Recommended Soldering Conditions

Soldering Method: Reflow soldering.

Flux: Rosin-based flux. Avoid highly acidic flux with halide content exceeding 0.2(wt)%.

Solder: Lead-free solder (96.5Sn /3.0Ag/0.5Cu).

Soldering Requirements:

  • Temperature difference between solder and product surface during pre-heating: Max 150.
  • Temperature difference between product surface and solvent during cooling: Max 100.
  • Soldering should be performed within the allowable range of the reflow soldering profile curve.

Manual Soldering:

  • Soldering Iron Temperature: 350 (Max)
  • Power: 30W (Max)
  • Soldering Time: < 5S (Avoid touching the coil and encapsulation layer).

Cleaning

Cleaning Conditions:

  • Cleaning Temperature: 60 (Max)
  • Cleaning Time: 5 minutes (Max)
  • Ultrasonic Power: 200W (Max)

Storage Requirements

Storage Period: Within 1 year from the inspection date at the inductor company. If exceeding 1 year, check solderability before use.

Storage Conditions:

  • Warehouse Temperature: -10 to +40
  • Relative Humidity: 30% to 70%
  • Do not store in corrosive substances (sulfur, chlorine gas, acid).
  • Store on a shelf to prevent influence from humidity and dust.
  • Avoid heat shock, vibration, and direct sunlight.
  • Products should be stored in airtight packaged condition.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 (carbon tetrachloride) and HCFC in its production process.

Notes

  • Product complies with RoHS directive.
  • Ensure your product has been evaluated and confirmed against your specifications when our product is mounted.
  • The company does not warrant against failure caused by any use of the product that deviates from the intended use.
  • Do not touch wire with sharp objects such as tweezers to prevent wire breakage.

2410121310_FH-FHW1812IF101JST_C394133.pdf

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