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Quality High frequency chip inductors FH VHF160808H33NJT with ceramic Al2O3 body silver inner electrodes and RoHS compliance factory
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Quality High frequency chip inductors FH VHF160808H33NJT with ceramic Al2O3 body silver inner electrodes and RoHS compliance factory
>
Specifications
Current Rating:
300mA
Inductance:
33nH
Tolerance:
±5%
Frequency - Self Resonant:
1.5GHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
800mΩ
Type:
Multilayer Inductor;High-frequency Inductor
Ratings:
-
Q @ Frequency:
12@100MHz
Mfr. Part #:
VHF160808H33NJT
Package:
0603
Key Attributes
Model Number: VHF160808H33NJT
Product Description

Product Overview

The VHF160808H Series Chip High Frequency Inductors are designed for high-frequency applications. Constructed with a ceramic body, inner electrodes of pure silver, and terminal electrodes with silver and Ni/Sn plating, these inductors offer reliable performance. They are suitable for various electronic circuits requiring precise inductance values and stable electrical characteristics.

Product Attributes

  • Product Type: Chip high frequency inductors
  • Series: VHF160808H
  • Materials: Ceramic body (Al2O3), Inner electrode (Ag), Terminal electrode (Ag layer, Ni-Sn plating)
  • Packaging: Tape & Reel
  • Certifications: RoHS compliant (for "Unitary lead free" products)

Technical Specifications

Part NO. Inductance (nH) Q Value (min) DCR () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max Dimensions (LWT) mm
VHF160808H1N0T 1.0 8 0.05 100 50 10000 500 1.60.80.8
VHF160808H1N2T 1.2 8 0.05 100 50 10000 500 1.60.80.8
VHF160808H1N5T 1.5 8 0.10 100 50 6000 500 1.60.80.8
VHF160808H1N8T 1.8 8 0.10 100 50 6000 500 1.60.80.8
VHF160808H2N0T 2.0 8 0.10 100 50 6000 500 1.60.80.8
VHF160808H2N2T 2.2 8 0.10 100 50 6000 500 1.60.80.8
VHF160808H2N4T 2.4 8 0.12 100 50 6000 500 1.60.80.8
VHF160808H2N7T 2.7 10 0.12 100 50 6000 500 1.60.80.8
VHF160808H3N3T 3.3 10 0.15 100 50 6000 500 1.60.80.8
VHF160808H3N6T 3.6 10 0.16 100 50 6000 500 1.60.80.8
VHF160808H3N9T 3.9 10 0.16 100 50 6000 500 1.60.80.8
VHF160808H4N3T 4.3 10 0.18 100 50 6000 500 1.60.80.8
VHF160808H4N7T 4.7 10 0.20 100 50 6000 500 1.60.80.8
VHF160808H5N1T 5.1 10 0.25 100 50 5500 500 1.60.80.8
VHF160808H5N6T 5.6 10 0.25 100 50 5000 500 1.60.80.8
VHF160808H6N8T 6.8 10 0.30 100 50 5000 500 1.60.80.8
VHF160808H7N5T 7.5 10 0.35 100 50 4500 500 1.60.80.8
VHF160808H8N2T 8.2 10 0.35 100 50 4500 500 1.60.80.8
VHF160808H9N1T 9.1 10 0.40 100 50 3500 500 1.60.80.8
VHF160808H10NT 10 12 0.40 100 50 3500 300 1.60.80.8
VHF160808H12NT 12 12 0.45 100 50 3000 300 1.60.80.8
VHF160808H15NT 15 12 0.50 100 50 2300 300 1.60.80.8
VHF160808H18NT 18 12 0.55 100 50 2200 300 1.60.80.8
VHF160808H22NT 22 12 0.60 100 50 2000 300 1.60.80.8
VHF160808H24NT 24 12 0.60 100 50 2000 300 1.60.80.8
VHF160808H27NT 27 12 0.65 100 50 1700 300 1.60.80.8
VHF160808H33NT 33 12 0.70 100 50 1500 300 1.60.80.8
VHF160808H36NT 36 12 0.70 100 50 1400 300 1.60.80.8
VHF160808H39NT 39 12 0.70 100 50 1400 300 1.60.80.8
VHF160808H47NT 47 12 0.70 100 50 1200 300 1.60.80.8
VHF160808H56NT 56 12 0.75 100 50 1100 300 1.60.80.8
VHF160808H68NT 68 12 0.85 100 50 900 300 1.60.80.8
VHF160808H82NT 82 8 1.00 100 50 800 300 1.60.80.8
VHF160808HR10T 100 8 1.20 100 50 700 300 1.60.80.8
VHF160808HR12T 120 8 1.40 50 50 600 200 1.60.80.8
VHF160808HR15T 150 8 1.60 50 50 500 200 1.60.80.8
VHF160808HR18T 180 8 1.90 50 50 400 200 1.60.80.8
VHF160808HR22T 220 8 2.40 50 50 350 200 1.60.80.8
VHF160808HR27T 270 8 2.60 50 50 350 150 1.60.80.8
VHF160808HR33T 330 8 2.80 50 50 350 150 1.60.80.8
VHF160808HR39T 390 8 3.20 50 50 300 150 1.60.80.8
VHF160808HR43T 430 8 3.40 50 50 280 150 1.60.80.8
VHF160808HR47T 470 8 3.60 50 50 250 150 1.60.80.8

Reliability Testing Items

Item Requirements Test Methods and Remarks
Operating Temperature Range -40+85
Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s
Resistance to Soldering Heat At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change within 10%; Q value change (ceramic) within 20% Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s
Adhesion of electrode The termination and body should be no damage. Applied force: 7N for 1608 series. Keep time: 101S
Low temperature resistance No mechanical damage. Inductance change within 10%; Q value change (ceramic) within 20% Temperature: -402; Testing time: 1000+24/-0 h
Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s
Vibration No mechanical damage. Inductance change within 10%; Q value change (ceramic) within 20% Amplitude: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
High temperature resistance No mechanical damage. Inductance change within 10%; Q value change (ceramic) within 20% Testing time: 1000+24/-0 h; Temperature: 852
Static Humidity No mechanical damage. Inductance change within 10%; Q value change (ceramic) within 20% Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000+24/-0 h
High temperature load No mechanical damage. Inductance change within 10%; Q value change (ceramic) within 20% Impose current: rated current; Testing time: 1000+24/-0 h; Temperature: 852
Temperature Shock No mechanical damage. Inductance change within 10%; Q value change (ceramic) within 20% Temperature: -55 for 303min +125 for 303min; Number of cycles: 100

Packaging

Size Pieces per REEL Pieces per BOX Pieces per CASE
160808 4000 40000 240000

Recommended Soldering Conditions

Products are suitable for reflow soldering.

  • Soldering Conditions: Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 max. Cooling into solvent after soldering should be limited to 100 max.
  • Reflow Soldering Profile: Products should be soldered within the allowable range indicated by the slanted line.
  • Iron Soldering: Soldering Iron Temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes).

Cleaning

  • Cleaning Temperature: 60 max
  • Cleaning Time: 1 minute min.
  • Ultrasonic Power: 200W max

Storage Requirements

  • Storage Period: Within 1 year from the factory inspection date. If exceeded, check solderability before use.
  • Storage Conditions:
    • Warehouse Temperature: -10+40, Humidity: 3070% relative humidity.
    • Do not store in corrosive gases (sulfur, chlorine gas, acid) to prevent electrode oxidation.
    • Store on pallets to prevent influence from humidity and dust.
    • Avoid heat shock, vibration, and direct sunlight.
    • Store in sealed packaging.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 and HCFC in its production process.

Notes

  • "Unitary lead free" products comply with RoHS directive requirements.
  • This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when our product is mounted.
  • The company does not warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.

2410121258_FH-VHF160808H33NJT_C90209.pdf

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