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Specifications
Current Rating:
50mA
Inductance:
47nH
Frequency - Self Resonant:
260MHz
Tolerance:
±10%
DC Resistance(DCR):
200mΩ
Type:
Multilayer Inductor;High-frequency Inductor
Q @ Frequency:
15@50MHz
Mfr. Part #:
CMI160808V47NKT
Package:
0603
Key Attributes
Model Number:
CMI160808V47NKT
Product Description
Product Overview
The CMI160808 Series Multilayer Chip Ferrite Inductors are designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with Ni/Sn plating. They offer a range of inductance values and electrical characteristics suitable for signal filtering and energy storage in compact electronic devices.
Product Attributes
- Product Type: Multilayer Chip Ferrite Inductors
- Series: CMI160808 Series
- Body Material: Ferrite (Ni-Cu-Zn system) or Ceramic
- Inner Electrode Material: Pure Silver (Ag)
- Terminal Electrode Material: Silver Layer (Ag Layer) with Ni/Sn Plating
- Packaging: Tape & Reel
- RoHS Compliance: Indicated by "Unitary lead free" label.
Technical Specifications
| Part NO. | Tolerance (%) | Inductance (H) | Q Value (min) | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA)max | Dimensions (LWT) mm |
|---|---|---|---|---|---|---|---|---|---|
| CMI160808V47NKT | 10 | 0.047 | 15 | 0.20 | 50 | 50 | 260 | 50 | 1.60.80.8 |
| CMI160808V56NKT | 10 | 0.056 | 15 | 0.20 | 50 | 50 | 260 | 50 | 1.60.80.8 |
| CMI160808V68NKT | 10 | 0.068 | 15 | 0.20 | 50 | 50 | 250 | 50 | 1.60.80.8 |
| CMI160808V82NKT | 10 | 0.082 | 15 | 0.20 | 50 | 50 | 245 | 50 | 1.60.80.8 |
| CMI160808VR10KT | 10 | 0.10 | 20 | 0.25 | 25 | 50 | 240 | 50 | 1.60.80.8 |
| CMI160808VR12KT | 10 | 0.12 | 20 | 0.30 | 25 | 50 | 205 | 50 | 1.60.80.8 |
| CMI160808VR15KT | 10 | 0.15 | 20 | 0.30 | 25 | 50 | 180 | 50 | 1.60.80.8 |
| CMI160808VR18KT | 10 | 0.18 | 20 | 0.30 | 25 | 50 | 165 | 50 | 1.60.80.8 |
| CMI160808VR22KT | 10 | 0.22 | 20 | 0.40 | 25 | 50 | 150 | 50 | 1.60.80.8 |
| CMI160808VR27KT | 10 | 0.27 | 20 | 0.45 | 25 | 50 | 136 | 50 | 1.60.80.8 |
| CMI160808VR33KT | 10 | 0.33 | 20 | 0.50 | 25 | 50 | 125 | 50 | 1.60.80.8 |
| CMI160808VR39KT | 10 | 0.39 | 20 | 0.60 | 25 | 50 | 110 | 50 | 1.60.80.8 |
| CMI160808VR47KT | 10 | 0.47 | 20 | 0.70 | 25 | 50 | 105 | 50 | 1.60.80.8 |
| CMI160808VR56KT | 10 | 0.56 | 20 | 0.70 | 25 | 50 | 95 | 50 | 1.60.80.8 |
| CMI160808VR68KT | 10 | 0.68 | 20 | 0.90 | 25 | 50 | 90 | 50 | 1.60.80.8 |
| CMI160808VR82KT | 10 | 0.82 | 20 | 1.00 | 25 | 50 | 85 | 50 | 1.60.80.8 |
| CMI160808U1R0KT | 10 | 1.0 | 25 | 0.50 | 10 | 50 | 75 | 25 | 1.60.80.8 |
| CMI160808U1R2KT | 10 | 1.2 | 25 | 0.55 | 10 | 50 | 65 | 25 | 1.60.80.8 |
| CMI160808U1R5KT | 10 | 1.5 | 25 | 0.70 | 10 | 50 | 60 | 25 | 1.60.80.8 |
| CMI160808U1R8KT | 10 | 1.8 | 25 | 0.75 | 10 | 50 | 55 | 25 | 1.60.80.8 |
| CMI160808U2R2KT | 10 | 2.2 | 25 | 0.80 | 10 | 50 | 50 | 25 | 1.60.80.8 |
| CMI160808U2R7KT | 10 | 2.7 | 25 | 0.90 | 10 | 50 | 45 | 15 | 1.60.80.8 |
| CMI160808U3R3KT | 10 | 3.3 | 25 | 1.00 | 10 | 50 | 40 | 15 | 1.60.80.8 |
| CMI160808U3R9KT | 10 | 3.9 | 25 | 1.30 | 10 | 50 | 35 | 15 | 1.60.80.8 |
| CMI160808U4R7KT | 10 | 4.7 | 25 | 1.50 | 10 | 50 | 33 | 15 | 1.60.80.8 |
| CMI160808J5R6KT | 10 | 5.6 | 12 | 1.55 | 4 | 50 | 22 | 5 | 1.60.80.8 |
| CMI160808J6R8KT | 10 | 6.8 | 12 | 1.55 | 4 | 50 | 20 | 5 | 1.60.80.8 |
| CMI160808J8R2KT | 10 | 8.2 | 12 | 1.65 | 4 | 50 | 18 | 5 | 1.60.80.8 |
| CMI160808J100KT | 10 | 10 | 20 | 1.75 | 2 | 50 | 17 | 3 | 1.60.80.8 |
| CMI160808J120KT | 10 | 12 | 20 | 1.85 | 2 | 50 | 15 | 3 | 1.60.80.8 |
| CMI160808J150MT | 20 | 15 | 20 | 2.50 | 1 | 50 | 14 | 1 | 1.60.80.8 |
| CMI160808J180MT | 20 | 18 | 20 | 2.70 | 1 | 50 | 13 | 1 | 1.60.80.8 |
| CMI160808J220MT | 20 | 22 | 20 | 3.00 | 1 | 50 | 12 | 1 | 1.60.80.8 |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | |
| Solder ability | At least 95% of terminal electrode should be covered with solder. | Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth: 10mm, Duration: 51s, Dip performance to a flux of about: 3 ~ 5 s |
| Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: V,U within 20%, X within 25%, J within 30%. Q value change (ferrite): within 30% | Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth: 10mm, Duration: 101s, Dip performance to a flux of about: 3 ~ 5 s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 7N for 1608 series. Keep time: 101S |
| Low temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Temperature: -402, Testing time: 1000 +240/-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate. For 0.5 mm/s compression speed, curvature: 2mm, hold time: 20s1s. |
| Vibration | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Amplitude modulation: 1.5mm. Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature resistance | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Testing time: 1000 +240/-0 h, Temperature: 852 |
| Static Humidity | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Humidity: 90% to 95% RH, Temperature: 602, Testing time: 1000 +240/-0 h |
| High temperature load | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Impose current: rated current. Testing time: 1000 +240/-0 h, Temperature: 852 |
| Temperature Shock | No mechanical damage. Inductance change: within 10%. Q value change (ferrite): within 30% | Temperature: -40 for 303min +85 for 303min, Number of cycles: 32 |
| Size | REEL | BOX | CASE |
|---|---|---|---|
| 160808 | 4000 | 40000 | 240000 |
| Soldering Conditions | Details |
|---|---|
| Reflow Soldering | Pre-heating: temperature difference between solder and ferrite surface 150 max. Cooling into solvent after soldering: temperature difference 100 max. Ensure soldering within allowable profile range. |
| Iron Soldering | Temperature: 350 (Max), Power: 30W (Max), Soldering Time: < 5S (Avoid contact with terminal electrodes). |
| Cleaning Conditions | Details |
|---|---|
| Temperature | 60 (max) |
| Time | 1 minute (min) |
| Ultrasonic Power | 200W (max) |
| Storage Requirements | Details |
|---|---|
| Storage Period | Within 1 year from inspection date. If exceeded, check solder ability. |
| Storage Conditions | Temperature: -10 to +40, Humidity: 30% to 70% RH. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Store in airtight packaging. |
ODS Usage
The company does not use ODS such as CCl4 and HCFC in its production processes.
Notes
- Products labeled "Unitary lead free" comply with RoHS directive requirements.
- This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when our product is mounted.
- Failure caused by uses deviating from the intended use described in this specification is not warranted.
2409271733_FH-CMI160808V47NKT_C3032610.pdf
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