Product Overview
The CMP321609-D Series is a Multilayer Chip Ferrite Power Inductor designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with silver layers and Ni/Sn plating. They offer reliable performance and are suitable for reflow soldering processes. The series is manufactured to meet stringent quality and reliability standards, ensuring consistent performance in demanding environments.
Product Attributes
- Product Type: Multilayer Chip Ferrite Power Inductor
- Series: CMP321609-D Series
- Manufacturer: (Implied, not explicitly stated)
- Material (Body): Ferrite (Ni-Cu-Zn system) or Ceramic
- Material (Inner Electrode): Pure Silver (Ag)
- Material (Terminal Electrode): Silver Layer (Ag) with Ni/Sn Plating
- Packaging: Tape & Reel (T)
- Certifications: RoHS compliant (if marked "Unitary lead free")
Technical Specifications
| Part Number | Tolerance (%) | Inductance (H) | DC Resistance (RDC) () max | Test Frequency (MHz) | Test Voltage (mV) | Self-Resonant Frequency (SRF) (MHz) min | Rated Current (mA) max | Dimensions (LWT) (mm) |
|---|---|---|---|---|---|---|---|---|
| CMP321609UD1R0MT | 20 | 1.0 | 0.15 | 1 | 50 | 60 | 1200 | 3.21.60.9 |
| CMP321609UD1R2MT | 20 | 1.2 | 0.15 | 1 | 50 | 65 | 1200 | 3.21.60.9 |
| CMP321609UD1R5MT | 20 | 1.5 | 0.17 | 1 | 50 | 60 | 1000 | 3.21.60.9 |
| CMP321609UD1R8MT | 20 | 1.8 | 0.24 | 1 | 50 | 55 | 900 | 3.21.60.9 |
| CMP321609UD2R2MT | 20 | 2.2 | 0.24 | 1 | 50 | 50 | 900 | 3.21.60.9 |
| CMP321609UD2R7MT | 20 | 2.7 | 0.30 | 1 | 50 | 45 | 800 | 3.21.60.9 |
| CMP321609UD3R3MT | 20 | 3.3 | 0.30 | 1 | 50 | 41 | 800 | 3.21.60.9 |
| CMP321609UD3R9MT | 20 | 3.9 | 0.38 | 1 | 50 | 38 | 700 | 3.21.60.9 |
| CMP321609UD4R7MT | 20 | 4.7 | 0.38 | 1 | 50 | 35 | 700 | 3.21.60.9 |
| CMP321609UD5R6MT | 20 | 5.6 | 0.45 | 1 | 50 | 32 | 500 | 3.21.60.9 |
| CMP321609XD6R8MT | 20 | 6.8 | 0.45 | 1 | 50 | 29 | 500 | 3.21.60.9 |
| CMP321609XD8R2MT | 20 | 8.2 | 0.55 | 1 | 50 | 26 | 300 | 3.21.60.9 |
| CMP321609XD100MT | 20 | 10 | 0.55 | 1 | 50 | 24 | 300 | 3.21.60.9 |
| CMP321609XD120MT | 20 | 12 | 0.55 | 1 | 50 | 22 | 300 | 3.21.60.9 |
| CMP321609JD150MT | 20 | 15 | 0.65 | 1 | 50 | 19 | 100 | 3.21.60.9 |
| CMP321609JD180MT | 20 | 18 | 0.65 | 1 | 50 | 18 | 100 | 3.21.60.9 |
Reliability Testing Items
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40+85 | - |
| Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s |
| Resistance to Soldering Heat | Inductance change: UD: 20%, XD: 25%, JD: 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 3216 series; Keep time: 101S |
| Low temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature: -402; Testing time: 1000 +24/-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| Vibration | No mechanical damage. Inductance change: within 10% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature resistance | No mechanical damage. Inductance change: within 10% | Testing time: 1000 +24/-0 h; Temperature: 852 |
| Static Humidity | No mechanical damage. Inductance change: within 10% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +24/-0 h |
| High temperature load | No mechanical damage. Inductance change: within 10% | Impose current: rated current; Testing time: 1000 +24/-0 h; Temperature: 852 |
| Temperature Shock | No mechanical damage. Inductance change: within 10% | Temperature: -40 for 303min +85 for 303min; Number of cycles: 32 |
Product Packaging
| Size | Pieces per Reel | Pieces per Box | Pieces per Case |
|---|---|---|---|
| 321609 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
Products are suitable for reflow soldering.
- Soldering Conditions: Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 max. Cooling into solvent after soldering should be limited to 100 max.
- Iron Soldering: Soldering Iron Temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S. Take care not to apply the tip of the soldering iron to the terminal electrodes.
Cleaning Conditions
- Cleaning temperature: 60 (max)
- Cleaning time: 1 minute (min)
- Ultrasonic output power: 200W (max)
Storage Requirements
- Storage Period: Within 1 year from the manufacturing inspection date. If exceeding 1 year, solderability should be checked.
- Storage Conditions: Temperature: -10 to +40, Relative Humidity: 30% to 70%. Avoid corrosive substances, humidity, dust, heat shock, vibration, and direct sunlight. Products should be stored in airtight packaging.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in the production process.
Notes
- If the product is marked "Unitary lead free", it complies with RoHS directive requirements.
- This product specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
- The company cannot warrant against failure caused by any use of the product that deviates from the intended use as described in this product specification.
2410121310_FH-CMP321609XD100MT_C395029.pdf
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