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Quality Wire Wound Chip Inductor Tape Packaging Ceramic Core FH FHW0603UC2N2KST Series 0603 Size factory
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Quality Wire Wound Chip Inductor Tape Packaging Ceramic Core FH FHW0603UC2N2KST Series 0603 Size factory
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Specifications
Current Rating:
700mA
Inductance:
2.2nH
Tolerance:
±10%
Frequency - Self Resonant:
10GHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
90mΩ
Ratings:
-
Q @ Frequency:
12@250MHz
Mfr. Part #:
FHW0603UC2N2KST
Package:
0603
Key Attributes
Model Number: FHW0603UC2N2KST
Product Description

Product Overview

The FHW0603UC Series is a range of wire wound chip inductors designed for various electronic applications. These inductors feature a ceramic core and are available in the compact 0603 size. They offer a wide inductance range with precise tolerance options, high Q values, and low DC resistance, making them suitable for demanding circuit designs. The series is built to withstand rigorous operating conditions, including wide temperature ranges and environmental stresses, ensuring reliability and performance. They are supplied in tape packaging for automated assembly.

Product Attributes

  • Product Type: Wire Wound Chip Inductor
  • Series: FHW0603UC Series
  • Core Material: Ceramic
  • Packaging: Tape (Paper Tape)
  • Compliance: RoHS compliant

Technical Specifications

Dimensions (0603 Size):

Size L (Max) (mm/inch) W (Max) (mm/inch) T (Max) (mm/inch) A (mm/inch) B (mm/inch) C (mm/inch) D (mm/inch) E (mm/inch)
1608 (0603) 1.78 (0.070) 1.10 (0.043) 0.95 (0.037) 0.76 (0.030) 0.30 (0.012) 1.02 (0.040) 0.64 (0.025) 0.64 (0.025)

Product Model Composition: FHW 0603 UC 1N6 K S T

  • Wire Wound Inductor Series
  • Dimensions: 0603
  • Material: UC Ceramic core
  • Inductance: e.g., 1N6=1.6nH, 010=10nH, R10=100nH
  • Tolerance: B (0.1nH), C (0.2nH), S (0.3nH), D (0.5nH), G (2%), H (3%), J (5%), K (10%)
  • Terminal: S (Tin)
  • Packaging: T (Tape Reel)

Electrical Characteristics:

Part NO. Accuracy Grade Inductance (nH) Ls Test Frequency (MHz) Q Min Q Test Frequency (MHz) Rdc Max () Test Voltage (mV) SRF Min (MHz) Idc Max (mA)
FHW0603UC1N6ST C,S,D,K 1.6 250 18 250 0.04 500 12500 700
FHW0603UC1N7ST B,C,S,D,K 1.7 250 18 250 0.045 500 12500 700
FHW0603UC1N8ST C,S,D,K 1.8 250 16 250 0.045 500 12500 700
FHW0603UC2N0ST C,S,D,K 2.0 250 12 250 0.09 500 10000 700
FHW0603UC2N2ST C,S,D,K 2.2 250 12 250 0.09 500 10000 700
FHW0603UC3N3ST S,D,K 3.3 250 20 250 0.075 500 5900 700
FHW0603UC3N6ST B,C,S,D,K 3.6 250 22 250 0.075 500 5900 700
FHW0603UC3N9ST B,C,S,D,K 3.9 250 22 250 0.08 500 6900 700
FHW0603UC4N3ST B,C,S,D,K 4.3 250 22 250 0.075 500 5900 700
FHW0603UC4N7ST B,C,S,D,K 4.7 250 20 250 0.116 500 5800 700
FHW0603UC5N1ST B,C,S,D,K 5.1 250 20 250 0.120 500 5700 700
FHW0603UC5N6ST K 5.6 250 18 250 0.20 500 5700 700
FHW0603UC6N0ST C,S,D,K 6.0 250 27 250 0.11 500 5700 700
FHW0603UC6N2ST C,S,D,K 6.2 250 27 250 0.11 500 5700 700
FHW0603UC6N8ST G,H,J,K 6.8 250 27 250 0.11 500 5800 700
FHW0603UC7N5ST G,H,J,K 7.5 250 28 250 0.11 500 4800 700
FHW0603UC8N2ST G,H,J,K 8.2 250 28 250 0.12 500 4700 700
FHW0603UC8N7ST G,H,J,K 8.7 250 28 250 0.12 500 4600 700
FHW0603UC9N1ST G,H,J,K 9.1 250 26 250 0.15 500 4500 700
FHW0603UC9N5ST G,H,J,K 9.5 250 26 250 0.15 500 5400 700
FHW0603UC010ST G,H,J,K 10 250 31 250 0.13 500 4800 700
FHW0603UC011ST G,H,J,K 11 250 33 250 0.13 500 4000 700
FHW0603UC012ST G,H,J,K 12 250 35 250 0.13 500 4000 700
FHW0603UC013ST G,H,J,K 13 250 30 250 0.14 500 4000 700
FHW0603UC014ST G,H,J,K 14 250 35 250 0.14 500 4000 700
FHW0603UC015ST G,H,J,K 15 250 30 250 0.15 500 4000 700
FHW0603UC016ST G,H,J,K 16 250 34 250 0.16 500 3300 700
FHW0603UC018ST G,H,J,K 18 250 35 250 0.17 500 3100 700
FHW0603UC020ST G,H,J,K 20 250 38 250 0.19 500 3000 700
FHW0603UC022ST G,H,J,K 22 250 38 250 0.19 500 3000 700
FHW0603UC024ST G,H,J,K 24 250 37 250 0.20 500 2650 700
FHW0603UC025ST G,H,J,K 25 250 38 250 0.21 500 2600 700
FHW0603UC027ST G,H,J,K 27 250 36 250 0.22 500 2800 600
FHW0603UC030ST G,H,J,K 30 250 37 250 0.22 500 2250 600
FHW0603UC033ST G,H,J,K 33 250 36 250 0.22 500 2300 600
FHW0603UC036ST G,H,J,K 36 250 36 250 0.25 500 2080 600
FHW0603UC039ST G,H,J,K 39 250 40 250 0.25 500 2200 600
FHW0603UC043ST G,H,J,K 43 250 36 250 0.28 500 2000 600
FHW0603UC047ST G,H,J,K 47 200 36 200 0.28 500 2000 600
FHW0603UC049ST G,H,J,K 49 200 36 200 0.28 500 2000 600
FHW0603UC051ST G,H,J,K 51 200 36 200 0 500 1900 600
FHW0603UC056ST G,H,J,K 56 200 38 200 0.28 500 1900 600
FHW0603UC068ST G,H,J,K 68 200 36 200 0.34 500 1700 600
FHW0603UC072ST G,H,J,K 72 150 34 150 0.53 500 1700 400
FHW0603UC075ST G,H,J,K 75 150 30 150 0.60 500 1400 400
FHW0603UC082ST G,H,J,K 82 150 34 150 0.55 500 1700 400
FHW0603UC091ST G,H,J,K 91 150 30 150 0.63 500 1400 400
FHW0603UCR10ST G,H,J,K 100 150 30 150 0.63 500 1400 400
FHW0603UCR11ST G,H,J,K 110 150 32 150 0.67 500 1350 300
FHW0603UCR12ST G,H,J,K 120 150 32 150 0.73 500 1300 300
FHW0603UCR15ST G,H,J,K 150 150 28 150 0.80 500 990 280
FHW0603UCR16ST G,H,J,K 160 100 25 100 1.25 500 990 250
FHW0603UCR18ST G,H,J,K 180 100 25 100 1.45 500 990 240
FHW0603UCR20ST G,H,J,K 200 100 25 100 1.55 500 900 200
FHW0603UCR22ST G,H,J,K 220 100 25 100 2.10 500 900 200
FHW0603UCR25ST G,H,J,K 250 100 25 100 3.55 500 822 120
FHW0603UCR27ST G,H,J,K 270 100 24 100 2.30 500 900 170
FHW0603UCR30ST G,H,J,K 300 100 24 100 3.00 500 1000 100
FHW0603UCR33ST G,H,J,K 330 100 25 100 3.89 500 900 100
FHW0603UCR39ST G,H,J,K 390 100 25 100 4.35 500 800 100
FHW0603UCR47ST G,H,J,K 470 100 25 100 7.00 500 700 75

Note: represents the nominal inductance accuracy level: B (0.1nH); C (0.2nH); S (0.3nH); D (0.5nH); G (2%); H (3%); J (5%); K (10%).

Reliability Testing Items:

No. Item Requirements Test Methods and Remarks
1 Test Standard Conditions a) Temperature: 15+35 ; b) Relative humidity: 25%75%; c) Pressure: 86 kPa106 kPa. For dispute resolution: a) Temperature: 201; b) Relative humidity: 63%67%; c) Pressure: 86 kPa106 kPa.
2 Operating Temperature Range FHW-UC series: -40+125
3 Solder ability No visible mechanical damage. Electrode surface solder coverage 90%. Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for 51s.
4 Resistance to Soldering No visible mechanical damage. Inductance change 5%. Q value change 10%. Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for 101s.
5 Vibration No visible mechanical damage. Inductance change 5%. Q value change 10%. Amplitude 1.5mm, frequency 10~55Hz, for 2 hours in each direction (X, Y, Z).
6 Adhesion of electrode No electrode detachment after test. No visible mechanical damage. Weld the product on PCB, apply force as per diagram/table. 0603UC Series: 13N, Keep time: (101)s, Speed: 1.0 mm/s.
7 Low temperature resistance No visible mechanical damage. Inductance change 5%. Q value change 10%. Subject to -402 for 1000 +240/-0 h.
8 High temperature resistance No visible mechanical damage. Inductance change 5%. Q value change 10%. Subject to +1255 for 1000 +240/-0 h.
9 Temperature Shock No visible mechanical damage. Inductance change 5%. Q value change 10%. +125 30 min -40 30 min, 100 Cycles.
10 High temperature load No visible mechanical damage. Inductance change 5%. Q value change 10%. Store at 1252 with rated current applied for 1000 +240/-0 h.
11 Static Humidity No visible mechanical damage. Inductance change 5%. Q value change 10%. Subject to 90%95% RH at 602 for 1000 +240/-0 h.
12 Bending strength No visible mechanical damage. Install on test substrate, apply force vertically. Bend down (20.2) mm at (10.5) mm/s, hold for (201) sec.
13 Solvent Resistance No visible mechanical damage. Inductance change 5%. Q value change 10%. Soak in isopropyl alcohol at 235 for 50.5 min.

Note: For tests involving electrical characteristics, perform within 48h after placing at room temperature for at least 2h.

Product Packaging:

Size Pieces Per Reel Pieces Per Box Pieces Per Case
0603 4000 12000 (3 Reels) 60000 (1.5 Cases) / 80000 (2 Cases) / 120000 (3 Cases) / 160000 (4 Cases) / 240000 (6 Cases)

Recommended Soldering Conditions:

  • Method: Reflow soldering.
  • Flux: Rosin-based flux. Avoid highly acidic flux with halide content > 0.2(wt)%.
  • Solder: Lead-free solder (96.5Sn /3.0Ag/0.5Cu).
  • Temperature Difference: Max 150 between solder and ferrite surface during pre-heating. Max 100 between product surface and solvent temperature during cooling.
  • Hand Soldering: Iron temperature: 350 (Max). Power: 30W (Max). Duration: < 5S. Avoid touching coil and encapsulation layer.

Cleaning Conditions:

  • Cleaning temperature: 60 (Max)
  • Cleaning time: 5 minutes (Max)
  • Ultrasonic power: 200W (Max)

Storage Requirements:

  • Storage Period: Within 1 year from the factory inspection date. If over 1 year, check solderability before use.
  • Storage Conditions: Temperature: -10 to +40, Relative humidity: 30% to 70%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Store in sealed packaging on a shelf.

Usage Of ODS (Ozone Depleting Substances): Not used in production processes (e.g., CCl4, HCFC).

Notes:

  • Products are RoHS compliant.
  • Ensure your product is evaluated and confirmed when our product is mounted.
  • No warranty for failures caused by uses deviating from this specification.
  • Do not touch wire with sharp objects to prevent breakage.

2410121258_FH-FHW0603UC2N2KST_C317980.pdf

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