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Specifications
Current - Saturation (Isat):
-
Mfr. Part #:
CMP201209UD1R5MT
Package:
0805
Key Attributes
Model Number:
CMP201209UD1R5MT
Product Description
Product Overview
The CMP201209 Series is a Multilayer Chip Ferrite Power Inductor designed for various electronic applications. These inductors offer reliable performance with specific electrical characteristics, dimensions, and material compositions. They are manufactured with a ferrite body (Ni-Cu-Zn system) and internal electrodes made of pure silver, with terminal electrodes featuring silver and Ni/Sn plating. The series is available in tape and reel packaging, suitable for automated assembly processes.
Product Attributes
- Product Type: Multilayer Chip Ferrite Power Inductor
- Series: CMP201209 Series
- Manufacturer: (Not specified in detail, but implied to be the issuer of the document)
- Material (Body): Ferrite (Nickel-Copper-Zinc system)
- Material (Inner Electrode): Pure Silver (Ag)
- Material (Terminal Electrode): Silver layer (Ag layer) with Ni/Sn plating
- Packaging: Tape & Reel
- Certifications: RoHS compliant (if marked 'Unitary lead free')
Technical Specifications
| Part NO. | Tolerance (%) | Inductance (H) | RDC () max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA) max | Dimensions (LWT) mm |
|---|---|---|---|---|---|---|---|---|
| CMP201209VD47NMT | 20 | 0.047 | 0.10 | 1 | 50 | 280 | 1100 | 2.01.20.9 |
| CMP201209VD56NMT | 20 | 0.056 | 0.10 | 1 | 50 | 280 | 1100 | 2.01.20.9 |
| CMP201209VD68NMT | 20 | 0.068 | 0.15 | 1 | 50 | 250 | 1100 | 2.01.20.9 |
| CMP201209VD82NMT | 20 | 0.082 | 0.15 | 1 | 50 | 250 | 1100 | 2.01.20.9 |
| CMP201209VDR10MT | 20 | 0.10 | 0.15 | 1 | 50 | 210 | 1100 | 2.01.20.9 |
| CMP201209VDR12MT | 20 | 0.12 | 0.15 | 1 | 50 | 200 | 1100 | 2.01.20.9 |
| CMP201209VDR15MT | 20 | 0.15 | 0.15 | 1 | 50 | 175 | 1100 | 2.01.20.9 |
| CMP201209VDR18MT | 20 | 0.18 | 0.15 | 1 | 50 | 160 | 1100 | 2.01.20.9 |
| CMP201209VDR22MT | 20 | 0.22 | 0.15 | 1 | 50 | 150 | 1100 | 2.01.20.9 |
| CMP201209VDR27MT | 20 | 0.27 | 0.15 | 1 | 50 | 130 | 1100 | 2.01.20.9 |
| CMP201209VDR33MT | 20 | 0.33 | 0.15 | 1 | 50 | 120 | 1100 | 2.01.20.9 |
| CMP201209VDR39MT | 20 | 0.39 | 0.15 | 1 | 50 | 110 | 1100 | 2.01.20.9 |
| CMP201209VDR47MT | 20 | 0.47 | 0.15 | 1 | 50 | 100 | 1100 | 2.01.20.9 |
| CMP201209VDR56MT | 20 | 0.56 | 0.36 | 1 | 50 | 100 | 800 | 2.01.20.9 |
| CMP201209VDR68MT | 20 | 0.68 | 0.36 | 1 | 50 | 95 | 800 | 2.01.20.9 |
| CMP201209VDR82MT | 20 | 0.82 | 0.36 | 1 | 50 | 90 | 800 | 2.01.20.9 |
| CMP201209UD1R0MT | 20 | 1.0 | 0.24 | 1 | 50 | 75 | 800 | 2.01.20.9 |
| CMP201209UD1R2MT | 20 | 1.2 | 0.24 | 1 | 50 | 65 | 800 | 2.01.20.9 |
| CMP201209UD1R5MT | 20 | 1.5 | 0.30 | 1 | 50 | 60 | 700 | 2.01.20.9 |
| CMP201209UD1R8MT | 20 | 1.8 | 0.36 | 1 | 50 | 55 | 600 | 2.01.20.9 |
| CMP201209UD2R2MT | 20 | 2.2 | 0.36 | 1 | 50 | 50 | 600 | 2.01.20.9 |
| CMP201209UD2R7MT | 20 | 2.7 | 0.36 | 1 | 50 | 45 | 600 | 2.01.20.9 |
| CMP201209UD3R3MT | 20 | 3.3 | 0.40 | 1 | 50 | 41 | 350 | 2.01.20.9 |
| CMP201209UD3R9MT | 20 | 3.9 | 0.40 | 1 | 50 | 38 | 350 | 2.01.20.9 |
| CMP201209UD4R7MT | 20 | 4.7 | 0.40 | 1 | 50 | 35 | 350 | 2.01.20.9 |
| CMP201209XD5R6MT | 20 | 5.6 | 0.50 | 1 | 50 | 32 | 250 | 2.01.20.9 |
| CMP201209XD6R8MT | 20 | 6.8 | 0.50 | 1 | 50 | 29 | 250 | 2.01.20.9 |
| CMP201209XD8R2MT | 20 | 8.2 | 0.56 | 1 | 50 | 26 | 250 | 2.01.20.9 |
| CMP201209XD100MT | 20 | 10 | 0.56 | 1 | 50 | 24 | 250 | 2.01.20.9 |
| CMP201209XD120MT | 20 | 12 | 0.56 | 1 | 50 | 22 | 250 | 2.01.20.9 |
| CMP201209JD150MT | 20 | 15 | 0.65 | 1 | 50 | 19 | 100 | 2.01.20.9 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance: VD, UD: change within 20%; JD: change within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about:3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 2012 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature: -402; Testing time: 1000 +240/-0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time: 20s1s |
| 7 | Vibration | No mechanical damage. Inductance change: within 10% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Inductance change: within 10% | Testing time: 1000 +240/-0 h; Temperature: 852 |
| 9 | Static Humidity | No mechanical damage. Inductance change: within 10% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +240/-0 h |
| 10 | High temperature load | No mechanical damage. Inductance change: within 10% | Impose current: at room rated current; Testing time: 1000 +240/-0 h; Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Inductance change: within 10% | Temperature: -40 for 303min +85 for 303min; Number of cycles: 32 |
Note: When there are questions concerning measurements, they shall be made after 242hrs of recovery under standard conditions.
Product Packaging
| Size | REEL Quantity | BOX Quantity | CASE Quantity |
|---|---|---|---|
| 201209 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
Products are suitable for reflow soldering.
- Soldering Conditions: Pre-heating should be such that the temperature difference between solder and ferrite surface is limited to 150 max. Cooling into solvent after soldering should be limited to 100 max. Insufficient pre-heating may cause cracks on the ferrite surface, leading to product quality deterioration. Products should be soldered within the indicated allowable range. Excessive soldering conditions may cause electrode corrosion.
- Iron Soldering: Tip temperature: 350 max; Power: 30W max; Duration: < 5S. Take care not to apply the tip of the soldering iron to the terminal electrodes.
Cleaning
- Cleaning Conditions: Cleaning temperature: 60 max; Cleaning time: 1 minute min; Ultrasonic output power: 200W max.
Storage Requirements
- Storage Period: Products inspected over 1 year ago by the inductor company should be examined and used. Solder ability should be checked if this period is exceeded.
- Storage Conditions: Warehouse temperature: -10 to +40; Relative humidity: 30% to 70%. Do not store products in corrosive gases (sulfur, chlorine gas, acid). Store products on a pallet to prevent influence from humidity and dust. Avoid heat shock, vibration, and direct sunlight. Products should be stored in airtight packaging.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 (Carbon Tetrachloride) and HCFC in its production process.
Notes
- If the parcel label on the product is "Unitary lead free", it indicates the products are in accordance with RoHS appointed requests.
- This product specification guarantees the quality of our product as a single unit. Please ensure your product has been evaluated and confirmed against your specifications when our product is mounted to your product.
- The company cannot warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification.
2410121310_FH-CMP201209UD1R5MT_C395013.pdf
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