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Specifications
Mfr. Part #:
CMP201209XE100MT
Package:
0805
Key Attributes
Model Number:
CMP201209XE100MT
Product Description
Product Overview
The CMP201209-E Series is a range of Multilayer Chip Ferrite Power Inductors designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with silver and Ni/Sn plating. They offer a range of inductance values from 0.047 H to 22 H, with tight tolerances and specific electrical characteristics suitable for power applications.
Product Attributes
- Product Type: Multilayer Chip Ferrite Power Inductor
- Series: CMP201209-E Series
- Construction: Ferrite or ceramic body, pure silver inner electrodes, silver and Ni/Sn plated terminal electrodes.
- Plating: Ni/Sn
- Packaging: Tape & Reel (T)
- Certifications: RoHS compliant (if designated "Unitary lead free")
Technical Specifications
Dimensions
| Size | L (mm/inch) | W (mm/inch) | T (mm/inch) | Terminal Electrode Width (mm/inch) |
|---|---|---|---|---|
| 201209 | 2.00.20 (0.0790.008) | 1.20.20 (0.0470.008) | 0.90.20 (0.0350.008) | 0.50.3 (0.0200.012) |
Electrical Characteristics
| Part NO. | Tolerance (%) | Inductance (H) | RDC ()max | Test frequency (MHz) | Test voltage (mV) | SRF (MHz) min | Rated current (mA)max |
|---|---|---|---|---|---|---|---|
| CMP201209VE47NMT | 20 | 0.047 | 0.15 | 1 | 50 | 320 | 350 |
| CMP201209VE56NMT | 20 | 0.056 | 0.15 | 1 | 50 | 320 | 350 |
| CMP201209VE68NMT | 20 | 0.068 | 0.20 | 1 | 50 | 280 | 350 |
| CMP201209VE82NMT | 20 | 0.082 | 0.20 | 1 | 50 | 280 | 350 |
| CMP201209VER10MT | 20 | 0.10 | 0.20 | 1 | 50 | 235 | 350 |
| CMP201209VER12MT | 20 | 0.12 | 0.20 | 1 | 50 | 220 | 350 |
| CMP201209VER15MT | 20 | 0.15 | 0.20 | 1 | 50 | 200 | 350 |
| CMP201209VER18MT | 20 | 0.18 | 0.25 | 1 | 50 | 185 | 300 |
| CMP201209VER22MT | 20 | 0.22 | 0.25 | 1 | 50 | 170 | 300 |
| CMP201209VER27MT | 20 | 0.27 | 0.25 | 1 | 50 | 150 | 300 |
| CMP201209VER33MT | 20 | 0.33 | 0.25 | 1 | 50 | 145 | 300 |
| CMP201209VER39MT | 20 | 0.39 | 0.30 | 1 | 50 | 135 | 250 |
| CMP201209VER47MT | 20 | 0.47 | 0.30 | 1 | 50 | 125 | 250 |
| CMP201209VER56MT | 20 | 0.56 | 0.36 | 1 | 50 | 115 | 200 |
| CMP201209VER68MT | 20 | 0.68 | 0.36 | 1 | 50 | 105 | 200 |
| CMP201209VER82MT | 20 | 0.82 | 0.36 | 1 | 50 | 100 | 200 |
| CMP201209UE1R0MT | 20 | 1.0 | 0.26 | 1 | 50 | 75 | 220 |
| CMP201209UE1R2MT | 20 | 1.2 | 0.26 | 1 | 50 | 65 | 220 |
| CMP201209UE1R5MT | 20 | 1.5 | 0.30 | 1 | 50 | 60 | 180 |
| CMP201209UE1R8MT | 20 | 1.8 | 0.30 | 1 | 50 | 55 | 180 |
| CMP201209UE2R2MT | 20 | 2.2 | 0.36 | 1 | 50 | 50 | 150 |
| CMP201209UE2R7MT | 20 | 2.7 | 0.36 | 1 | 50 | 45 | 150 |
| CMP201209UE3R3MT | 20 | 3.3 | 0.40 | 1 | 50 | 41 | 120 |
| CMP201209UE3R9MT | 20 | 3.9 | 0.40 | 1 | 50 | 38 | 120 |
| CMP201209UE4R7MT | 20 | 4.7 | 0.40 | 1 | 50 | 35 | 120 |
| CMP201209XE5R6MT | 20 | 5.6 | 0.60 | 1 | 50 | 32 | 100 |
| CMP201209XE6R8MT | 20 | 6.8 | 0.60 | 1 | 50 | 29 | 100 |
| CMP201209XE8R2MT | 20 | 8.2 | 0.65 | 1 | 50 | 26 | 100 |
| CMP201209XE100MT | 20 | 10 | 0.65 | 1 | 50 | 24 | 100 |
| CMP201209XE120MT | 20 | 12 | 0.65 | 1 | 50 | 22 | 100 |
| CMP201209JE150MT | 20 | 15 | 0.75 | 1 | 50 | 19 | 50 |
| CMP201209JE180MT | 20 | 18 | 0.75 | 1 | 50 | 18 | 50 |
| CMP201209JE220MT | 20 | 22 | 0.75 | 1 | 50 | 16 | 50 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration : 51s; Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance: VE, UE: 20%; XE: 25%; JE: 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration : 101s; Dip performance to a flux of about:3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 2012 series; Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature: -402; Testing time: 1000+24/-0 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; Compression speed: 0.5mm/s; Curvature: 2mm; Hold time: 20s1s |
| 7 | Vibration | No mechanical damage. Inductance change: within 10% | Amplitude: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions; Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature resistance | No mechanical damage. Inductance change: within 10% | Temperature: 852; Testing time: 1000+24/-0 h |
| 9 | Static Humidity | No mechanical damage. Inductance change: within 10% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000+24/-0 h |
| 10 | High temperature load | No mechanical damage. Inductance change: within 10% | Impose current: rated current; Temperature: 852; Testing time: 1000+24/-0 h |
| 11 | Temperature Shock | No mechanical damage. Inductance change: within 10% | Temperature: -40 for 303min +85 for 303min; Number of cycles: 32 |
Note: Measurements shall be made after 242hrs of recovery under standard conditions.
Packaging
Packaging Quantity (Unit: Pcs)
| Size | Quantity per REEL | Quantity per BOX | Quantity per CASE |
|---|---|---|---|
| 201209 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
Soldering Conditions: Products can be applied to reflow soldering.
- Reflow Soldering Profile: Products should be soldered within the allowable range indicated by the slanted line. Excessive conditions may cause electrode corrosion.
- Iron Soldering: Temperature: 350 max; Power: 30W max; Duration: < 5S. Avoid touching terminal electrodes with the soldering iron tip.
Cleaning
Cleaning Conditions:
- Cleaning temperature: 60 max
- Cleaning time: 1 minute min.
- Ultrasonic output power: 200W max
Storage Requirements
Storage Period: Within 1 year from the manufacturing inspection date. If exceeded, check solderability before use.
Storage Conditions:
- Warehouse temperature: -10 ~ +40; Relative humidity: 30% ~ 70%.
- Do not store in corrosive substances (sulfur, chlorine gas, acid) to prevent electrode oxidation.
- Store on a pallet to prevent influence from humidity and dust.
- Avoid heat shock, vibration, and direct sunlight.
- Products should be stored under airtight packaged condition.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 and HCFC in its production process.
Notes
- If the product is designated "Unitary lead free", it complies with RoHS directive requirements.
- This product specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed when this product is mounted.
- The company does not warrant against failure caused by any use of the product that deviates from the intended use described in this specification.
2410121310_FH-CMP201209XE100MT_C5344316.pdf
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