Product Overview
This document details Chip Beads, Inductors, and Chip High Frequency Inductors from the CBG, CBW, CBM, CBY, CBH, CMI, CMP, and VHF series. These components are designed for various electronic applications, offering specific electrical characteristics like impedance, inductance, DC resistance, Q value, and self-resonant frequency. The product line includes different types such as normal beads, power beads, ultra-high current beads, peak beads, high R beads, ferrite inductors, and high-frequency inductors, available in multiple sizes and with various material codes. They are manufactured with precision and undergo rigorous reliability testing to ensure performance and durability in operating temperatures ranging from -40 to +85.
Product Attributes
- Brand: Not explicitly stated, but implied as the manufacturer.
- Origin: Not explicitly stated.
- Materials: Ferrite (Ni-Cu-Zn system), Ceramic (Al2O3 system), Silver (Ag), Nickel/Tin (Ni/Sn plating).
- Certifications: RoHS compliant (indicated by "Unitary lead free" label).
Technical Specifications
Dimensions & Inner Configuration
| Size | L (mm/inch) | W (mm/inch) | T (mm/inch) | a (mm/inch) |
|---|---|---|---|---|
| 100505 | 1.00.15 (0.0400.006) | 0.50.15 (0.0200.006) | 0.50.15 (0.0200.006) | 0.250.1 (0.0100.004) |
| 160808 | 1.60.20 (0.0630.008) | 0.80.20 (0.0310.008) | 0.80.20 (0.0310.008) | 0.30.2 (0.010.008) |
| 201209 | 2.00.20 (0.0790.008) | 1.20.20 (0.0470.008) | 0.90.20 (0.0350.008) | 0.50.3 (0.0200.012) |
| 201212 | 2.00.20 (0.0790.008) | 1.20.20 (0.0470.008) | 1.20.20 (0.0470.008) | 0.50.3 (0.0200.012) |
| 252009 | 2.50.20 (0.0980.008) | 2.00.20 (0.0790.008) | 0.90.20 (0.0350.008) | 0.50.3 (0.0200.012) |
| 321609 | 3.20.20 (0.1260.008) | 1.60.20 (0.0630.008) | 0.90.20 (0.0350.008) | 0.50.3 (0.0200.012) |
| 321611 | 3.20.20 (0.1260.008) | 1.60.20 (0.0630.008) | 1.10.20 (0.0430.008) | 0.50.3 (0.0200.012) |
| 322513 | 3.20.20 (0.1260.008) | 2.50.20 (0.0980.008) | 1.30.20 (0.0510.008) | 0.50.3 (0.0200.012) |
| 451616 | 4.50.20 (0.1800.008) | 1.60.20 (0.0630.008) | 1.60.20 (0.0630.008) | 0.50.3 (0.0200.012) |
| 453215 | 4.50.20 (0.1800.008) | 3.20.20 (0.1260.008) | 1.50.20 (0.0600.008) | 0.50.3 (0.0200.012) |
Product Spec. Model Composition
| Component | Description |
|---|---|
| Product Symbol | CBG: Normal Beads, CBW: Power Beads, CBM: Ultra-high Current Beads, CBY: Peak Beads, CBH: High R Beads, CMI: Ferrite Inductors, VHF: High Frequency Inductor, CMP: Power Inductors |
| Dimensions | (LWT) e.g., (1.60.80.8mm) |
| Material Code | U, W, A, X, J, V, H |
| Impedance/Inductance | e.g., 120 (CBG), 1.0H (CMI) |
| Tolerance | M (25%), K (10%), J (5%), S (0.3nH), D (0.5nH) |
| Packaging | B: Bulk, T: Tape & Reel |
Electrical Characteristics List (Partial Example)
| Part NO. | Tolerance (%) | Inductance (H/nH) | Q Value (min) | DC Resistance ()max | Test Frequency (MHz) | Test Voltage (mV) | SRF (MHz) min | Rated Current (mA)max |
|---|---|---|---|---|---|---|---|---|
| CMI100505V47NKT | 10 | 0.047 | 10 | 0.45 | 50 | 50 | 220 | 25 |
| CMI160808U1R0KT | 10 | 1.0 | 25 | 0.50 | 10 | 50 | 40 | 25 |
| VHF100505H1N0ST | 0.3 | 1.0 nH | 7 | 0.10 | 100 | 50 | 10000 | 400 |
| CBG160808U101T | 25% | 100 | N/A | 0.20 | 100 | 50 | N/A | 300 |
| CBW201209U101T | 25% | 100 | N/A | 0.10 | 100 | 50 | N/A | 2500 |
| CBM201209U101T | 25% | 100 | N/A | 0.05 | 100 | 50 | N/A | 3000 |
| CBY201209A121T | 25% | 120 | N/A | 0.25 | 100 | 50 | N/A | 600 |
| CBH201209W121T | 25% | 120 | N/A | 0.15 | 100 | 50 | N/A | 400 |
Reliability Testing Items
| No. | Item | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -40+85 | |
| 2 | Solder ability | At least 90% of terminal electrode should be covered with solder. | Preheating temperature: 120-150, time: 60s; Solder temperature: 2455, duration: 51s. |
| 3 | Resistance to Soldering Heat | At least 75% of terminal electrode should be covered with solder. No mechanical damage. | Inductance change within 10% to 30% (material dependent); Q value change within 20% to 30%; Impedance change within 30%. Solder temperature: 2605, duration: 101s. |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N (1005, 1608 series), 10N (larger series); Keep time: 101S. |
| 5 | Low temperature resistance | No mechanical damage. Inductance change within 10%. | Temperature: -552, Testing time: 500h. |
| 6 | Bending strength | No mechanical damage. Inductance change within 10%. | Warp: 2mm on 0.8mm substrate. |
| 7 | Drop | No mechanical damage. Inductance change within 10%. | Drop 10 times from 1m height onto concrete floor. |
| 8 | Vibration | No mechanical damage. Inductance change within 10%. | Amplitude: 1.5mm, 2h in 3 directions (10Hz-55Hz-10Hz). |
| 9 | High temperature resistance | No mechanical damage. Inductance change within 10%. | Applied rated current (for high current beads). Temperature: 852, Testing time: 1000h. |
| 10 | Static Humidity | No mechanical damage. Inductance change within 10%. | Humidity: 90-95% RH, Temperature: 552, Testing time: 500h. |
| 11 | Thermal Shock | No mechanical damage. Inductance change within 10%. | -40 (303min) to +85 (303min), 32 cycles. |
Packaging
| SIZE | REEL (Pcs) | BOX (Pcs) | CASE (Pcs) |
|---|---|---|---|
| 453215 | 3000 | 12000 | 36000 |
| 451616 | 5000 | 20000 | No |
| 322513 | 3000 | 30000 | 180000 |
| 321611 | 3000 | 30000 | 180000 |
| 321609 | 4000 | 40000 | 240000 |
| 252009 | 3000 | 30000 | 180000 |
| 201212 | 3000 | 30000 | 180000 |
| 201209 | 4000 | 40000 | 240000 |
| 160808 | 4000 | 40000 | 240000 |
| 100505 | 10000 | 100000 | 600000 |
Recommended Soldering Conditions
Soldering Requirements: Temperature difference between product surface and solder during pre-heating should not exceed 150. Temperature difference between product surface and solvent after soldering should not exceed 100. Insufficient pre-heating may cause cracks.
Reflow Soldering Profile: Products should be soldered within the allowable range indicated by the slanted line. Excessive conditions may cause electrode corrosion.
Flow Soldering Profile: (Details not provided in text)
Iron Soldering: Iron temperature: max 30W, max 350. Duration: < 5S. Avoid touching terminal electrodes.
Cleaning Conditions
- Cleaning temperature: 60 max
- Cleaning time: 1 minute min.
- Ultrasonic output power: 200W max
Storage Requirements
- Storage Period: Within 6 months from the manufacturer's inspection date. If exceeding 6 months, check solderability before use.
- Storage Conditions: Temperature: -10 to +40, Humidity: 30-70% RH. Avoid corrosive gases, humidity, dust, heat shock, vibration, and direct sunlight. Store in airtight packaging.
Usage Of ODS (Ozone Depleting Substances)
The company does not use ODS such as CCl4 and HCFC in its production processes.
Notes
- "Unitary lead free" indicates compliance with RoHS directives.
- This specification guarantees the product as a single unit; ensure your product is validated when integrating our components.
- Failures caused by uses deviating from intended use as described are not warranted.
2411220117_FH-CMI321611J101KT_C128802.pdf
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